Camera device and optical instrument

Patent metadata

Field	Value
Publication number	US-12574617-B2
Application number	US-202218294099-A
Country	US
Kind code	B2
Filing date	Jul 27, 2022
Priority date	Aug 5, 2021
Publication date	Mar 10, 2026
Grant date	Mar 10, 2026

Abstract

A camera device of the disclosure includes a moving unit, including a first heat dissipation member, a first board disposed on the first heat dissipation member and including a hole to expose a portion of the first heat dissipation member, and an image sensor disposed in the hole, a fixed unit, including a second board disposed so as to be spaced apart from the first heat dissipation member and a second heat dissipation member disposed on the second board, and a support member, configured to support the moving unit to move relative to the fixed unit in a direction perpendicular to an optical-axis direction. The image sensor is coupled to the first heat dissipation member, and the second heat dissipation member is disposed so as to be spaced apart from the first heat dissipation member and to overlap the first heat dissipation member in the optical-axis direction.

First claim

The invention claimed is:

1 . A camera device comprising:
a moving unit comprising a first metal plate, a first board disposed on the first metal plate and including a hole to expose a portion of the first metal plate, and an image sensor disposed on the portion of the first metal plate; a fixed unit comprising a magnet and a second metal plate spaced apart from the first metal plate so as to overlap the first metal plate in an optical-axis direction; a coil disposed on the moving unit so as to face the magnet and configured to move the moving unit in a direction perpendicular to the optical-axis direction by an interaction with the magnet; and a support member configured to support the moving unit to move relative to the fixed unit in the direction perpendicular to an optical-axis direction, wherein the moving unit comprises a spacing member disposed on the first board, wherein the coil is disposed on the spacing member so as to be spaced apart from the first board, and wherein the image sensor is disposed in the hole of the first board.

2 . The camera device according to claim 1 , wherein the fixed unit comprises a second board disposed under the second metal plate and the support member conductively connects the first board and the second board.

3 . The camera device according to claim 2 , wherein a value obtained by dividing a spacing distance between the first metal plate and the second metal plate the optical-axis direction by a thickness of the second board is ⅔ to 2.

4 . The camera device according to claim 2 , wherein the second metal plate is disposed on a first surface of the second board, the first surface being a surface facing the first metal plate, and
wherein the second board comprises a first conductive layer exposed to the first surface of the second board, the first conductive layer being in contact with the second metal plate.

5 . The camera device according to claim 2 , wherein the support member comprises a support substrate,
wherein the support substrate comprises: a body disposed to correspond to side portions of the first board; a connection portion connecting the body and the first board; and a terminal unit extending toward the second substrate from the body and coupled to the second substrate; and wherein the support substrate is configured to conductively connect the first board and the second board.

6 . The camera device according to claim 1 , wherein the first metal plate comprises a protruding portion disposed in the hole in the first board, and
wherein the image sensor is disposed on the protruding portion of the first metal plate.

7 . The camera device according to claim 1 , wherein a spacing distance in the optical-axis direction between the first metal plate and the second metal plate is 0.15 mm to 0.5 mm.

8 . The camera device according to claim 1 , wherein a value obtained by dividing a spacing distance between the first metal plate and the second metal plate in the optical-axis direction by a thickness of the first metal plate is 1.4 to 3.75.

9 . The camera device according to claim 1 , wherein a value obtained by dividing a spacing distance between the first metal plate and the second metal plate in the optical-axis direction by a thickness of the first board is 0.8 to 2.

10 . The camera device according to claim 1 , wherein a value obtained by dividing a spacing distance between the first metal plate and the second metal plate in the optical-axis direction by a thickness of the second metal plate is 1.4 to 3.75.

11 . The camera device according to claim 1 , wherein at least one of the first metal plate and the second metal plate comprises a groove.

12 . The camera device according to claim 11 , wherein the groove is formed in a predetermined pattern, and
wherein the predetermined pattern is a stripe-shaped pattern, a net-shaped pattern, a mesh-shaped pattern, or a multiple dot-shaped pattern.

13 . The camera device according to claim 1 , wherein the first metal plate and the second metal plate have a same thickness.

14 . The camera device according to claim 1 , wherein the second metal plate overlaps the first metal plate in an area that is 80% to 100% of an area of the first metal plate.

15 . The camera device according to claim 1 , wherein the first metal plate has an area that is 55% to 80% of an area of the second metal plate.

16 . The camera device according to claim 1 , wherein the second board comprises a second conductive layer connected to the first conductive layer and exposed from a second surface of the second board, the second surface being a surface formed opposite the first surface, and the second conductive layer is conductively connected to a ground of the second board.

17 . The camera device according to claim 1 , wherein the coil comprises a first coil unit, a second coil unit, a third coil unit, and a fourth coil unit that are spaced apart from one another, and
wherein the magnet comprises a first magnet unit facing the first coil unit in the optical-axis direction, a second magnet unit facing the second coil unit in the optical-axis direction, a third magnet unit facing the third coil unit in the optical-axis direction, and a fourth magnet unit facing the fourth coil unit in the optical-axis direction.

18 . The camera device according to claim 17 , wherein the moving unit comprises a first sensor overlapping the first magnet unit in the optical-axis direction and a second sensor overlapping the second magnet unit in the optical-axis direction, and
wherein each of the first to fourth coil units has a ring shape including a hole, and wherein the first sensor is disposed under the hole of the first coil unit, and the second sensor is disposed under the hole of the second coil unit.

19 . An optical instrument comprising the camera device according to claim 1 and a power supply.

20 . A camera device comprising:
a moving unit comprising a first metal plate, a first board disposed on the first metal plate, an image sensor disposed on the first metal plate, a coil disposed on the first board, and a spacing member disposed between the coil and the first board; a fixed unit comprising a magnet facing the coil in an optical-axis direction and a second metal plate spaced apart from the first metal plate so as to overlap the first metal plate in an optical-axis direction; a position sensor disposed on first board; and a support substrate configured to support the moving unit to move relative to the fixed unit in a direction perpendicular to the optical-axis direction, and wherein the first board comprises a hole to expose a portion of the first metal plate and the image sensor is disposed on the portion of the first metal plate so as to be disposed in the hole of the first board, and wherein the coil has a ring shape including a hole, and the position sensor is disposed under the hole of the coil.

Assignees

• Lg Innotek Co Ltd

Inventors

• Park Sang Ok

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G03B17/55

  with provision for heating or cooling, e.g. in aircraft · CPC title

• H04N23/687

  by shifting the lens or sensor position · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title