Different material bonding apparatus and operation method thereof

US12565010B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12565010-B2
Application numberUS-202318228866-A
CountryUS
Kind codeB2
Filing dateAug 1, 2023
Priority dateAug 9, 2022
Publication dateMar 3, 2026
Grant dateMar 3, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of the second layer, the second layer includes a plurality of penetration grooves formed to be recessed in the one surface contacting the first layer, and a melting point of the second layer is higher than a melting point of the first layer.

First claim

Opening claim text (preview).

What is claimed is: 1 . A bonding apparatus comprising: an upper layer having a first surface, a second surface opposite to the first surface, and lateral surfaces extending between the first and second surfaces; a lower layer having a third surface facing the first surface, a fourth surface facing away from the first surface, and end portions; and a heater, wherein the lower layer has a melting point higher than a melting point of the upper layer, the end portions are formed integrally and bent upwardly to cover and be in contact with the lateral surfaces of the upper layer, and the heater is configured to apply heat to lateral outer surfaces of the end portions. 2 . The bonding apparatus according to claim 1 , wherein the lower layer includes a plurality of penetration grooves formed to be recessed in the third surface facing the first surface of the upper layer. 3 . The bonding apparatus according to claim 2 , wherein each of the penetration grooves is provided to have a shape of a polygon or a part of a circle in a cross section in a lateral direction. 4 . The bonding apparatus according to claim 1 , wherein the first upper layer is plastic. 5 . The bonding apparatus according to claim 4 , wherein the plastic includes at least one of a transmission layer plastic that transmits a laser wavelength or an absorption layer plastic that absorbs a laser wavelength. 6 . The bonding apparatus according to claim 1 , wherein the heater includes a laser welding heater. 7 . The bonding apparatus according to claim 1 , wherein the lower layer is aluminum. 8 . The bonding apparatus according to claim 1 , further comprising a presser configured to apply pressure so that the upper layer and the lower layer come into close contact with each other. 9 . The bonding apparatus according to claim 1 , wherein the end portions of the lower layer are formed to cover and be in contact with both the lateral surfaces and edge regions of the second surface in a C-shaped configuration around the upper layer. 10 . A bonding apparatus comprising: an upper layer having a first surface, a second surface opposite to the first surface, and lateral surfaces extending between the first and second surfaces; a lower layer having a third surface facing the first surface, a fourth surface facing away from the first surface, and end portions; and a heater, wherein the lower layer has a melting point higher than a melting point of the upper layer, the end portions are formed integrally and bent upwardly to cover and be in contact with the lateral surfaces and edge regions of the second surface in a C-shaped configuration around the upper layer, and the heater is configured to apply heat to top outer surfaces of the end portions.

Assignees

Inventors

Classifications

  • Joining of substantially the whole surface of the articles (methods or apparatus for laminating B32B37/00) · CPC title

  • Dovetailed interlocking undercuts · CPC title

  • Reforming or reshaping the joint, e.g. folding over (reshaping the burr B29C66/326) · CPC title

  • Applying molten plastics, e.g. hot melt (using welding bar {combined with hot gases} B29C65/12; by moulding B29C65/70) · CPC title

  • Aluminium or alloys of aluminium · CPC title

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What does patent US12565010B2 cover?
Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of t…
Who is the assignee on this patent?
Hl Klemove Corp
What technology area does this patent fall under?
Primary CPC classification B29C65/1635. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 03 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).