Earphone

Patent metadata

Field	Value
Publication number	US-12556846-B2
Application number	US-202318304380-A
Country	US
Kind code	B2
Filing date	Apr 21, 2023
Priority date	Oct 11, 2022
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

An embodiment of the present disclosure provides an earphone, which includes a housing with a cavity, a first speaker housed in the cavity for producing low-frequency sounds, a second speaker for producing mid to high frequency sounds, and a sound damping mesh. The housing includes a sound outlet penetrating therethrough, and the cavity is connected with the outside through the sound outlet. The second speaker is fixed to the sound damping mesh. The sound damping mesh completely separates the first speaker from the second speaker. The low-frequency sound emitted by the first speaker is transmitted to the sound outlet through the sound damping mesh.

First claim

What is claimed is:

1 . An earphone, including:
a housing having a cavity, and a sound outlet penetrating therethrough, for communicating the cavity with an outside; a first speaker housed in the cavity for producing low frequency sounds; a second speaker located between the first speaker and the sound outlet for producing mid to high frequency sounds; a sound damping mesh locating between the first speaker and the second speaker, and being fixed to the second speaker; wherein the sound damping mesh completely separates the first speaker from the second speaker so that the low-frequency sounds emitted by the first speaker are transmitted to the sound outlet through the sound damping mesh, and at the same time, the sound damping mesh blocks the mid-high frequency sounds generated by the second speaker from passing through for achieving filtering reduction, wherein the sound damping mesh includes a fixed frame and an impedance mesh attached to the fixed frame; the fixed frame is fixed on the housing, and the fixed frame includes a plurality of air leaking holes; the impedance mesh completely covers the air leaking holes; the second speaker is fixed to the sound damping mesh; the second speaker and the sound damping mesh together divide the cavity into a front cavity and a rear cavity; the front cavity is connected with the outside through the sound outlet, the second speaker is at least partially contained within the front cavity; the first speaker is accommodated in the rear cavity, and is spaced apart from the sound damping mesh.

2 . The earphone as described in claim 1 , wherein, the impedance mesh is set on a side of the fixed frame close to the sound outlet, or the impedance mesh is set on a side of the fixed frame away from the sound outlet.

3 . The earphone as described in claim 2 , wherein, the impedance mesh is set on the side of the fixed frame close to the sound outlet, and the second speaker is fixed on the side of the impedance mesh close to the sound outlet.

4 . The earphone as described in claim 2 , wherein, the sound damping mesh is provided with a mounting hole penetrating therethrough, the second speaker matches the mounting hole; the second speaker at least partially passes through the mounting hole and forms an integral structure with the sound damping mesh.

5 . The earphone as described in claim 4 , wherein, the impedance mesh is set on the side of the fixed frame close to the sound outlet.

6 . The earphone as described in claim 1 , wherein the fixed frame is integrally formed with the housing.

7 . The earphone as described in claim 1 , wherein, the second speaker is a MEMS piezo speaker, and the first speaker includes a movable coil.

Assignees

• Aac Kaitai Tech Wuhan Co Ltd

Inventors

• Shen Yu
• Zhou Yiwei
• Dan qiang
• Li Yang

Classifications

• H04R1/10

  Earpieces; Attachments therefor {; Earphones; Monophonic headphones (H04R1/28 takes precedence; stereophonic headphones H04R5/033)} · CPC title

• H04R1/28

  Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns H04R1/30)} · CPC title

• H04R17/00

  Piezoelectric transducers; Electrostrictive transducers (piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners {H10N30/00}) · CPC title

• H04R1/288

  for loudspeaker transducers · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title