Multi-channel cooling pipeline integration apparatus, thermal management integration module and electric vehicle

US12558940B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12558940-B2
Application numberUS-202318463323-A
CountryUS
Kind codeB2
Filing dateSep 8, 2023
Priority dateJun 24, 2021
Publication dateFeb 24, 2026
Grant dateFeb 24, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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A multi-channel cooling pipeline integration apparatus, a thermal management integration module, and an electric vehicle are provided, which belong to the field of vehicle technologies. The multi-channel cooling pipeline integration apparatus is in a substantially rectangular plate shape, and has a plurality of cooling connection pipelines formed therein. A plurality of component mounting points and a plurality of component connection ports are disposed on a surface of the multi-channel cooling pipeline integration apparatus. The plurality of component mounting points is configured to have at least two thermal management components mounted thereon. Each of the plurality of component connection ports is in communication with a corresponding one of the plurality of cooling connection pipelines, to enable the at least two thermal management components to be connected to the plurality of cooling connection pipelines. The at least two thermal management components are configured to be connected to each other.

First claim

Opening claim text (preview).

What is claimed is: 1 . A multi-channel cooling pipeline integration apparatus, being in a substantially rectangular plate shape, and having a plurality of cooling connection pipelines formed therein, a plurality of component mounting points and a plurality of component connection ports being disposed on a surface of the multi-channel cooling pipeline integration apparatus, wherein: the plurality of component mounting points is configured to have at least two thermal management components mounted thereon; and each of the plurality of component connection ports is in communication with a corresponding one of the plurality of cooling connection pipelines, to enable the at least two thermal management components mounted on the plurality of component mounting points to be connected, through the plurality of component connection ports, to the plurality of cooling connection pipelines, and the at least two thermal management components are configured to be connected to each other through the plurality of cooling connection pipelines, wherein multi-channel cooling pipeline integration apparatus comprises a main body portion, a first cover plate portion, and a second cover plate portion, wherein: the main body portion, the first cover plate portion, and the second cover plate portion are assembled together sequentially in a thickness direction of the multi-channel cooling pipeline integration apparatus; a first group of cooling connection pipelines are provided on the main body portion and have an opening towards the first cover plate portion; the first cover plate portion seals the first group of cooling connection pipelines, and a second group of cooling connection pipelines are provided on the first cover plate portion and have an opening towards the second cover plate portion; and the second cover plate portion seals the second group of cooling connection pipelines. 2 . The multi-channel cooling pipeline integration apparatus according to claim 1 , wherein the plurality of component mounting points comprises at least two of an expansion tank mounting point, a multi-port valve mounting point, a water pump mounting point, a heat exchanger mounting point, a condenser mounting point, a temperature sensor mounting point, or a two-port proportional valve mounting point. 3 . The multi-channel cooling pipeline integration apparatus according to claim 2 , wherein: when the plurality of component mounting points comprises a plurality of water pump mounting points, the plurality of water pump mounting points is disposed on a side of an end of the multi-channel cooling pipeline integration apparatus in a length direction, and a position distribution of the plurality of water pump mounting points enables at least two water pumps to be mounted, via the plurality of water pump mounting points, on the same side of the end of the multi-channel cooling pipeline integration apparatus in the length direction and to be arranged in a width direction of the multi-channel cooling pipeline integration apparatus; and when the plurality of component mounting points further comprises the expansion tank mounting point, the expansion tank mounting point is disposed on the other side of the end of the multi-channel cooling pipeline integration apparatus at which the water pump mounting point is located, to enable an expansion tank to be mounted at a position on a side of the multi-channel cooling pipeline integration apparatus opposite to the water pump. 4 . The multi-channel cooling pipeline integration apparatus according to claim 2 , wherein when the plurality of component mounting points further comprises the multi-port valve mounting point, the multi-port valve mounting point is disposed on a middle portion of a side of the multi-channel cooling pipeline integration apparatus, to enable a multi-port valve to be mounted on the middle portion of the side of the multi-channel cooling pipeline integration apparatus. 