Radiation-enabled retention features for fixtureless assembly of node-based structures

Patent metadata

Field	Value
Publication number	US-12560191-B2
Application number	US-202318506969-A
Country	US
Kind code	B2
Filing date	Nov 10, 2023
Priority date	Jul 28, 2020
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

Retention features are provided for joining at least two structural components in a fixtureless assembly system. A first structure including a groove may be configured to contain at least one adhesive, and a second structure may include a tongue configured to contact the at least one adhesive to join the first and second structures. The first structure may also include at least one window that receives electromagnetic (EM) radiation from an EM radiation source into the groove. The at least one adhesive is configured to cure at a first rate upon exposure to one of time or heating, and the at least one adhesive is configured to cure at a second rate faster than the first rate upon exposure to the EM radiation.

First claim

What is claimed is:

1 . An apparatus, comprising:
a first structure comprising a first compartment, a second compartment and a window, wherein the first compartment comprises a first adhesive, and the second compartment comprises a second adhesive, wherein the second adhesive is not within the first compartment, wherein the second adhesive comprises an electromagnetic (EM) radiation-cured adhesive and is different from the first adhesive, and wherein the window is located on the first structure to allow EM radiation to cure the second adhesive; and a second structure comprising a second protrusion extending into the second compartment and contacting the second adhesive, and a first protrusion extending into the first compartment and contacting the first adhesive to join the second structure to the first structure.

2 . The apparatus of claim 1 , wherein the EM radiation comprises ultraviolet (UV) radiation.

3 . The apparatus of claim 1 , wherein the window comprises a screen.

4 . The apparatus of claim 1 , wherein the first adhesive cures at a first rate and the second adhesive cures at a second rate, wherein the first rate is different from the second rate.

5 . The apparatus of claim 4 , wherein the second rate is a faster curing rate than the first rate.

6 . The apparatus of claim 1 , wherein the first compartment comprises a plurality of adhesive compartments, and the first adhesive is contained within the plurality of the adhesive compartments.

7 . The apparatus of claim 6 , wherein the first protrusion comprises a plurality of tongues, wherein a first tongue of the plurality of tongues extends within a first adhesive compartment of the plurality of adhesive compartments and a second tongue of the plurality of tongues extends within a second adhesive compartment of the plurality of adhesive compartments.

8 . The apparatus of claim 1 , wherein the second protrusion comprises a tongue having one of a waffle shape, a fork shape, a comb shape, a loop shape, or a snake shape.

9 . The apparatus of claim 8 , wherein the tongue comprises a plurality of segments spaced apart from each other.

10 . The apparatus of claim 8 , wherein the tongue comprises one or more openings.

11 . The apparatus of claim 1 , wherein the second protrusion does not contact the first structure.

12 . The apparatus of claim 1 , wherein the first protrusion does not contact the first structure.

13 . The apparatus of claim 12 , wherein the second protrusion does not contact the first structure.

Assignees

• Divergent Tech Inc

Inventors

• Czinger Lukas Philip
• Burokas Vincent Arunas
• Gallagher Jason Vincent
• Okoli Chukwubuikem Marcel
• Miller Samuel Noah

Classifications

• B29C66/1122

  Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

• B29L2024/006

  multi-channelled · CPC title

• B29C65/4845

  Radiation curing adhesives, e.g. UV light curing adhesives · CPC title

• F16B11/006 Primary

  by gluing (gluing of plastics material B29C65/48) · CPC title