Induction welding using a heat sink and/or cooling

US12565012B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12565012-B2
Application numberUS-202217929857-A
CountryUS
Kind codeB2
Filing dateSep 6, 2022
Priority dateAug 6, 2019
Publication dateMar 3, 2026
Grant dateMar 3, 2026

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.

First claim

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The following is claimed: 1 . A method of forming a heat sink, the method comprising: spacing a number of tiles into a single layer with a gap between the tiles, wherein the tiles are electrically non-conductive and thermally conductive; and filling the gap between the tiles with an adhesive flexibly joining sides of the number of tiles to each other. 2 . The method of claim 1 , further comprising joining the tiles with a mechanical hinge disposed within the gap. 3 . The method of claim 1 , further comprising setting the tiles onto a layer of flexible adhesive sprayed onto a backing material comprising fibers comprised of a glass. 4 . The method of claim 3 , further comprising disposing cooling channels within the gap. 5 . The method of claim 3 , further comprising curing the adhesive. 6 . The method of claim 1 , wherein: spacing the tiles includes spacing the tiles on a backing material: and the adhesive comprises: a tensile strength of between 690 psi to 1035 psi; and a tear strength (Die B) of between 31 lb/in to 190 lb/in. 7 . The method of claim 1 , further comprising the flexible adhesive comprising a silicone. 8 . The method of claim 1 , wherein; the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; and the adhesive comprises: a long-term degradation temperature greater than about 570 degrees Fahrenheit in air; and an elongation of between 120% and 670%. 9 . The method of claim 1 , further comprising fluid channels within the tiles and the gap defining a fluid path for communicating a coolant through the heat sink. 10 . A method for forming a heat sink for induction welding, the method comprising: spacing a number of tiles into a single layer within a frame having a jig; removing the jig; applying a flexible adhesive between the tiles; and subsequently curing the flexible adhesive. 11 . The method of claim 10 , further comprising priming the tiles with a primer. 12 . The method of claim 11 , wherein: priming the tiles includes priming the tiles with a silicone primer: and the flexible adhesive comprises: a long-term degradation temperature greater than about 570 degrees Fahrenheit in air; and an elongation of between 120% and 670%. 13 . The method of claim 10 , further comprising providing the number of tiles that are electrically non-conductive and thermally conductive prior to spacing the number of tiles within the frame. 14 . The method of claim 10 , wherein spacing the tiles within the frame includes spacing the tiles on a backing material comprising a glass disposed under the frame. 15 . The method of claim 14 , wherein; spacing the tiles on the backing material includes adhering the tiles to the backing material; and the flexible adhesive comprises: a tensile strength of between 690 psi to 1035 psi; and a tear strength (Die B) of between 31 lb/in to 190 lb/in. 16 . The method of claim 15 , further comprising disposing cooling channels within the flexible adhesive. 17 . The method of claim 16 , further comprising removing the backing material after curing the flexible adhesive. 18 . The method of claim 10 , wherein the flexible adhesive forms a joint between the tiles at edges of the tiles and the flexible adhesive is comprised of silicon. 19 . The method of claim 10 wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec. 20 . The method of claim 10 , further comprising disposing a fluid path defined by fluid channels within the tiles and the flexible adhesive for communicating a coolant through the heat sink.

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What does patent US12565012B2 cover?
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B29C66/349. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 03 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).