Injection-molded flexible cold plate
US-10712102-B2 · Jul 14, 2020 · US
US12565012B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12565012-B2 |
| Application number | US-202217929857-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2022 |
| Priority date | Aug 6, 2019 |
| Publication date | Mar 3, 2026 |
| Grant date | Mar 3, 2026 |
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A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
Opening claim text (preview).
The following is claimed: 1 . A method of forming a heat sink, the method comprising: spacing a number of tiles into a single layer with a gap between the tiles, wherein the tiles are electrically non-conductive and thermally conductive; and filling the gap between the tiles with an adhesive flexibly joining sides of the number of tiles to each other. 2 . The method of claim 1 , further comprising joining the tiles with a mechanical hinge disposed within the gap. 3 . The method of claim 1 , further comprising setting the tiles onto a layer of flexible adhesive sprayed onto a backing material comprising fibers comprised of a glass. 4 . The method of claim 3 , further comprising disposing cooling channels within the gap. 5 . The method of claim 3 , further comprising curing the adhesive. 6 . The method of claim 1 , wherein: spacing the tiles includes spacing the tiles on a backing material: and the adhesive comprises: a tensile strength of between 690 psi to 1035 psi; and a tear strength (Die B) of between 31 lb/in to 190 lb/in. 7 . The method of claim 1 , further comprising the flexible adhesive comprising a silicone. 8 . The method of claim 1 , wherein; the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; and the adhesive comprises: a long-term degradation temperature greater than about 570 degrees Fahrenheit in air; and an elongation of between 120% and 670%. 9 . The method of claim 1 , further comprising fluid channels within the tiles and the gap defining a fluid path for communicating a coolant through the heat sink. 10 . A method for forming a heat sink for induction welding, the method comprising: spacing a number of tiles into a single layer within a frame having a jig; removing the jig; applying a flexible adhesive between the tiles; and subsequently curing the flexible adhesive. 11 . The method of claim 10 , further comprising priming the tiles with a primer. 12 . The method of claim 11 , wherein: priming the tiles includes priming the tiles with a silicone primer: and the flexible adhesive comprises: a long-term degradation temperature greater than about 570 degrees Fahrenheit in air; and an elongation of between 120% and 670%. 13 . The method of claim 10 , further comprising providing the number of tiles that are electrically non-conductive and thermally conductive prior to spacing the number of tiles within the frame. 14 . The method of claim 10 , wherein spacing the tiles within the frame includes spacing the tiles on a backing material comprising a glass disposed under the frame. 15 . The method of claim 14 , wherein; spacing the tiles on the backing material includes adhering the tiles to the backing material; and the flexible adhesive comprises: a tensile strength of between 690 psi to 1035 psi; and a tear strength (Die B) of between 31 lb/in to 190 lb/in. 16 . The method of claim 15 , further comprising disposing cooling channels within the flexible adhesive. 17 . The method of claim 16 , further comprising removing the backing material after curing the flexible adhesive. 18 . The method of claim 10 , wherein the flexible adhesive forms a joint between the tiles at edges of the tiles and the flexible adhesive is comprised of silicon. 19 . The method of claim 10 wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec. 20 . The method of claim 10 , further comprising disposing a fluid path defined by fluid channels within the tiles and the flexible adhesive for communicating a coolant through the heat sink.
by using adhesives · CPC title
composite, e.g. polymers with fillers or fibres · CPC title
Flexible elements · CPC title
Coatings; Surface treatments · CPC title
from aluminium or aluminium alloys · CPC title
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