Apparatus and method for transferring light-emitting diodes

Patent metadata

Field	Value
Publication number	US-12568840-B2
Application number	US-202217807928-A
Country	US
Kind code	B2
Filing date	Jun 21, 2022
Priority date	Jun 24, 2021
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

An apparatus for transferring light-emitting diodes (LEDs) includes a backing board for supporting a backplane, a sealing member formed on the backing board around a periphery of the backplane, a transparent panel formed on the sealing member such that a space is formed between the backing board and the transparent panel, and a vacuum source for drawing a vacuum on the space.

First claim

What is claimed is:

1 . A system comprising:
an apparatus for transferring light-emitting diodes (LEDs), the apparatus comprising:
a backing board configured to support a backplane;
a sealing member located on the backing board around a periphery of a position of the backplane;
a glass panel that is transparent, the glass panel located on the sealing member such that a space is formed between the backing board and the glass panel;
a vacuum source configured to draw a vacuum on the space; and
a laser radiation source that is configured to direct a laser radiation through the glass panel to irradiate a LED coupon on the backplane in the space,
wherein the vacuum source is configured to draw the vacuum on the space such that the vacuum pulls the glass panel toward the backplane, thereby causing the glass panel to press the LED coupon toward the backplane, wherein an upper surface of the sealing member is configured to be above an upper surface of the backplane in a case where the backplane is supported by the backing board, and wherein the glass panel is on the upper surface of the sealing member.

2 . The system of claim 1 , further comprising:
the backplane located on the backing board; and the LED coupon located on the backplane.

3 . The system of claim 1 , wherein the vacuum source is configured to draw the vacuum such as to cause the glass panel to press the LED coupon with a pressure that is substantially uniform over an entirety of the glass panel, and
wherein the pressure is less than or equal to 14.7 psi.

4 . The system of claim 1 , further comprising:
the backplane located on the backing board; and a plurality of LED coupons that are located in an array on the backplane, wherein the glass panel is configured to press on the plurality of LED coupons with a pressure that is substantially uniform over the plurality of LED coupons.

5 . The apparatus of claim 1 , further comprising the LED coupon,
wherein the LED coupon comprises a micro-LED coupon comprising a substrate and a plurality of micro-LEDs that are formed on the substrate and are to be transferred from the substrate to the backplane.

6 . The apparatus of claim 1 , wherein the backing board comprises through channels, and the vacuum source is connected to the backing board and is configured to draw the vacuum on the space through the through channels.

7 . The apparatus of claim 1 , wherein the vacuum source further comprises a transparent vacuum bag that is formed around the backing board, the sealing member and the glass panel, and the vacuum source is configured to draw the vacuum on the space by drawing a vacuum on the transparent vacuum bag.

8 . The apparatus of claim 1 , wherein the glass panel has a thickness no greater than about 5 mm.

9 . The apparatus of claim 8 , wherein the backing board comprises a rigid backing board and the glass panel comprises a pliable transparent panel having a lower rigidity than a rigidity of the backing board.

10 . The system of claim 1 , further comprising the LED coupon,
wherein a thickness of the sealing member is equal or greater than 0.9 times and equal to or less than 1.1 times a combination of a thickness of the backplane and a thickness of the LED coupon.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Huang Ivan
• Martinelli Massimo
• Strasilla Eric

Classifications

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/0198 Primary

  batch processes · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10W90/00

  Package configurations · CPC title