Differential pumping apparatus and focused charged particle beam system

Patent metadata

Field	Value
Publication number	US-12555739-B2
Application number	US-202117923203-A
Country	US
Kind code	B2
Filing date	May 31, 2021
Priority date	Jun 29, 2020
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A differential pumping apparatus for creating a high vacuum inside a processing space includes a displacement drive unit configured to move a substrate to be processed or a head, to adjust parallelism and distance between a surface to be processed and a surface of the head. Gap measurement devices are placed at three or more locations along the periphery of the surface of the head to provide distance information. A gap control unit is configured to control the displacement drive unit in response to the distance information between the surface to be processed and the surface adapted to face the surface to be processed, so that the surface to be processed and the surface adapted to face the surface to be processed are parallel.

First claim

What is claimed is:

1 . A differential pumping apparatus, comprising:
a head movable relative to a surface to be processed of a substrate to be processed to face any area on the surface to be processed, the head having closed-loop grooves ( 10 A, 10 B, 10 C, 10 D) in its surface adapted to face the surface to be processed, each of the closed-loop grooves surrounding the center of the surface adapted to face the surface to be processed, the closed-loop grooves including an innermost closed loop-groove ( 10 A) and other closed-loop grooves ( 10 B, 10 C, 10 D), the head having, within the area surrounded by the innermost closed-loop groove ( 10 A), an aperture defining a space for conducting processing of the surface to be processed, the innermost closed-loop groove ( 10 A) being connectable to a deposition gas supply to deliver a deposition gas to the space for conducting processing of the surface to be processed, the closed-loop grooves including at least one closed-loop groove, selected from the other closed-loop grooves ( 10 B, 10 C, 10 D), to which a vacuum pump is connectable to suck air from the one closed-loop groove to create high vacuum within the space under the condition that the surface of the head faces the surface to be processed; a displacement drive unit configured to move the head or the surface to be processed to adjustably control the parallelism and distance between the surface to be processed and the surface of the head; gap measurement devices placed at least three locations along the periphery of the surface of the head, each of the gap measurement devices being configured to detect the distance between the surface of the head and the surface to be processed and to provide the distance information, and a gap control unit configured to control the displacement drive unit in response to the distance information measured by each of the gap measurement devices so that the surface of the head and the surface to be processed will be parallel to each other with a predetermined distance kept therebetween.

2 . The differential pumping apparatus according to claim 1 , wherein
each of the gap measurement devices detects pressure in the space from the gap measurement device to the surface to be processed and provides the pressure information, and the gap control unit controls the displacement drive unit in response to the pressure information.

3 . The differential pumping apparatus according to claim 1 , wherein the substrate to be processed has the boundary that is defined by a rectangle having its length and width lying along the X-axis and Y-axis,
the head and the substrate to be processed are movable relative to each other along the X-axis and Y-axis; the gap measurement devices are placed at four (4) locations outside the outermost closed-loop groove of the closed-loop grooves, and the gap measurement devices placed at the four locations consists of two pairs of gap measurement devices, the gap measurement devices of one of the two pairs are lined up in a row along the X-axis and separated from the center of the aperture by the same distance in opposite directions, the gap measurement devices of the other pair are lined up in a row along the Y-axis and separated from the center of the aperture by the same distance in the opposite directions.

4 . The differential pumping apparatus according to claim 1 , wherein
each of the gap measurement units is composed of a laser displacement sensor; and the laser displacement sensor is set back from the surface of the head in a direction away from the surface to be processed to keep a distance to the surface to be processed in the high-precision measurement range in which the laser displacement sensor can work to provide measurements with good accuracy and good precision.

5 . The differential pumping apparatus according to claim 1 , wherein
there is an optical microscope configured to detect an alignment mark on the substrate to be processed.

6 . The differential pumping apparatus according to claim 1 , wherein
there is an observation microscope, which is installed near the head with an offset-distance, configured to observe the area to be processed on the substrate to be processed.

7 . The differential pumping apparatus according to claim 1 , wherein
the outermost closed-loop groove among the closed-loop grooves is connected to a pump for supplying inert gas, and the inert gas is blown through the outermost closed-loop groove to the substrate to be processed to create a curtain of inert gas.

8 . The differential pumping apparatus according to claim 1 , wherein
surrounding the entire periphery of the surface of the head, a gas levitator is located outside and integrated with the surface of the head; the gas levitator is connected to a pump which is a supply of inert gas, and the gas levitator is configured to blow inert gas to the surface to be processed to create a curtain of gas and to bias the head in a direction away from the surface to be processed.

9 . A focused charged particle beam system, comprising:
a differential pumping apparatus, including: a head movable relative to a surface to be processed of a substrate to be processed to face any area on the surface to be processed, the head having closed-loop grooves ( 10 A, 10 B, 10 C, 10 D) in its surface adapted to face the surface to be processed, each of the closed-loop grooves surrounding the center of the surface adapted to face the surface to be processed, the closed-loop grooves including the innermost closed loop-groove ( 10 A) and other closed-loop grooves ( 10 B, 10 C, 10 D), the head having, within the area surrounded by the innermost closed-loop groove ( 10 A), among the closed-loop grooves an aperture defining a space for conducting processing of the surface to be processed, the innermost closed-loop groove ( 10 A) being connectable to a deposition gas supply to deliver a deposition gas to the space for conducting processing of the surface to be processed, the closed-loop grooves including at least one closed-loop groove, selected from the other closed-loop grooves ( 10 B, 10 C, 10 D), to which a vacuum pump is connectable to suck air from the one closed-loop groove to create high vacuum within the space under the condition that the surface of the head faces the surface to be processed; a focused energy beam column, which is on the side of the head opposite to the surface adapted to face the surface to be processed, having a lens barrel, the lens barrel having a focused energy beam system built-in for emitting a focused energy beam to pass through the aperture; a displacement drive unit configured to move the head or the surface to be processed to adjustably control the parallelism and distance between the surface to be processed and the surface of the head; gap measurement devices placed at least three locations along the periphery of the surface of the head, each of the gap measurement devices being configured to detect the distance between the surface of the head and the surface to be processed and to provide the distance information, and a gap control unit configured to control the displacement drive unit in response to the distance information measured by each of the gap measurement devices so that the surface of the head and the surface to be processed will be parallel to each other with a predetermined distance kept therebetween.

10 . The focused charged particle beam system according to claim 9 , wherein
each of the gap measurement devices detects pressure in the space from the gap measurement device to the surface to be processed and provides the pressure information, and the gap control unit controls the displacement d

Assignees

• V Tech Co Ltd

Inventors

• Mizumura Michinobu
• Arai Toshinari
• Matsumoto Takanori
• Takeshita Takuro

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• H01J37/3007

  Electron or ion-optical systems · CPC title

• H01J37/18 Primary

  Vacuum locks {; Means for obtaining or maintaining the desired pressure within the vessel} · CPC title

• G03F7/2061

  Electron scattering (proximity) correction or prevention methods · CPC title

• H01J37/3174

  Particle-beam lithography, e.g. electron beam lithography · CPC title