Semi-conductive compound composition and method for preparing same

Patent metadata

Field	Value
Publication number	US-12570843-B2
Application number	US-202318862177-A
Country	US
Kind code	B2
Filing date	May 2, 2023
Priority date	May 3, 2022
Publication date	Mar 10, 2026
Grant date	Mar 10, 2026

Abstract

The present invention relates to a semiconducting compound composition and a method of preparing the same. More particularly, the present invention relates to a semiconducting compound composition containing: a base resin obtained by mixing two types of ethylene butyl acrylate resins having different melt indices; and carbon black, wherein a volume of the carbon black in the semiconducting compound composition is 60 vol % or more of the total composition volume, and a method of preparing the same.

First claim

The invention claimed is:

1 . A semiconducting compound composition comprising:
a base resin obtained by mixing two types of ethylene butyl acrylate resins having different melt indices, the two types of ethylene butyl acrylate resins being a first ethylene butyl acrylate resin and a second ethylene butyl acrylate resin; and carbon black, wherein in the base resin, the first ethylene butyl acrylate resin is an ethylene butyl acrylate resin having a content of a structural unit derived from a butyl acrylate monomer of 15 to 18 mol % and having MI 1 of 5 to 10 g/10 min, the second ethylene butyl acrylate resin is an ethylene butyl acrylate resin having a content of a structural unit derived from a butyl acrylate monomer of 19 to 22 mol % and having MI 2 of 17 to 22 g/10 min, and wherein a content of the carbon black satisfies the following Expression 1:

(

M
1

/

d
1

)

(

M
1

/

d
1

+

M
2

/

d
2

)

×
100

≥

60
⁢
%

[

Expression
⁢

1

]

wherein M 1 is a weight of the carbon black, M 2 is a weight of the base resin, d 1 is a specific gravity of the carbon black, and d 2 is a specific gravity of the base resin.

2 . The semiconducting compound composition of claim 1 , wherein the melt indices satisfy the following Expressions 2 and 3:

1
≤

M
⁢

I
1

≤
10

[

Expression
⁢

2

]

11
≤

M
⁢

I
2

≤

3
⁢
0

[

Expression
⁢

3

]

wherein MI 1 is a melt index of the first ethylene butyl acrylate resin, MI 2 is a melt index of the second ethylene butyl acrylate resin, the melt index is measured under conditions of 125° C. and 2.16 kg according to the ASTM D1238 measurement method, and a unit of the melt index is g/10 min.

3 . The semiconducting compound composition of claim 2 , wherein MI 1 of the first ethylene butyl acrylate resin is 5 to 10 g/10 min, and MI 2 of the second ethylene butyl acrylate resin is 15 to 25 g/10 min.

4 . The semiconducting compound composition of claim 2 , wherein MI 1 and MI 2 of the base resin satisfy the following Expression 4:

1
⁢
0

≤

M
⁢

I
2

-

M
⁢

I
1

≤

2
⁢
0

[

Expression
⁢

4

]

wherein MI 1 is the melt index (g/10 min) of the first ethylene butyl acrylate resin measured under conditions of 125° C. and 2.16 kg according to the ASTM D1238 measurement method, and MI 2 is the melt index (g/10 min) of the second ethylene butyl acrylate resin measured by the same measurement method as described above.

5 . The semiconducting compound composition of claim 1 , wherein the carbon black is contained in an amount of 30 to 100 parts by weight with respect to 100 parts by weight of the base resin.

6 . The semiconducting compound composition of claim 1 , further comprising an antioxidant and a crosslinking agent.

7 . The semiconducting compound composition of claim 6 , wherein the carbon black, the antioxidant, and the crosslinking agent are contained in amounts of 30 to 100 parts by weight, 0.01 to 5 parts by weight, and 0.1 to 10 parts by weight, respectively, with respect to 100 parts by weigh

Assignees

• Hanwha Solutions Corp

Inventors

• Lee In Jun
• Lim Jae Yun
• Park Jeong Hyun

Classifications

• H01B1/24

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• H01B1/18

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• C08L2312/00

  Crosslinking · CPC title

• C08L2310/00

  Masterbatches · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title