Headband and a method for producing the headband

Patent metadata

Field	Value
Publication number	US-12556865-B2
Application number	US-202218047540-A
Country	US
Kind code	B2
Filing date	Oct 18, 2022
Priority date	Dec 28, 2020
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A headband for a headset and a method for producing the headband for the headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a rubber suspension formed by overmolding. The method comprising the steps of providing the carrier, arranging the carrier in an injection molding tool, and forming the suspension from a rubber material by overmolding such that the suspension forms at least two attachment points to the carrier.

First claim

The invention claimed is:

1 . A headband for a headset, the headband being configured to carry at least one earcup of the headset, the headband comprising:
a carrier curved to conform to any wearer's head; and a suspension,
wherein the suspension is formed from a rubber material by overmolding, and the suspension is attached to the carrier at at least two attachment points formed at a first suspension end and a second suspension end,
wherein the suspension forms a head pad that extends between the first suspension end and the second suspension end and is configured to rest at and abut the wearer's head at a top portion when the headband is in use,
wherein further the head pad is formed by overmolding simultaneous with the suspension, and

wherein the two attachment points are arranged at an equally spaced distance from a midpoint of the carrier.

2 . A headband for a headset according to claim 1 , wherein the carrier and the suspension contribute to a clamping force of the headband.

3 . A headband for a headset according to claim 1 , wherein the suspension comprises:
a first rubber material part; and a second rubber material part, wherein
the first rubber material part forming the attachment points,
the second rubber material part being spaced from the first rubber material part,
the second rubber material part being configured to rest on the wearer's head, and
the first rubber material part is configured to hover over the second rubber material part and the wearer's head.

4 . A headband for a headset according to claim 3 , wherein the headband further comprises at least one telescopic extension slideably arranged onto one end of the headband.

5 . A headband for a headset according to claim 4 , wherein the at least one telescopic extension is arranged onto the headband by means of a hook.

6 . A headband according to claim 3 , wherein the second rubber material part has a concave shape seen in cross-section facing towards the first rubber part.

7 . A headband for a headset according to claim 1 , further comprising:
a headphone unit; and an electrical cable attached to the carrier,
wherein the electrical cable is configured for electrically connecting the headphone unit and the earcup.

8 . A headband for a headset according to claim 1 , wherein the carrier is a metal carrier formed in a bended shape.

Assignees

• Gn Audio As

Inventors

• Lin Frank
• Huang Seven
• Lin Alice
• Madsen Jon Grane
• Zeng Bill

Classifications

• H04R5/033

  Headphones for stereophonic communication {(details thereof, e.g. relating to batteries, cables or control elements H04R1/10)} · CPC title

• H04R1/105 Primary

  Earpiece supports, e.g. ear hooks (for stereophonic headphones H04R5/0335) · CPC title

• H04R1/1008

  Earpieces of the supra-aural or circum-aural type · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R1/1058

  Manufacture or assembly · CPC title