Aluminum molded body and method for producing same

Patent metadata

Field	Value
Publication number	US-12564878-B2
Application number	US-202117919815-A
Country	US
Kind code	B2
Filing date	Apr 13, 2021
Priority date	Apr 21, 2020
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

The present invention provides an aluminum molded body having high thermal conductivity as well as higher strength than a rolled material, and a method for producing the aluminum molded body. More specifically, provided are an aluminum molded body having a thermal conductivity of 180 W/mK or higher and higher strength than a rolled material of the same composition, and a method with which it is possible to efficiently produce the aluminum molded body even when the shape thereof is complex. An aluminum layered molded body obtained by molding through an additive manufacturing method according to the present invention is characterized in that: an aluminum material containing 0.001-2.5 mass % of a transition metal element that forms a eutectic with Al, the balance being Al and unavoidable impurities, is used as a raw material; and the thermal conductivity is 180 W/mK or higher.

First claim

The invention claimed is:

1 . An aluminum molded body,
which is an aluminum laminated molded body molded by an additive manufacturing method, which is characterized in that: a raw material therefor is an aluminum material consisting of 0.5 to 2.5% by mass of Fe that forms a eutectic crystal with Al, with the remainder being Al and unavoidable impurities; and a thermal conductivity thereof is 180 W/mK or more.

2 . The aluminum molded body according to claim 1 , wherein average particle size of the compound composed of Al and Fe in the region excluding the boundary portion of the melt pool is 20 to 100 nm.

3 . The aluminum molded body according to claim 1 , wherein the thermal conductivity is 190 W/mK or more.

4 . The aluminum molded body according to claim 1 , wherein the Vickers hardness is 30 to 90 HV.

5 . The aluminum molded body according to claim 1 , wherein the decrease in Vickers hardness when kept at 400 to 500° C. for 1 hour is 5 HV or less.

6 . The aluminum molded body according to claim 1 , wherein the aluminum molded body has tensile strength: 100 MPa or more, 0.2% proof stress: 75 MPa or more, and elongation: 5% or more.

7 . The aluminum molded body according to claim 1 , wherein the unavoidable impurities includes Si, Cu, Mn, Mg, Zn, Cr or Ti.

8 . The aluminum molded body according to claim 1 , wherein the unavoidable impurities includes Si and a content of Si in the aluminum material is 0.06 to 0.12% by mass.

9 . A method for producing an aluminum molded body, which is characterized by including,
a lamination molding step of molding an aluminum material consisting of 0.5 to 2.5% by mass of Fe which forms a eutectic crystal with Al, with the remainder being Al and unavoidable impurities by an additive manufacturing method to obtain an aluminum laminated molded body; and a heat treatment step of holding the aluminum laminated molded body at 325 to 525° C. to precipitate a compound composed of Al and Fe and to reduce residual stress, wherein a thermal conductivity of the aluminum molded body is 180 W/mK or more.

Assignees

• Nippon Light Metal Co
• Toyo Aluminium Kk

Inventors

• YATSUKURA Masato
• Nagao Takashi
• TASHIRO Tsuguharu
• Kusui Jun

Classifications

• C22C21/00

  Alloys based on aluminium · CPC title

• C22C1/0416

  Aluminium-based alloys · CPC title

• B33Y80/00 Primary

  Products made by additive manufacturing · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B22F2998/10

  Processes characterised by the sequence of their steps · CPC title