Light-emitting device, manufacturing method thereof and display module using the same
US-11641010-B2 · May 2, 2023 · US
US12557703B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12557703-B2 |
| Application number | US-202318135032-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 14, 2023 |
| Priority date | Apr 29, 2022 |
| Publication date | Feb 17, 2026 |
| Grant date | Feb 17, 2026 |
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An illuminator comprises a substrate, a plurality of connecting pads, a plurality of LEDs, and a plurality of adhesive blocks. The plurality of connecting pads is on the substrate, each of the connecting pads defines a first well. Each of the plurality of LEDs is on one of the plurality of connecting pads. Each of the plurality of adhesive blocks bonds one of the plurality of LEDs and one of the plurality of connecting pads. Each of the plurality of adhesive blocks at least partially covers the first well of the corresponding one of the plurality of connecting pads, enabling light to shine on the each of plurality of adhesive blocks from a side of the substrate away from the plurality of connecting pads. An illuminator repairing device and an illuminator repairing method are also disclosed.
Opening claim text (preview).
What is claimed is: 1 . An illuminator comprising: a substrate; a plurality of connecting pads on the substrate, each of the plurality of connecting pads comprising a first well; a plurality of light emitting diodes (LEDs), each of the plurality of LEDs being on a corresponding one of the plurality of connecting pads; and a plurality of adhesive blocks, each of the plurality of adhesive blocks bonding a corresponding one of the plurality of LEDs and the corresponding one of the plurality of connecting pads; wherein each of the plurality of adhesive blocks at least partially covers the first well of the corresponding one of the plurality of connecting pads, wherein the substrate comprises a plurality of second wells, and each of the plurality of second wells penetrates the substrate and communicates with a corresponding one of the plurality of first wells; a side of the substrate is configured to receive irradiating laser light; in response to the irradiating laser light penetrating though the substrate, each of the plurality of adhesive blocks is molten by the irradiating laser light, and the corresponding LED is released from the corresponding connecting pad. 2 . The illuminator of claim 1 , wherein the substrate is made of a transparent material. 3 . The illuminator of claim 1 , wherein the substrate comprises a plurality of wires, and each of the plurality of wires is electrically connected to a corresponding one of the plurality of connecting pads for transmitting an electrical signal to the corresponding LED. 4 . The illuminator of claim 1 , wherein a melting point of the plurality of adhesive blocks is lower than a melting point of the substrate and a melting point of the plurality of connecting pads. 5 . The illuminator of claim 1 , wherein each of the plurality of adhesive blocks is made of silver glue, tin paste, epoxy resin, indium tin oxide, or allotropic conductive adhesive. 6 . The illuminator of claim 1 , wherein each of the plurality of adhesive blocks fills the first well of the corresponding one of the plurality of connecting pads and is in contact with a sidewall of a corresponding one of the plurality of second wells formed in the substrate. 7 . An illuminator comprising: a substrate; a plurality of connecting pads on the substrate, each of the plurality of connecting pads having a first well; a plurality of light emitting diodes (LEDs), each of the plurality of LEDs being on a corresponding one of the plurality of connecting pads; and a plurality of adhesive blocks, each of the plurality of adhesive blocks bonding a corresponding one of the plurality of LEDs and the corresponding one of the plurality of connecting pads; wherein each of the plurality of adhesive blocks at least partially covers the first well of the corresponding one of the plurality of connecting pads; a side of the substrate is configured to receive irradiating laser light; in response to the irradiating laser light penetrating though the substrate, each of the plurality of adhesive blocks is molten by the irradiating laser light, and the corresponding LED is released from the corresponding connecting pad; wherein each of the plurality of LEDs is a vertical LED having a first electrode positioned near the substrate and a second electrode positioned away from the substrate, the substrate comprises a plurality of wires, and each of the plurality of wires is electrically connected to the first electrode of the corresponding LED by a corresponding one of the plurality of connecting pads and a corresponding one of the plurality of adhesive blocks. 8 . The illuminator of claim 7 , wherein the substrate is made of a transparent material. 9 . The illuminator of claim 7 , wherein a melting point of the plurality of adhesive blocks is lower than each of a melting point of the substrate and a melting point of the plurality of connecting pads. 10 . The illuminator of claim 7 , wherein each of the plurality of adhesive blocks is made of silver glue, tin paste, epoxy resin, indium tin oxide, or allotropic conductive adhesive. 11 . The illuminator of claim 7 , wherein each of the plurality of adhesive blocks fills the first well of the corresponding one of the plurality of connecting pads and is in contact with a surface of the substrate on which the plurality of connecting pads is arranged. 12 . The illuminator of claim 7 , wherein the substrate further comprises a plurality of second wells, and each of the plurality of second wells penetrates the substrate and communicates with a corresponding one of the plurality of first wells. 13 . The illuminator of claim 12 , wherein each of the plurality of adhesive blocks fills the first well of the corresponding one of the plurality of connecting pads and is in contact with a sidewall of a corresponding one of the plurality of second wells formed in the substrate. 14 . An illuminator comprising: a substrate; a plurality of connecting pads on the substrate, each of the plurality of connecting pads having a first well; a plurality of light emitting diodes (LEDs), wherein each of the plurality of LEDs is on a corresponding one of the plurality of connecting pads; and a plurality of adhesive blocks, each of the plurality of adhesive blocks bonding a corresponding one of the plurality of LEDs and the corresponding one of the plurality of connecting pads; wherein each of the plurality of adhesive blocks at least partially covers the first well of the corresponding one of the plurality of connecting pads; a side of the substrate is configured to receive irradiating laser light; in response to the irradiating laser light penetrating though the substrate, each of the plurality of adhesive blocks is molten by the irradiating laser light, and the corresponding LED is released from the corresponding connecting pad; wherein each of the plurality of LEDs is a front-mounted LED having a first electrode and a second electrode both positioned away from the substrate, the illuminator further comprises a wire layer on the plurality of LEDs, and the wire layer is electrically coupled to the first electrode and the second electrode of each of the plurality of LEDs. 15 . The illuminator of claim 14 , wherein the substrate is made of a transparent material. 16 . The illuminator of claim 14 , wherein a melting point of the plurality of adhesive blocks is lower than each of a melting point of the substrate and a melting point of the plurality of connecting pads. 17 . The illuminator of claim 14 , wherein each of the plurality of adhesive blocks is made of silver glue, tin paste, epoxy resin, indium tin oxide, or allotropic conductive adhesive. 18 . The illuminator of claim 14 , wherein each of the plurality of adhesive blocks fills the first well of the corresponding one of the plurality of connecting pads and is in contact with a surface of the substrate on which the plurality of connecting pads is arranged. 19 . The illuminator of claim 14 , wherein the substrate comprises a plurality of second wells, each of the plurality of second wells penetrates the substrate and communicates with a corresponding one of the plurality of first wells. 20 . The illuminator of claim 19 , wherein each of the plurality of adhesive blocks fills the first well of the corresponding one of the plurality of connecting pads and is in contact with a sidewall of a corresponding one of the plurality of second wells formed in the substrate.
of coatings · CPC title
Bonding of wafers · CPC title
Package configurations · CPC title
Coatings, e.g. passivation layers or antireflective coatings · CPC title
Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title
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