Resin composition, self-fusing insulated electric wire and wire bundle

Patent metadata

Field	Value
Publication number	US-12565565-B2
Application number	US-202117918722-A
Country	US
Kind code	B2
Filing date	Jun 11, 2021
Priority date	Jun 16, 2020
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

A resin composition includes a phenoxy resin as a principal component. The phenoxy resin has a weight-average molecular weight of 40,000 or more. The phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy and a second structural unit derived from a bisphenol epoxy other than the first structural unit. A content ratio of the first structural unit in the phenoxy resin is 20 mol % to 80 mol % relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.

First claim

The invention claimed is:

1 . A resin composition comprising
60 to 85 mass % of a phenoxy resin, and 15 to 40 mass % of at least one additional component comprising a blowing agent, wherein the phenoxy resin has a weight-average molecular weight of 40,000 or more, the phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy, a second structural unit derived from a bisphenol A epoxy and a bisphenol F epoxy, and a content ratio of the first structural unit in the phenoxy resin is 20 mol % to 80 mol % relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.

2 . The resin composition according to claim 1 , having an elastic modulus E 1 at 60° C. in a state before curing treatment of 0.5 MPa or more and an elastic modulus E 2 at 100° C. in a state before curing treatment of less than 2.0 MPa.

3 . The resin composition according to claim 2 , further comprising an organic solvent.

4 . A self-fusing insulated electric wire comprising a linear conductor, an insulating layer covering an outer peripheral surface of the conductor, and a heat fusion layer covering an outer peripheral surface of the insulating layer,
wherein the heat fusion layer is composed of the resin composition according to claim 3 .

5 . A self-fusing insulated electric wire comprising a linear conductor, an insulating layer covering an outer peripheral surface of the conductor, and a heat fusion layer covering an outer peripheral surface of the insulating layer,
wherein the heat fusion layer is composed of the resin composition according to claim 2 .

6 . A wire bundle comprising two or more self-fusing insulated electric wires fixed through a heat fusion layer,
wherein the self-fusing insulated electric wires are each the self-fusing insulated electric wire according to claim 5 .

7 . The resin composition according to claim 1 , further comprising an organic solvent.

8 . A self-fusing insulated electric wire comprising a linear conductor, an insulating layer covering an outer peripheral surface of the conductor, and a heat fusion layer covering an outer peripheral surface of the insulating layer,
wherein the heat fusion layer is composed of the resin composition according to claim 7 .

9 . A wire bundle comprising two or more self-fusing insulated electric wires fixed through a heat fusion layer, wherein the self-fusing insulated electric wires are each the self-fusing insulated electric wire according to claim 8 .

10 . A self-fusing insulated electric wire comprising a linear conductor, an insulating layer covering an outer peripheral surface of the conductor, and a heat fusion layer covering an outer peripheral surface of the insulating layer,
wherein the heat fusion layer is composed of the resin composition according to claim 1 .

11 . A wire bundle comprising two or more self-fusing insulated electric wires fixed through a heat fusion layer,
wherein the self-fusing insulated electric wires are each the self-fusing insulated electric wire according to claim 10 .

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Wintec Inc

Inventors

• Saito Hideaki
• Homma Shigenori
• Sugawara Jun

Classifications

• H01F5/06

  Insulation of windings · CPC title

• H01B3/30 Primary

  plastics; resins; waxes · CPC title

• C08J2381/06

  Polysulfones; Polyethersulfones · CPC title

• C08J2363/02

  Polyglycidyl ethers of bis-phenols · CPC title

• C08J2203/22

  Expandable microspheres, e.g. Expancel® · CPC title