High-frequency dielectric heating adhesive sheet, joining method, and joined body

Patent metadata

Field	Value
Publication number	US-12559654-B2
Application number	US-202118012852-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Jun 30, 2020
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.

First claim

The invention claimed is:

1 . A high-frequency dielectric heating adhesive sheet comprising an adhesive layer that comprises:
a thermoplastic resin (A) comprising a reactive site (Y); a dielectric material that generates heat upon application of a high-frequency electric field; and a silane coupling agent (C), wherein the silane coupling agent (C) comprises a functional group (X) and an alkoxysilyl group (Z), wherein a main chain linking the functional group (X) with a silicon atom of the alkoxysilyl group (Z) comprises eight or more atoms, excluding atoms of side chains bonded to atoms forming the main chain and hydrogen atoms on the main chain.

2 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein a volume content ratio of the silane coupling agent (C) in the adhesive layer is in a range from 0.5 vol % to 25 vol %.

3 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein the functional group (X) is at least one group selected from the group consisting of an epoxy group, an amino group, an isocyanate group, and a mercapto group.

4 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein a molecular weight of the silane coupling agent (C) is 200 or more.

5 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein a difference ΔT between a 5%-weight-reduction temperature Td5 of the silane coupling agent (C) and a flow start temperature Tfs of the thermoplastic resin (A), represented by a numerical formula (Numerical Formula 1), is-20 degrees C. or more,
Δ T=Td 5− Tfs   (Numerical Formula 1).

6 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein the silane coupling agent (C) has a 5%-weight-reduction temperature of 120 degrees C. or more.

7 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein the reactive site (Y) comprises at least one selected from the group consisting of a carboxy group, a hydroxyl group, an amino group, an isocyanate group, and an acid anhydride structure.

8 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein the reactive site (Y) comprises a maleic anhydride structure.

9 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein the thermoplastic resin (A) is a polyolefin resin.

10 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein a volume content ratio of the dielectric material in the adhesive layer is in a range from 5 vol % to 50 vol %.

11 . The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein the dielectric material is a dielectric filler (B).

12 . The high-frequency dielectric heating adhesive sheet according to claim 11 , wherein the dielectric filler (B) comprises at least one selected from the group consisting of zinc oxide, silicon carbide, barium titanate, and titanium oxide.

13 . The high-frequency dielectric heating adhesive sheet according to claim 11 , wherein a volume average particle diameter of the dielectric filler (B) is in a range from 1 μm to 30 μm, and
the volume average particle diameter is a volume average particle diameter obtained by measuring a particle size distribution of the dielectric filler (B) by a laser diffraction/scattering method and performing calculation from a result of the particle size distribution measurement in accordance with JIS Z 8819-2:2001.

14 . A bonding method comprising:
providing the high-frequency dielectric heating adhesive sheet according to claim 1 between a first adherend and a second adherend; and applying a high-frequency electric field to the high-frequency dielectric heating adhesive sheet to bond the first adherend and the second adherend.

15 . A joined body comprising a first adherend, a second adherend, and the high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
at least one of the first adherend or the second adherend is an adherend made of glass, and the first adherend is bonded with the second adherend via the high-frequency dielectric heating adhesive sheet.

Assignees

• Lintec Corp

Inventors

• Tsuchibuchi Koji
• Taya Naoki

Classifications

• C08K2003/2296

  of zinc · CPC title

• C08K5/5415

  containing at least one Si—O bond · CPC title

• B32B2315/08

  Glass · CPC title

• B32B2310/14

  Corona, ionisation, electrical discharge, plasma treatment · CPC title

• B32B2307/54

  Yield strength; Tensile strength · CPC title