Liquid-cooling circulating system and method for server, electronic device and storage medium

Patent metadata

Field	Value
Publication number	US-12563701-B2
Application number	US-202318873667-A
Country	US
Kind code	B2
Filing date	Nov 22, 2023
Priority date	Feb 15, 2023
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

A liquid-cooling cycle system includes at least one composite phase change heat sink structure, and each composite phase change heat sink structure at least includes a composite phase change heat sink main body and two flexible oscillating heat pipes respectively connected to two sides of the composite phase change heat sink main body through interface structures, so that in the liquid-cooling cycle process of a server, phase change conversion between a-gaseous refrigerant and liquid refrigerant may be achieved by means of the flexible oscillating heat pipes and the composite phase change heat sink main body. During maintenance of the server, quick and convenient maintenance may be carried out simply by disassembling the flexible oscillating heat pipes.

First claim

The invention claimed is:

1 . A liquid cooling cycle system applied to a server, wherein the liquid cooling cycle system comprises at least a secondary side cycle module, the secondary side cycle module comprises secondary side refrigerant, a condenser, a first cycle pump connected to the condenser, and at least one composite phase change heat sink structure, wherein each composite phase change heat sink structure comprises at least a composite phase change heat sink main body, and two flexible oscillating heat pipes respectively connected to two sides of the composite phase change heat sink main body through interface structures, and a server motherboard is placed between the composite phase change heat sink main body and one flexible oscillating heat pipe of the two flexible oscillating heat pipes; wherein
the flexible oscillating heat pipe is used for absorbing heat source heat of the server motherboard, and heating first liquid refrigerant in the secondary side refrigerant to a saturated liquid state according to the heat source heat; and the composite phase change heat sink main body is used for absorbing the heat source heat of the server motherboard, transporting gaseous refrigerant in the secondary side refrigerant to the condenser for cooling treatment, and receiving second liquid refrigerant returned by the first cycle pump to complete a liquid cooling cycle for the server.

2 . The liquid cooling cycle system according to claim 1 , wherein the condenser is used for:
performing the cooling treatment on the gaseous refrigerant to obtain second liquid refrigerant corresponding to the gaseous refrigerant, and transporting the second liquid refrigerant to the first cycle pump.

3 . The liquid cooling cycle system according to claim 1 , wherein the first cycle pump is used for:
receiving the second liquid refrigerant transported by the condenser, and cyclically driving the second liquid refrigerant into interior of the composite phase change heat sink main body.

4 . The liquid cooling cycle system according to claim 1 , wherein interior of the composite phase change heat sink main body stores third liquid refrigerant, and the composite phase change heat sink main body is used for:
absorbing the heat source heat of the server motherboard, and performing vaporization treatment on the third liquid refrigerant according to the heat source heat, to obtain gaseous refrigerant corresponding to the third liquid refrigerant.

5 . The liquid cooling cycle system according to claim 4 , wherein the interior of the composite phase change heat sink main body is a micro/nano boiling enhancement structure, the micro/nano boiling enhancement structure is formed by a compounding process, and the compounding process comprises at least sintering, screen printing, fibers, and grooves.

6 . The liquid cooling cycle system according to claim 5 , wherein a section of the micro/nano boiling enhancement structure is a wedge-shaped structure section, the wedge-shaped structure section is used for accelerating discharge of bottom bubbles from the composite phase change heat sink main body when performing the vaporization treatment on the third liquid refrigerant.

7 . The liquid cooling cycle system according to claim 5 , wherein the micro/nano boiling enhancement structure is an inclined plane structure with an exponential curve characteristic, and the exponential curve characteristic is used for balancing a boiling point difference at a bottom of the composite phase change heat sink main body.

8 . The liquid cooling cycle system according to claim 1 , wherein the liquid cooling cycle system comprises a control module, and the control module is used for:
performing on-off control on the server motherboard, and performing cycle control on the first cycle pump.

9 . The liquid cooling cycle system according to claim 1 , wherein the liquid cooling cycle system comprises a data collection module, and the data collection module is used for:
collecting liquid cooling data of the liquid cooling cycle system, wherein the liquid cooling data comprises at least saturation temperature data and saturated vapor pressure data of the secondary side refrigerant, and temperature data of the server motherboard.

10 . The liquid cooling cycle system according to claim 1 , wherein the server motherboard comprises a first heat source main body and a second heat source main body, a motherboard surface where the first heat source main body is located is opposite to a motherboard surface where the second heat source main body is located; and
a surface of the first heat source main body is covered with the flexible oscillating heat pipe, and a surface of the second heat source main body is covered with the composite phase change heat sink main body.

11 . The liquid cooling cycle system according to claim 1 , wherein the liquid cooling cycle system further comprises a primary side cycle module connected to the condenser, the primary side cycle module comprises a second cycle pump and a heat dissipation end structure connected to the second cycle pump.

12 . The liquid cooling cycle system according to claim 11 , wherein the primary side cycle module further comprises primary side cooling water, the primary side cooling water is used for performing the cooling treatment for the condenser, and the second cycle pump is used for:
transporting the primary side cooling water flowing through the condenser to the heat dissipation end structure; and the heat dissipation end structure is used for performing heat dissipation and cooling treatment for the primary side cooling water, and returning the primary side cooling water after the heat dissipation and cooling treatment to the condenser.

13 . The liquid cooling cycle system according to claim 1 , wherein the flexible oscillating heat pipe comprises a heat pipe head end and a heat pipe tail end, the flexible oscillating heat pipe is an open cycle oscillating heat pipe, and the open cycle oscillating heat pipe represents that the heat pipe head end is not connected to the heat pipe tail end.

14 . The liquid cooling cycle system according to claim 1 , wherein the flexible oscillating heat pipe comprises a heat pipe head end and a heat pipe tail end, the flexible oscillating heat pipe is a closed cycle oscillating heat pipe, and the closed cycle oscillating heat pipe represents that the heat pipe head end is connected to the heat pipe tail end.

15 . The liquid cooling cycle system according to claim 13 , wherein the flexible oscillating heat pipe comprises a heat absorption section of the flexible oscillating heat pipe and a heat release section of the flexible oscillating heat pipe, and the heat release section of the flexible oscillating heat pipe is used for:
releasing the heat source heat after the heat absorption section of the flexible oscillating heat pipe absorbs the heat source heat of the server motherboard, heating the first liquid refrigerant in the secondary side refrigerant to the saturated liquid state.

16 . The liquid cooling cycle system according to claim 13 , wherein the flexible oscillating heat pipe comprises a condensation promotion peak structure, and the condensation promotion peak structure is used for:
when the secondary side refrigerant is converted from a liquid state to a gaseous state, promoting boiling of the secondary side refrigerant; and when the secondary side refrigerant is converted from the gaseous state to the liquid state, promoting condensation of the secondary side refrigerant.

17 . The liquid cooling cycle syst

Assignees

• Suzhou Metabrain Intelligent Technology Co Ltd

Inventors

• Zhu Huanlai
• Wu An
• Liu Guangzhi

Classifications

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20381

  Thermal management, e.g. evaporation control · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20318

  Condensers · CPC title