Light detection and ranging (LIDAR) sensor system including integrated chip

Patent metadata

Field	Value
Publication number	US-12566306-B2
Application number	US-202318359127-A
Country	US
Kind code	B2
Filing date	Jul 26, 2023
Priority date	Jul 26, 2023
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

First claim

What is claimed is:

1 . A method for manufacturing an integrated chip packaging for a light detection and ranging (LIDAR) sensor mounted to a vehicle, the method comprising:
obtaining a metallic housing including a cutout on a side of the metallic housing; obtaining a ceramic radio frequency (RF) circuit board including a flange; mounting a base of the ceramic RF circuit board situated to a side of the flange onto a supporting structure using a plurality of standoffs; coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing; applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing; and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

2 . The method of claim 1 , wherein the seal at the interface is a hermetic seal.

3 . The method of claim 2 , wherein the hermetic seal shields RF signals on the ceramic RF circuit board within the metallic housing from electromagnetic interference.

4 . The method of claim 1 , wherein coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing comprises:
inserting the ceramic RF circuit board into the cutout on the side of the metallic housing; and aligning the flange of the ceramic RF circuit board against the cutout on the side of the metallic housing.

5 . The method of claim 4 , wherein aligning the flange of the ceramic RF circuit board against the cutout on the side of the metallic housing comprises:
aligning bond pads between the ceramic RF circuit board and a direct current (DC) circuit board within the metallic housing; and wire bonding the bond pads for making an interconnection.

6 . The method of claim 5 , wherein the interconnection includes one between a transimpedance amplifier (TIA) bank on the ceramic RF circuit board and a transceiver assembly on the DC circuit board within the metallic housing.

7 . The method of claim 4 , wherein applying the sealing material to the interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing comprises:
dispensing the sealing material onto a surface of the flange of the ceramic RF circuit board prior to the coupling; and applying pressure to ensure contact is made at the interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing.

8 . The method of claim 1 , further comprising:
prior to locally heating the flange of the ceramic RF circuit board, coupling a lid to the metallic housing.

9 . The method of claim 8 , wherein the lid covers an open side of the metallic housing, and a side of the lid overlaps the flange of the ceramic RF circuit board such that the lid contacts the sealing material.

10 . The method of claim 9 , wherein locally heating the flange of the ceramic RF circuit board bonds the lid to the metallic housing and the flange of the ceramic RF circuit board.

11 . The method of claim 1 , wherein the flange of the ceramic RF circuit board includes an embedding of a resistive heater and a thermocouple.

12 . The method of claim 11 , wherein locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing comprises:
raising, using the resistive heater, a temperature of the flange to sinter the sealing material; and measuring, using the thermocouple, the temperature of the flange as the resistive heater raises the temperature to reach a threshold temperature associated with sintering.

13 . The method of claim 12 , wherein the temperature of the flange is raised to a point anywhere in a range from 200 to 250 degree Celsius.

14 . The method of claim 1 , wherein the ceramic RF circuit board is assembled with one or more of an RF connector, a transimpedance amplifier (TIA) bank, RF amplifiers, and RF filters.

15 . The method of claim 5 , wherein the DC circuit board within the metallic housing is assembled with one or more of a seed laser assembly, an optical amplifier assembly, a transceiver assembly, a lens array, and a heat transfer component.

16 . The method of claim 1 , wherein the sealing material comprises at least one of silver sinter or solder.

17 . The method of claim 1 , wherein the ceramic RF circuit board is a multilayer ceramic RF circuit board.

18 . An integrated chip packaging for a light detection and ranging (LIDAR) sensor manufactured by a process comprising:
obtaining a metallic housing including a cutout on a side of the metallic housing; obtaining a ceramic radio frequency (RF) circuit board including a flange; mounting a base of the ceramic RF circuit board situated to a side of the flange onto a supporting structure using a plurality of standoffs; coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing; applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing; and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

19 . A light detection and ranging (LIDAR) sensor system comprising:
an integrated chip packaging for a LIDAR sensor, the integrated chip packaging manufactured by a process including: obtaining a metallic housing including a cutout on a side of the metallic housing; obtaining a ceramic radio frequency (RF) circuit board including a flange; mounting a base of the ceramic RF circuit board situated to a side of the flange onto a supporting structure using a plurality of standoffs; coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing; applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing; and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

Assignees

• Aurora Operations Inc

Inventors

• Ferrara James
• Heinemann Stefan
• Jujjavarapu Pruthvi
• Lin Sen
• Tang Zhizhong

Classifications

• G02B6/4277

  Protection against electromagnetic interference [EMI], e.g. shielding means (shielding of electric apparatus H05K9/00, of instruments G12B17/00) · CPC title

• G01S17/931 Primary

  of land vehicles · CPC title

• G02B6/4251

  Sealed packages (G02B6/4248 takes precedence) · CPC title

• G02B6/4295

  coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors · CPC title

• G02B6/426

  mounting, engaging or coupling of the package to a board, a frame or a panel · CPC title