Display substrate and manufacturing method therefor, and display device

Patent metadata

Field	Value
Publication number	US-12557485-B2
Application number	US-202117800902-A
Country	US
Kind code	B2
Filing date	Oct 13, 2021
Priority date	Nov 27, 2020
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A display substrate and a manufacturing method therefor, and a display device. The display substrate comprises a plurality of island areas that are spaced apart from each other, a plurality of hole areas, and bridge areas for connecting adjacent island areas. The island areas or/and the bridge areas comprise an edge area adjacent to the hole area; the edge area comprises a composite structure layer provided on a base substrate; a stepped structure is formed at a side surface of the composite structure layer facing the hole areas; the edge area further comprises an inorganic encapsulation layer disposed on the composite structure layer and the stepped structure.

First claim

The invention claimed is:

1 . A display substrate, comprising a plurality of island areas spaced apart from each other, a plurality of hole areas, and bridge areas for connecting adjacent island areas, wherein
the hole area comprises one or more openings penetrating the display substrate; the island area comprises an edge area adjacent to the hole area; the edge area comprises a composite structure layer disposed on a base substrate, a stepped structure is formed at a side surface of the composite structure layer towards the hole areas, the height of steps in the stepped structure gradually decreases along a direction towards the hole area, a first step with the lowest height in the stepped structure comprises the base substrate, and a side surface of the first step towards the hole area is a first step side surface; and the edge area further comprises an inorganic encapsulation layer disposed on the composite structure layer and disposed on the stepped structure, wherein an edge of the inorganic encapsulation layer is located on the first step side surface, and the inorganic encapsulation layer exposes at least a partial area of the first step side surface; wherein the first step side surface comprises a first plane and a second plane intersecting each other and being adjacent to the hole area, and a convex edge protruding towards the hole area is formed at the intersection of the first plane and the second plane adjacent to the hole area.

2 . The display substrate according to claim 1 , wherein the edge of the inorganic encapsulation layer is located on an area of the side surface of the first step corresponding to the base substrate.

3 . The display substrate according to claim 1 , wherein the composite structure layer of the edge area comprises an inorganic composite insulation layer disposed on the base substrate and an organic composite layer disposed on the inorganic composite insulation layer, and the stepped structure comprises at least one step formed on the inorganic composite insulation layer and at least one step formed on the organic composite layer.

4 . The display substrate according to claim 3 , wherein the inorganic composite insulation layer comprises a first insulation layer, a second insulation layer, a third insulation layer and a fourth insulation layer which are sequentially stacked on the base substrate; the organic composite layer comprises a first organic insulation layer and a second organic insulation layer which are sequentially stacked on the fourth insulation layer.

5 . The display substrate according to claim 4 , wherein the stepped structure comprises the first step formed by the first insulation layer and the base substrate, a second step formed by the second insulation layer, the third insulation layer and the fourth insulation layer, a third step formed by the first organic insulation layer, and a fourth step formed by the second organic insulation layer; or
the stepped structure comprises the first step formed by the base substrate and the inorganic composite insulation layer, a second step formed by the first organic insulation layer, and a third step formed by the second organic insulation layer.

6 . The display substrate according to claim 4 , wherein the first organic insulation layer is located at same layer and made of same material as a planarization layer of the island area, and the second organic insulation layer is located at same layer and made of same material as a pixel definition layer of the island area.

7 . A display device comprising the display substrate according to claim 1 .

8 . A manufacturing method for a display substrate, wherein the display substrate comprises a plurality of island areas spaced apart from each other, a plurality of hole areas, and bridge areas for connecting adjacent island areas, the hole area comprises one or more openings penetrating the display substrate, the manufacturing method comprising:
forming a base substrate of the display substrate on a hard carrier plate; forming a composite structure layer on the base substrate of an edge area of the island area adjacent to the hole area, wherein a stepped structure is formed at a side surface of the composite structure layer towards the hole areas, the height of steps in the stepped structure gradually decreases along a direction towards the hole area, a first step with the lowest height in the stepped structure comprises the base substrate, and a side surface of the first step towards the hole area is a first step side surface; forming an inorganic encapsulation thin film in the edge area and on a surface of the hard carrier plate exposed by the hole area, wherein the inorganic encapsulation thin film is disposed on the composite structure layer and on the stepped structure; removing the inorganic encapsulation thin film at an intersection position where the first step side surface intersects a surface of the hard carrier plate exposed by the hole area, or removing the inorganic encapsulation thin film on the first step side surface close to the intersection position to disconnect the inorganic encapsulation thin film of the edge area from the inorganic encapsulation thin film on the hard carrier plate, wherein the intersection position refers to an intersection position of the first step side surface and the surface of the hard carrier plate exposed by the hole area; and striping off the hard carrier plate from the base substrate to obtain the display substrate, wherein the inorganic encapsulation thin film in the edge area of the display substrate is an inorganic encapsulation layer, an edge of the inorganic encapsulation layer is located on the first step side surface, and the inorganic encapsulation layer exposes at least a partial area of the first step side surface; wherein the first step side surface comprises a first plane and a second plane intersecting each other and being adjacent to the hole area, and a convex edge protruding towards the hole area is formed at the intersection of the first plane and the second plane adjacent to the hole area.

9 . The manufacturing method for a display substrate according to claim 8 , wherein removing the inorganic encapsulation thin film at an intersection position where the first step side surface intersects the surface of the hard carrier plate exposed by the hole area comprises removing the inorganic encapsulation thin film at a circumferential edge area or the entire area of the surface of the hard carrier plate exposed by the hole area.

10 . The manufacturing method for a display substrate according to claim 8 , wherein the inorganic encapsulation thin film in the circumferential edge area of the surface of the hard carrier plate exposed by the hole area is partially removed in a thickness direction, while removing the inorganic encapsulation thin film on the first step side surface close to an intersection position.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Tian Hongwei
• Niu Yanan
• Liu Ming
• Li Ran
• Wang Jing
• Liu Zheng

Classifications

• H10K50/844

  Encapsulations · CPC title

• H10K77/111 Primary

  Flexible substrates · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/35

  comprising red-green-blue [RGB] subpixels · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title