Antenna assembly

US12562495B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12562495-B2
Application numberUS-202418659665-A
CountryUS
Kind codeB2
Filing dateMay 9, 2024
Priority dateSep 8, 2023
Publication dateFeb 24, 2026
Grant dateFeb 24, 2026

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An antenna assembly is provided. The antenna assembly includes a ceramic carrier having a first surface and a second surface, the second surface being opposite the first surface. The antenna assembly further includes an antenna pattern. The antenna pattern includes a first antenna portion positioned at least partially on the first surface of the ceramic carrier. The antenna pattern further includes a second antenna portion comprising a plurality of conductive vias extending through the ceramic carrier from the first antenna portion to the second surface of the ceramic carrier.

First claim

Opening claim text (preview).

What is claimed is: 1 . An antenna assembly, comprising: a ceramic carrier having a first surface and a second surface, the second surface being opposite the first surface; an antenna pattern, comprising: a first antenna portion positioned at least partially on the first surface of the ceramic carrier; and a second antenna portion comprising a plurality of conductive vias extending through the ceramic carrier from the first antenna portion to the second surface of the ceramic carrier; wherein the plurality of conductive vias is located along a first sidewall of the ceramic carrier, the first sidewall being greater in length than adjacent sidewalls of the ceramic carrier. 2 . The antenna assembly of claim 1 , wherein the plurality of conductive vias is positioned along a sidewall of the ceramic carrier, each conductive via of the plurality of conductive vias being located a distance from the sidewall. 3 . The antenna assembly of claim 1 , wherein the antenna pattern further comprises: a third antenna portion positioned on the second surface of the ceramic carrier, wherein the second antenna portion electrically couples the first antenna portion to the third antenna portion. 4 . The antenna assembly of claim 1 , wherein the antenna pattern further comprises: a fourth antenna portion positioned on the second surface of the ceramic carrier; and a fifth antenna portion positioned on the second surface of the ceramic carrier, wherein the second antenna portion electrically couples the first antenna portion to the fourth antenna portion, wherein the second antenna portion electrically couples the first antenna portion to the fifth antenna portion. 5 . The antenna assembly of claim 1 , wherein the antenna assembly comprises a GPS antenna. 6 . The antenna assembly of claim 5 , wherein the GPS antenna operates at an L1 frequency band. 7 . The antenna assembly of claim 6 , wherein the antenna assembly has a return loss in a range of about −12 dB to about −16 dB. 8 . The antenna assembly of claim 6 , wherein the antenna assembly has a band width in a range of about 80 MHz to about 85 MHz. 9 . The antenna assembly of claim 6 , wherein the antenna assembly has a radiation efficiency in a range of about −0.30 to about −0.40. 10 . The antenna assembly of claim 5 , wherein the GPS antenna operates at an L5 frequency band. 11 . The antenna assembly of claim 10 , wherein the antenna assembly has a return loss in a range of about −25 dB to about −30 dB. 12 . The antenna assembly of claim 10 , wherein the antenna assembly has a band width in a range of about 130 MHz to about 135 MHz. 13 . The antenna assembly of claim 10 , wherein the antenna assembly has a radiation efficiency in a range of about −0.20 to about −0.30. 14 . The antenna assembly of claim 1 , further comprising: a circuit board, wherein the circuit board is coupled to the second surface of the ceramic carrier. 15 . The antenna assembly of claim 1 , wherein the antenna assembly does not include a metal sidewall. 16 . A communication device, comprising: an antenna, comprising: a first antenna portion positioned at least partially on a first surface of a ceramic carrier; and a second antenna portion comprising a plurality of conductive vias extending through the ceramic carrier from the first antenna portion to a second surface of the ceramic carrier, wherein the second surface of the ceramic carrier is opposite the first surface of the ceramic carrier and the plurality of conductive vias is located along a first sidewall of the ceramic carrier, the first sidewall being greater in length than adjacent sidewalls of the ceramic carrier. 17 . The communication device of claim 16 , wherein the plurality of conductive vias is positioned along a sidewall of the ceramic carrier, each conductive via of the plurality of conductive vias being located a distance from the sidewall. 18 . The communication device of claim 16 , wherein the antenna further comprises: a third antenna portion positioned on the second surface of the ceramic carrier, wherein the second antenna portion electrically couples the first antenna portion to the third antenna portion. 19 . The communication device of claim 16 , wherein the antenna further comprises: a fourth antenna portion positioned on the second surface of the ceramic carrier; and a fifth antenna portion positioned on the second surface of the ceramic carrier, wherein the second antenna portion electrically couples the first antenna portion to the fourth antenna portion, wherein the second antenna portion electrically couples the first antenna portion to the fifth antenna portion.

Assignees

Inventors

Classifications

  • Horns fed by a slotted waveguide array (biconical horns H01Q13/06) · CPC title

  • with built-in antennas · CPC title

  • H01Q13/20Primary

    Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave · CPC title

  • H01Q1/38Primary

    formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

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Frequently asked questions

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What does patent US12562495B2 cover?
An antenna assembly is provided. The antenna assembly includes a ceramic carrier having a first surface and a second surface, the second surface being opposite the first surface. The antenna assembly further includes an antenna pattern. The antenna pattern includes a first antenna portion positioned at least partially on the first surface of the ceramic carrier. The antenna pattern further incl…
Who is the assignee on this patent?
Kyocera Avx Components San Diego Inc
What technology area does this patent fall under?
Primary CPC classification H01Q13/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 24 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).