Miniaturized long-term evolution antenna

Patent metadata

Field	Value
Publication number	US-12562490-B2
Application number	US-202418412815-A
Country	US
Kind code	B2
Filing date	Jan 15, 2024
Priority date	Jan 19, 2023
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

A miniaturized long-term evolution (LTE) antenna. In one embodiment, the antenna includes a dielectric substrate comprising a first surface and a second opposing surface; a first metallization layer disposed on the first surface of the dielectric substrate, the first metallization layer comprising a first metallization, a second metallization, a third metallization, and a fourth metallization; and a second metallization layer disposed on the second opposing surface of the dielectric substrate, the second metallization layer comprising a fifth metallization, a sixth metallization, a seventh metallization, an eighth metallization, and a ninth metallization. The antenna includes a plurality of through hole vias that: connect the first metallization with the fifth metallization; connect the second metallization with both the sixth metallization and the seventh metallization; and connect the fourth metallization with both the fifth metallization and the sixth metallization. System level implementations are also disclosed.

First claim

What is claimed is:

1 . An antenna for use in long-term evolution (LTE) frequency bands, comprising:
a dielectric substrate comprising a first surface and a second opposing surface; a first metallization layer disposed on the first surface of the dielectric substrate, the first metallization layer comprising a first discrete metallization, a second discrete metallization, a third discrete metallization, and a fourth discrete metallization; and a second metallization layer disposed on the second opposing surface of the dielectric substrate, the second metallization layer comprising a fifth discrete metallization, a sixth discrete metallization, a seventh discrete metallization, an eighth discrete metallization, and a ninth discrete metallization; wherein the antenna comprises a plurality of through hole vias that:
connect the first discrete metallization with the fifth discrete metallization;
connect the second discrete metallization with both the sixth discrete metallization and the seventh discrete metallization; and
connect the fourth discrete metallization with both the fifth discrete metallization and the sixth discrete metallization;
wherein the seventh discrete metallization, the eighth discrete metallization, and the ninth discrete metallization comprise external terminations for a system level printed circuit board; wherein the first discrete metallization comprises a generally rectangular shape; and wherein the second discrete metallization comprises a generally L-shaped metallization, the generally L-shaped metallization comprising two of the plurality of through hole vias, the two of the plurality of through hole vias being positioned at opposing ends of the generally L-shaped metallization.

2 . The antenna of claim 1 , wherein the second discrete metallization comprises both a choke point and a truncation feature.

3 . The antenna of claim 2 , wherein the truncation feature is positioned generally between the fifth discrete metallization and the sixth discrete metallization.

4 . An antenna for use in long-term evolution (LTE) frequency bands, comprising:
a dielectric substrate comprising a first surface and a second opposing surface; a first metallization layer disposed on the first surface of the dielectric substrate, the first metallization layer comprising a first discrete metallization, a second discrete metallization, a third discrete metallization, and a fourth discrete metallization; and a second metallization layer disposed on the second opposing surface of the dielectric substrate, the second metallization layer comprising a fifth discrete metallization, a sixth discrete metallization, a seventh discrete metallization, an eighth discrete metallization, and a ninth discrete metallization; wherein the antenna comprises a plurality of through hole vias that:
connect the first discrete metallization with the fifth discrete metallization;
connect the second discrete metallization with both the sixth discrete metallization and the seventh discrete metallization; and
connect the fourth discrete metallization with both the fifth discrete metallization and the sixth discrete metallization;
wherein the seventh discrete metallization, the eighth discrete metallization, and the ninth discrete metallization comprise external terminations for a system level printed circuit board; wherein the first discrete metallization comprises a generally rectangular shape; and wherein the fourth discrete metallization comprises a generally U-shaped metallization, the generally U-shaped metallization comprising an additional two of the plurality of through hole vias, the additional two of the plurality through hole vias being positioned at opposing ends of the generally U-shaped metallization.

5 . The antenna of claim 4 , wherein the fourth discrete metallization further comprises an angled contour as well as a staircasing feature.

6 . The antenna of claim 5 , wherein less than an entire portion of the angled contour overlaps the sixth discrete metallization.

7 . The antenna of claim 6 , wherein the staircasing feature is positioned generally between the eighth discrete metallization and the ninth discrete metallization.

8 . A system comprising:
an antenna for use in long-term evolution (LTE) frequency bands, comprising:
a dielectric substrate comprising a first surface and a second opposing surface;
a first metallization layer disposed on the first surface of the dielectric substrate, the first metallization layer comprising a first discrete metallization, a second discrete metallization, a third discrete metallization, and a fourth discrete metallization; and
a second metallization layer disposed on the second opposing surface of the dielectric substrate, the second metallization layer comprising a fifth discrete metallization, a sixth discrete metallization, a seventh discrete metallization, an eighth discrete metallization, and a ninth discrete metallization;
wherein the antenna comprises a plurality of through hole vias that:
connect the first discrete metallization with the fifth discrete metallization;
connect the second discrete metallization with both the sixth discrete metallization and the seventh discrete metallization; and
connect the fourth discrete metallization with both the fifth discrete metallization and the sixth discrete metallization; and

a system level printed circuit board upon which the antenna is disposed; wherein the seventh discrete metallization, the eighth discrete metallization, and the ninth discrete metallization comprise external terminations for the system level printed circuit board; wherein the seventh discrete metallization comprises a signal interface to a feed connection located on the system level printed circuit board; and the eighth discrete metallization comprises an interface to matching circuitry located on the system level printed circuit board.

9 . The system of claim 8 , wherein the matching circuitry comprises a switch that enables the antenna to switch between a plurality of operating frequencies for the antenna.

10 . The system of claim 8 , wherein the first discrete metallization comprises a generally rectangular shape.

11 . The system of claim 10 , wherein the second discrete metallization comprises a generally L-shaped metallization, the generally L-shaped metallization comprising two of the plurality of through hole vias, the two of the plurality of through hole vias being positioned at opposing ends of the generally L-shaped metallization.

12 . The system of claim 11 , wherein the fourth discrete metallization comprises a generally U-shaped metallization, the generally U-shaped metallization comprising an additional two of the plurality of through hole vias, the additional two of the plurality through hole vias being positioned at opposing ends of the generally U-shaped metallization.

13 . The system of claim 12 , wherein the fourth discrete metallization further comprises an angled contour as well as a staircasing feature.

14 . The system of claim 13 , wherein less than an entire portion of the angled contour overlaps the sixth discrete metallization.

15 . The system of claim 14 , wherein the staircasing feature is positioned generally between the eighth discrete metallization and the ninth discrete metallization.

Assignees

• Taoglas Group Holdings Ltd

Inventors

• Kelley Timothy Patrick

Classifications

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q9/42 Primary

  with folded element, the folded parts being spaced apart a small fraction of the operating wavelength · CPC title