Dual reservoir immersive cooling system

Patent metadata

Field	Value
Publication number	US-12563696-B2
Application number	US-202318373539-A
Country	US
Kind code	B2
Filing date	Sep 27, 2023
Priority date	Apr 1, 2021
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

An immersive cooling system is described. The system includes an immersive cooling container, including: a first reservoir; a second reservoir; numerous slots, each configured to hold a casing; a reservoir connector corresponding to each slot, and configured to provide fluid communication with the first reservoir; and a pump configured to convey a dielectric immersion cooling liquid from the second reservoir to the first reservoir. The immersive cooling system also includes a casing, configured to contain an electronic device and to fit within a slot of the container. The casing includes an inlet configured to be in fluid communication with the reservoir connector of the slot within which the casing is disposed to facilitate flow of the cooling liquid into an interior of the casing through the reservoir connector and an outlet configured to facilitate flow of the cooling liquid from the interior of the casing into the second reservoir.

First claim

What is claimed is:

1 . An immersive cooling system configured to cool at least one electronic device, the immersive cooling system comprising:
an immersive cooling container, including:
a first reservoir, configured to contain a dielectric immersion cooling liquid;
a second reservoir, configured to contain the dielectric immersion cooling liquid;
a plurality of slots, each slot in the plurality of slots configured to hold a casing;
a reservoir connector corresponding to each slot in the plurality of slots, the reservoir connector configured to provide fluid communication with the first reservoir; and
a pump configured to convey the dielectric immersion cooling liquid from the second reservoir to the first reservoir; and
a casing, configured to contain an electronic device to be cooled in an interior portion of the casing and configured to be disposed within a slot in the plurality of slots of the immersive cooling container, the casing including:
an inlet configured to be in fluid communication with the reservoir connector corresponding to the slot within which the casing is disposed to facilitate flow of the dielectric immersion cooling liquid into the interior portion of the casing through the reservoir connector, such that the dielectric immersion cooling liquid contacts the electronic device to collect thermal energy from the electronic device; and
an outlet configured to facilitate flow of the dielectric immersion cooling liquid from the interior portion of the casing into the second reservoir,
wherein the second reservoir comprises a sealing chamber, the sealing chamber comprising a plurality of openings aligned with the plurality of slots, each opening enabling insertion of a casing in a corresponding one of the slots, each opening being in a closed configuration by default to prevent the dielectric immersion cooling liquid from flowing from the second reservoir to a corresponding slot in absence of a casing in said slot.

2 . The immersive cooling system of claim 1 , wherein the inlet comprises a casing connector configured to fluidly couple with the reservoir connector corresponding to the slot within which the casing is disposed.

3 . The immersive cooling system of claim 2 , wherein a size of the casing connector is smaller than a size of the reservoir connector, such that the casing connector fits within the corresponding reservoir connector.

4 . The immersive cooling system of claim 2 , wherein a size of the casing connector is larger than a size of the reservoir connector, such that the reservoir connector fits within the corresponding casing connector.

5 . The immersive cooling system of claim 2 , wherein the casing connector is disposed on a bottom portion of the casing.

6 . The immersive cooling system of claim 1 , wherein the reservoir connector corresponding to an empty slot is closed using a self-closing mechanism.

7 . The immersive cooling system of claim 1 , wherein the first reservoir is disposed below the casing, such that the dielectric immersion cooling liquid from the first reservoir flows upwards into the interior portion of the casing.

8 . The immersive cooling system of claim 7 , wherein the outlet is disposed in an upper portion of the casing, and wherein the second reservoir is disposed at an upper portion of the casing, to receive a flow of the dielectric immersion cooling liquid from the outlet.

Assignees

• OVH

Inventors

• Chehade Ali
• Bauchart Gregory Francis Louis

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title