Modular cooling farm for cryogenic application

Patent metadata

Field	Value
Publication number	US-12566023-B2
Application number	US-202218065703-A
Country	US
Kind code	B2
Filing date	Dec 14, 2022
Priority date	Dec 14, 2022
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

Systems and/or methods provided herein relate to cooling of a component within a chamber of a cryostat. A system can comprise a cryostat having a cooling plate disposed within the cryostat, and a cooling feed line extending into the cryostat from external to the cryostat, which cooling feed line is thermally coupled to the cooling plate by a heat exchanger. In one or more embodiments, the system further can comprise a bulk cooling system that employs a liquifiable gas to provide cooling, wherein the bulk cooling system is fluidly coupled to the cooling feed line. In one or more embodiments, the system further can comprise a vacuum pump disposed at the cooling return line and external to the cryostat and physically decoupled from the cryostat by a section of the cooling return line disposed between the cryostat and the vacuum pump.

First claim

What is claimed is:

1 . A system comprising:
a cryostat having a body and a cooling plate disposed within the cryostat body; a cooling feed line extending into the cryostat from external to the cryostat, which cooling feed line is thermally coupled to the cooling plate by a heat exchanger; a bulk cooling system that employs a first liquifiable gas and the bulk cooling system employing, or a second bulk cooling system that employs, a second liquifiable gas to provide cooling, wherein the bulk cooling system is fluidly coupled to the cooling feed line and wherein one or more pumps providing the first liquifiable gas or the second liquifiable gas to and from the bulk cooling system are decoupled from and spaced apart from the cryostat body, wherein the first liquifiable gas comprises an atomic element not comprised by the second liquifiable gas, and wherein each of the first liquifiable gas and the second liquifiable gas are employed during a common cooling cycle to cool the cryostat.

2 . The system of claim 1 ,
wherein the bulk cooling system comprises, a liquid nitrogen cooling system fluidly coupled to the cooling feed line and a liquid helium cooling system fluidly coupled to a second cooling feed line that also extends into the cryostat from external to the cryostat and is thermally coupled to the cooling plate by a second heat exchanger, and wherein the first liquifiable gas is the liquid nitrogen, and the second liquifiable gas is the liquid helium.

3 . The system of claim 1 ,
wherein the cooling plate is disposed within an internal thermally insulated section within the cryostat, wherein a second cooling plate is disposed within the cryostat but external to the internal thermally insulated section, and wherein pumps, of the one or more pumps, for separately cooling the first cooling plate and the second cooling plate, are disposed external to, spaced apart from, and physically decoupled from the cryostat body.

4 . The system of claim 3 , wherein the cryostat further comprises a dilution refrigeration unit disposed within the internal thermally insulated section.

5 . The system of claim 1 , further comprising:
a cooling return line fluidly coupled to the cooling feed line at the cooling plate and extending out of the cryostat from the cooling plate; and a vacuum pump, of the one or more pumps, disposed at the cooling return line and external to the cryostat.

6 . The system of claim 5 , wherein the vacuum pump is spaced apart from and physically decoupled from the cryostat body at least by a section of the cooling return line disposed between the cryostat body and the vacuum pump.

7 . The system of claim 1 , absent any pump, of the one or more pumps, coupled at an external surface of the cryostat body or extending into the cryostat.

8 . The system of claim 1 , further comprising:
a second cooling plate disposed within the cryostat; a second cooling feed line extending into the cryostat, which second cooling feed line is thermally coupled to the second cooling plate and does not extend to the cooling plate; and a second bulk cooling system that employs a third liquifiable gas for cooling of the cryostat, which second bulk cooling system is fluidly coupled to the second cooling feed line, wherein the third liquifiable gas comprises an atomic element not comprised by the first liquifiable gas or comprised by the second liquifiable gas, and wherein each of the first liquifiable gas, the second liquifiable gas, and the third liquifiable gas are employed during the common cooling cycle to cool the cryostat.

9 . A system comprising:
a cryostat having a cryostat body, a cold plate and a second cold plate within the cryostat body, and primary cooling feed line and an auxiliary cooling feed line extending into the cryostat, wherein the primary cooling feed line is both physically coupled and thermally coupled to the cold plate within the cryostat body by a heat exchanger, and wherein the auxiliary cooling feed line is both physically coupled and thermally coupled to the second cold plate; a bulk cooling system employing a first liquifiable gas to provide cooling; a main cooling feed line fluidly coupled to the bulk cooling system and to the primary cooling feedline, wherein one or more pumps providing the liquifiable gas to and from the bulk cooling system are decoupled from and spaced apart from the cryostat body; a second bulk cooling system employing a second liquifiable gas to provide cooling; and a second main cooling feed line fluidly coupled to the second bulk cooling system and to the auxiliary cooling feed line, wherein one or more pumps providing the second liquifiable gas to and from the second bulk cooling system are decoupled from and spaced apart from the cryostat body, wherein the first liquifiable gas comprises an atomic element not comprised by the second liquifiable gas, and wherein each of the first liquifiable gas and the second liquifiable gas are employed during a common cooling cycle to cool the cryostat.

10 . The system of claim 9 , wherein the primary cooling feed line is thermally coupled to each cold plate in the cryostat, including the cold plate and the second cold plate.

11 . The system of claim 9 ,
wherein the auxiliary cooling feed line is thermally coupled to less than all cold plates within the cryostat.

12 . The system of claim 9 , further comprising:
a primary cooling return line fluidly coupled to the primary cooling feed line at the cooling plate and extending out of the cryostat from the cooling plate; and a vacuum pump, of the one or more pumps, at the primary cooling return line and external to the cryostat.

13 . A method for operating a cryostat, the method comprising:
pumping, by a system operatively coupled to a processor, a gas from a bulk cooling system, through a cooling feed line entering a cryostat, thereby providing cooling to the cryostat; cooling, by the system, the cooling plate within the cryostat by the gas flowing from the bulk cooling system, wherein the cooling feed line is thermally coupled to the cooling plate, wherein one or more pumps providing the gas to and from the bulk cooling system are spaced apart from and decoupled from the cryostat body; and cooling, by the system, the cooling plate or a second cooling plate disposed within the cryostat by a second gas flowing from the bulk cooling system or from a second bulk cooling system, wherein the first gas comprises an atomic element not comprised by the second gas, and wherein each of the first gas and the second gas are employed during a common cooling cycle to cool the cryostat.

14 . The method according to claim 13 , wherein the first cooling plate is disposed within an internal thermally insulated section within the cryostat, wherein the second cooling plate is disposed external to the internal thermally insulated section, and wherein pumps, of the one or more pumps, for separately cooling the first cooling plate and the second cooling plate are disposed external to and physically decoupled from the cryostat body.

15 . The method according to claim 13 , further comprising:
wherein the cooling the cooling plate or the second cooling plate disposed within the cryostat by a second gas comprises cooling, by the system, to a temperature lower than a temperature of the cooling plate cooled by the gas flowing from the bulk cooling system, the second cooling plate disposed within the cryostat by the second gas flowing from the bulk cooling system or from the second bulk cooling system through a secondary cooling feed line entering the

Assignees

• IBM

Inventors

• Gumann Patryk
• Spratt William Thomas
• Bedell Stephen W
• Bauer Gilbert
• Zarsky David

Classifications

• F17C2203/0391

  by vacuum · CPC title

• F25B9/10

  with several cooling stages · CPC title

• F25D19/006

  Thermal coupling structure or interface · CPC title

• F25D3/005

  combined with heat exchangers · CPC title

• F17C2250/0689

  Methods for controlling or regulating · CPC title