Display apparatus and method of manufacturing the same
US-2018092225-A1 · Mar 29, 2018 · US
US12563897B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12563897-B2 |
| Application number | US-202418828521-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 9, 2024 |
| Priority date | Nov 21, 2018 |
| Publication date | Feb 24, 2026 |
| Grant date | Feb 24, 2026 |
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A display panel includes a substrate including an opening area, a display area, and a first non-display area, the first non-display area being between the opening area and the display area, a plurality of display elements arranged in the display area, a thin film encapsulation layer that covers the display elements, the thin film encapsulation layer including an inorganic encapsulation layer and an organic encapsulation layer, a groove in the first non-display area, a planarization layer in the first non-display area, the planarization layer covering the groove, a first inorganic insulating layer under the planarization layer such that the first inorganic insulating layer is between the planarization layer and the substrate, and a second inorganic insulating layer over the planarization layer.
Opening claim text (preview).
What is claimed is: 1 . An electronic device comprising: a display panel comprising an opening area and a display area surrounding the opening area; and a component corresponding to the opening area of the display panel, wherein the display panel comprises: a substrate having an opening in the opening area; a plurality of pixel electrodes arranged in the display area; an opposite electrode overlapping the plurality of pixel electrodes in the display area; an intermediate layer between the plurality of pixel electrodes and the opposite electrode; an encapsulation layer on the opposite electrode, the encapsulation layer comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer; a first inorganic insulating layer on the encapsulation layer; a plurality of touch electrodes on the first inorganic insulating layer, the plurality of touch electrodes being arranged in the display area; a barrier wall in a non-display area, the non-display area being between the opening area and the display area; and an organic insulation layer disposed on an upper surface of the first inorganic insulating layer in the non-display area, wherein the first inorganic insulating layer and the second inorganic encapsulation layer each extend to the non-display area, on an upper surface of the barrier wall, the first inorganic insulating layer is in direct contact with the second inorganic encapsulation layer, a contact area of the first inorganic insulating layer and the second inorganic encapsulation layer is overlapped by the organic insulation layer, the organic insulation layer does not overlap the display area in plan view, and the barrier wall completely surrounds the opening in plan view. 2 . The electronic device of claim 1 , wherein the first inorganic encapsulation layer extends to the non-display area, and on the barrier wall, the second inorganic encapsulation layer is in direct contact with the first inorganic encapsulation layer. 3 . The electronic device of claim 1 , wherein an upper surface of the organic insulation layer is substantially flat. 4 . The electronic device of claim 1 , further comprising a second inorganic insulating layer on the organic insulation layer. 5 . The electronic device of claim 1 , wherein the organic insulation layer overlaps a part of the organic encapsulation layer in the non-display area. 6 . The electronic device of claim 5 , wherein the overlapping region of the organic insulation layer and the organic encapsulation layer is only between the barrier wall and the display area. 7 . The electronic device of claim 1 , wherein the display panel further comprises a groove in the non-display area, the groove is overlapped by the organic insulation layer, and the groove completely surrounds the opening in plan view. 8 . The electronic device of claim 7 , wherein the second inorganic encapsulation layer and the first inorganic encapsulation layer are in direct contact with each other between a bottom surface of the groove and the organic insulation layer. 9 . The electronic device of claim 8 , wherein the groove is between the barrier wall and the opening of the substrate. 10 . The electronic device of claim 1 , wherein the component comprises a camera or a sensor. 11 . An electronic device, comprising: a display panel comprising an opening area and a display area at least partially surrounding the opening area; and a component corresponding to the opening area of the display panel, wherein the display panel comprises: a substrate having an opening in the opening area; a plurality of pixel electrodes arranged in a display area, the display area surrounding the opening area; an opposite electrode overlapping the plurality of pixel electrodes in the display area; an intermediate layer between the plurality of pixel electrodes and the opposite electrode; an encapsulation layer on the opposite electrode, the encapsulation layer comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer; a first inorganic insulating layer on the encapsulation layer; a plurality of touch electrodes on the first inorganic insulating layer, the plurality of touch electrodes being arranged in the display area; at least two grooves in a non-display area, the non-display area being between the opening area and the display area; and an organic insulating layer, wherein in a first region between the at least two grooves, the organic insulating layer overlaps the first inorganic insulating layer, the second inorganic encapsulation layer, and the first inorganic encapsulation layer, in the first region, the first inorganic insulating layer is in direct contact with an upper surface of the second inorganic encapsulation layer, the organic insulating layer does not overlap the display area in plan view, and the display area completely surrounds the opening in plan view. 12 . The electronic device of claim 11 , wherein, in the first region, the organic insulating layer is in direct contact with the first inorganic insulating layer, and the second inorganic encapsulation layer is in direct contact with the first inorganic encapsulation layer. 13 . An electronic device, comprising: a display panel comprising an opening area and a display area at least partially surrounding the opening area; and a component corresponding to the opening area of the display panel, wherein the display panel comprises: a substrate having an opening in the opening area; a plurality of pixel electrodes arranged in a display area, the display area surrounding the opening area; an opposite electrode overlapping the plurality of pixel electrodes in the display area; an intermediate layer between the plurality of pixel electrodes and the opposite electrode; an encapsulation layer on the opposite electrode, the encapsulation layer comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer; a first inorganic insulating layer on the encapsulation layer; a plurality of touch electrodes on the first inorganic insulating layer, the plurality of touch electrodes being arranged in the display area; at least two grooves in a non-display area, the non-display area being between the opening area and the display area; and an organic insulating layer, wherein in a first region between the at least two grooves, the organic insulating layer overlaps the first inorganic insulating layer, the second inorganic encapsulation layer, and the first inorganic encapsulation layer, in the first region, the first inorganic insulating layer is in direct contact with an upper surface of the second inorganic encapsulation layer, the intermediate layer comprises an organic layer, and the organic layer comprises a first portion, a second portion, and a third portion that are separated from each other, the first portion of the organic layer is on a bottom surface of a first groove of the at least two grooves, the second portion of the organic layer is on a bottom surface of a second groove of the at least two grooves, and the third portion of the organic layer is in the first region. 14 . The electronic device of claim 13 , wherein the t
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