5 . The multi-channel cooling pipeline integration apparatus according to claim 4 , wherein when the plurality of component mounting points further comprises the heat exchanger mounting point, the heat exchanger mounting point is disposed on the same side of the multi-channel cooling pipeline integration apparatus as the multi-port valve mounting point, and a position distribution of the heat exchanger mounting point enables a heat exchanger to be mounted at a position on the same side of the multi-channel cooling pipeline integration apparatus as the multi-port valve and close to the multi-port valve. 6 . The multi-channel cooling pipeline integration apparatus according to claim 5 , wherein when the plurality of component mounting points further comprises the condenser mounting point, the condenser mounting point is disposed at an end of the multi-channel cooling pipeline integration apparatus in a length direction, on the same side as the heat exchanger mounting point, and a position distribution of the condenser mounting point enables a condenser to be mounted at a position on the same side of the multi-channel cooling pipeline integration apparatus as the heat exchanger and adjacent to the heat exchanger. 7 . The multi-channel cooling pipeline integration apparatus according to claim 1 , wherein the multi-channel cooling pipeline integration apparatus has a plurality of cooling pipeline external ports, each of the plurality of cooling pipeline external ports is configured to be connected to a cooling liquid connection pipeline of a thermal management object of a vehicle, and positions of the plurality of cooling pipeline external ports are arranged based on an arrangement position of the thermal management object to enable the cooling liquid connection pipeline of the thermal management object to be the shortest. 8 . The multi-channel cooling pipeline integration apparatus according to claim 7 , wherein: the plurality of cooling pipeline external ports comprises a radiator liquid-inlet port, a radiator liquid-outlet port, a Direct Current-Direct Current (DC-DC) converter liquid-inlet port, a high pressure liquid heater liquid-inlet port, a high pressure liquid heater liquid-outlet port, an on-vehicle charger liquid-outlet port, a battery pack liquid-inlet port, and a battery pack liquid-outlet port; the radiator liquid-inlet port, the radiator liquid-outlet port, and the DC-DC converter liquid-inlet port are located at an end of the multi-channel cooling pipeline integration apparatus in a length direction, and the radiator liquid-inlet port and the radiator liquid-outlet port protrude towards a side of the multi-channel cooling pipeline integration apparatus; and the high pressure liquid heater liquid-inlet port, the on-vehicle charger liquid-outlet port, the battery pack liquid-outlet port, the high pressure liquid heater liquid-outlet port, and the battery pack liquid-inlet port are located at the other end of the multi-channel cooling pipeline integration apparatus in the length direction, are arranged in a width direction of the multi-channel cooling pipeline integration apparatus sequentially, and each have a protrusion direction identical to a protrusion direction of the radiator liquid-inlet port. 9 . The multi-channel cooling pipeline integration apparatus according to claim 1 , wherein a plurality of mounting lugs is further provided on the multi-channel cooling pipeline integration apparatus, each of the plurality of mounting lugs protrudes outwards from an edge of the multi-channel cooling pipeline integration apparatus, and a through hole is defined on each of the plurality of mounting lugs and is configured to cooperate with a fastener, to mount the multi-channel cooling pipeline integration apparatus to a body of a vehicle.

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What does patent US12558940B2 cover?
A multi-channel cooling pipeline integration apparatus, a thermal management integration module, and an electric vehicle are provided, which belong to the field of vehicle technologies. The multi-channel cooling pipeline integration apparatus is in a substantially rectangular plate shape, and has a plurality of cooling connection pipelines formed therein. A plurality of component mounting point…
Who is the assignee on this patent?
Geely Holding Group Co Ltd, Ningbo Geely Automobile Res & Development Co Ltd
What technology area does this patent fall under?
Primary CPC classification B60H1/00899. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 24 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).