Sensor and sensor manufacturing method

US12560496B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12560496-B2
Application numberUS-202318137889-A
CountryUS
Kind codeB2
Filing dateApr 21, 2023
Priority dateApr 28, 2022
Publication dateFeb 24, 2026
Grant dateFeb 24, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor includes: a sensor section including a conductive structure made up of a three-dimensionally continuous unit lattices, each including a plurality of columnar beams; and output connectors that output a resistance value of the sensor section, the resistance value changing at least when the conductive structure is compressed by an external force. A method for manufacturing a sensor includes forming the sensor section by stacking using a 3D printer. The sensor and method for manufacturing the sensor enable the adjustment of the repulsive force against compression to an input member and thus appropriately setting the change in resistance value against external force according to the device, in which the sensor is to be incorporated and the mode of use.

First claim

Opening claim text (preview).

What is claimed is: 1 . A sensor comprising: a sensor section including a conductive structure made up of a pattern of three-dimensionally continuous unit lattices, each unit lattice being conductive and including a plurality of columnar beams; and output connectors that output a resistance value of the sensor section, the resistance value changing at least when the conductive structure is compressed by an external force. 2 . The sensor according to claim 1 , wherein the conductive structure is adjacent to a non-conductive structure, in which the unit lattices are three-dimensionally continuous. 3 . The sensor according to claim 2 , wherein the non-conductive structure intervenes between two of the output connectors from an edge of the conductive structure toward an interior so that a distance of a conductive path between the two output connectors is longer than a distance of a conductive path without the non-conductive structure intervening. 4 . The sensor according to claim 3 , wherein the two output connectors are adjacent to each other on one face of the conductive structure with the non-conductive structure interposed therebetween. 5 . The sensor according to claim 1 , wherein each unit lattice includes the plurality of columnar beams, each radially extending from one point in the unit lattice toward a lattice point. 6 . The sensor according to claim 1 , wherein each unit lattice includes the plurality of columnar beams connecting adjacent lattice points to form a frame. 7 . A method for manufacturing the sensor according to claim 1 , comprising forming the sensor section by stacking using a 3D printer. 8 . The sensor according to claim 1 , wherein the sensor section has a cubic shape. 9 . The sensor according to claim 1 , wherein each unit lattice has a cubic shape. 10 . The sensor according to claim 1 , wherein the sensor section has a spherical shape. 11 . The sensor according to claim 1 , wherein the sensor section has a cylindrical shape. 12 . The sensor according to claim 1 , wherein the conductive structure is configured to deform in accordance with a magnitude of the external force. 13 . The sensor according to claim 1 , wherein the conductive structure has an elasticity to return to an original shape in response to the external force being removed. 14 . The sensor according to claim 1 , wherein the output connectors are arranged in gaps of the sensor section. 15 . The sensor according to claim 1 , wherein the output connectors are arranged on a lateral face of the sensor section, and wherein the external force is applied to a top surface of the sensor section. 16 . The sensor according to claim 1 , wherein the compression by the external force increases a contact area between the plurality of columnar beams. 17 . The sensor according to claim 16 , wherein the increase in contact area corresponds to an amount of the compression by the external force. 18 . The sensor according to claim 1 , further comprising a detection circuit configured to convert the resistance value to a corresponding digital signal. 19 . The sensor according to claim 1 , wherein the conductive structure is composed of thermoplastic polyurethane and a conductive filler. 20 . The sensor according to claim 1 , wherein the plurality of columnar beams comprises a set of one or more skeletal columnar beams and a set of one or more frame columnar beams.

Assignees

Inventors

Classifications

  • Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes · CPC title

  • using variations in ohmic resistance · CPC title

  • G01L1/20Primary

    by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids (of piezo-resistive materials G01L1/18); by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress · CPC title

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Frequently asked questions

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What does patent US12560496B2 cover?
A sensor includes: a sensor section including a conductive structure made up of a three-dimensionally continuous unit lattices, each including a plurality of columnar beams; and output connectors that output a resistance value of the sensor section, the resistance value changing at least when the conductive structure is compressed by an external force. A method for manufacturing a sensor includ…
Who is the assignee on this patent?
Mercari Inc, Univ Tokyo
What technology area does this patent fall under?
Primary CPC classification G01L1/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 24 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).