Cutting tool

Patent metadata

Field	Value
Publication number	US-12569917-B2
Application number	US-202218279625-A
Country	US
Kind code	B2
Filing date	Mar 4, 2022
Priority date	Apr 30, 2021
Publication date	Mar 10, 2026
Grant date	Mar 10, 2026

Abstract

A cutting tool comprising a base material and a coating disposed on the base material, wherein the coating comprises a hard particle layer; the hard particle layer is formed from a plurality of hard particles including titanium, silicon, carbon, and nitrogen; in the hard particles, a concentration of the silicon periodically changes along a first direction set in the hard particles; and an orientation of the hard particle layer is a (311) orientation.

First claim

The invention claimed is:

1 . A cutting tool comprising a base material and a coating disposed on the base material, wherein
the coating comprises a hard particle layer, the hard particle layer is formed from a plurality of hard particles including titanium, silicon, carbon, and nitrogen, in the hard particles, a concentration of the silicon periodically changes along a first direction set in the hard particles, an orientation of the hard particle layer is a (311) orientation, and the orientation of the hard particle layer that is the (311) orientation means that an orientation index TC(311) of a (311) plane in the hard particle layer among an orientation index TC(hkl) defined by an expression (1)

T
⁢

C
⁡
(

hk
⁢
1

)

=

I
⁡
(

hk
⁢
1

)

I
0

(

hk
⁢
1

)

⁢

{

1
8

∑

x
,
y
,
z

I
⁡
(

h
x

⁢

k
y

⁢

1
z

)

I
0

(

h
x

⁢

k
y

⁢

1
z

)

}

-
1

(
1
)

is larger than respective orientation indices of a (111) plane, a (200) plane, a (220) plane, a (422) plane, a (331) plane, a (420) plane, and a (511) plane, where I(hkl) and I(hxkylz) represent a measured diffraction intensity of a (hkl) plane and a measured diffraction intensity of a (hxkylz) plane, respectively, I0(hkl) and I0(hxkylz) represent an average value of a powder diffraction intensity of TiC (card number: 32-1383) and TiN (card number: 38-1420) of the (hkl) plane according to JCPDS (Joint Committee on Powder Diffraction Standards) database and an average value of a powder diffraction intensity of TiC and TiN of the (hxkylz) plane according to the JCPDS database, respectively, and (hkl) and (hxkylz) each represent any of 8 planes of the (111) plane the (200) plane, the (220) plane, the (311) plane, the (331) plane, the (420) plane, the (422) plane, and the (511) plane.

2 . The cutting tool according to claim 1 , wherein
in the hard particles, an average of a percentage of the number of atoms of the silicon, A Si , to a sum of the number of atoms of the titanium, A Ti , and the number of atoms of the silicon, A Si , {A Si /(A Si +A Ti )}×100, is 1% or more and 20% or less.

3 . The cutting tool according to claim 2 , wherein the average of {A Si /(A Si +A Ti )}×100 is 1% or more and 10% or less.

4 . The cutting tool according to claim 1 , wherein an average period width of the concentration of the silicon is 3 nm or more and 50 nm or less.

5 . The cutting tool according to claim 4 , wherein the average period width of the concentration of the silicon is 4 nm or more and 30 nm or less.

6 . The cutting tool according to claim 1 , wherein a thickness of the hard particle layer is 1 μm or more and 20 μm or less.

7 . The cutting tool according to claim 1 , wherein
the base material is formed from a cemented carbide including tungsten carbide and cobalt, and a content of the cobalt in the cemented carbide is 6% by mass or more and 11% by mass or less.

8 . The cutting tool according to claim 1 , wherein in the hard particles, a difference between a maximum value and a minimum value of a percentage of the number of atoms of the silicon, A Si , to a sum of the number of atoms of the titanium, A Ti , and the number of atoms of the silicon, A Si , {A Si /(A Si +A Ti )}×100, is 1% or more and 38% or less.

9 . The cutting tool according to claim 1 , wherein a value of an orientation index

Assignees

• Sumitomo Electric Industries

Inventors

• Ono Satoshi
• Paseuth Anongsack
• Okamura Katsumi

Classifications

• C23C16/403

  of aluminium, magnesium or beryllium · CPC title

• C23C16/36

  Carbonitrides · CPC title

• C23C16/34

  Nitrides {(C23C16/303 takes precedence)} · CPC title

• C23C16/308

  Oxynitrides · CPC title

• B23B2228/105

  with specified thickness · CPC title