Solid state optoelectronic device with plated support substrate

Patent metadata

Field	Value
Publication number	US-12557434-B2
Application number	US-201916597462-A
Country	US
Kind code	B2
Filing date	Oct 9, 2019
Priority date	Mar 22, 2011
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A vertical solid state lighting (SSL) device is disclosed. In one embodiment, the SSL device includes a light emitting structure formed on a growth substrate. Individual SSL devices can include a embedded contact formed on the light emitting structure and a metal substrate plated at a side at least proximate to the embedded contact. The plated substrate has a sufficient thickness to support the light emitting structure without bowing.

First claim

We claim:

1 . A solid state lighting device, comprising:
a light emitting structure having a first side, a second side opposite the first side, and angled sidewalls between the first side and the second side, the light emitting structure comprising a first semiconductor material on the first side, a second semiconductor material on the second side, and an active region between the first and second semiconductor materials, an embedded contact layer at the second side having a first thickness; and a thick metal backside support member formed on the embedded contact layer and having a second thickness, wherein the thick metal backside support member includes a plurality of projecting regions, each of the plurality of projecting regions extending alongside a corresponding one of the angled sidewalls of the light emitting structure and extending past an interface between the second semiconductor material and the active region,
wherein the second thickness is larger than the first thickness.

2 . The solid state lighting device of claim 1 wherein the light emitting structure is an organic light emitting structure.

3 . The solid state lighting device of claim 1 , further comprising a barrier material between the thick metal backside support and the embedded contact layer.

4 . The solid state lighting device of claim 1 , further comprising a plurality of exterior contacts formed on the first side of the light emitting structure.

5 . The solid state lighting device of claim 1 wherein the second thickness of the thick metal backside support member is about 50-300 μm.

6 . The solid state lighting device of claim 1 wherein the second thickness of the thick metal backside support member is about 100-150 μm.

7 . The solid state lighting device of claim 1 wherein the thick metal backside support comprises a copper alloy.

8 . The solid state lighting device of claim 1 wherein the embedded contact layer is configured to be reflective.

9 . The solid state lighting device of claim 1 wherein the embedded contact layer is silver (Ag).

10 . The solid state lighting device of claim 1 wherein:
the first semiconductor material comprises a p-type gallium nitride (“p-GaN”) material;
the second semiconductor material comprises a n-type gallium nitride (“n-GaN”) material; and
the active region comprises an indium gallium nitride (“InGaN”) material.

Assignees

• Micron Technology Inc

Inventors

• Odnoblyudov Vladimir
• Schellhammer Scott D

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10H20/8312

  extending at least partially through the bodies · CPC title