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Method and apparatus for setting semiconductor device manufacturing parameter

US12554246B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12554246-B2
Application numberUS-202318458896-A
CountryUS
Kind codeB2
Filing dateAug 30, 2023
Priority dateSep 15, 2022
Publication dateFeb 17, 2026
Grant dateFeb 17, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Determining a semiconductor device manufacturing parameter may include determining an EPM (electrical measurement parameters) group that has a correlation in a baseline EPM dataset including EPMs of a device manufactured under a baseline condition, deriving principal components (PCs) corresponding to main correlation axes between EPMs in the EPM group, deriving a PC-based dataset including a baseline PC dataset and a conditional split PC dataset by converting the baseline EPM dataset and a conditional split EPM dataset measured from devices manufactured under conditional splits into a PC domain, determining, using the PC-based dataset, respective PCs which are effectively changed by the conditional splits, obtaining split variation information of the conditional splits, extracting an optimal point capable of optimizing a figure of merit of a semiconductor device within a range of the PC-based dataset, and deriving information for process feedback for realizing the optimal point using the split variation information.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for performing semiconductor device manufacturing, the method comprising: determining an EPM (electrical measurement parameter) group having a correlation in a baseline EPM dataset, the baseline EPM dataset including a plurality of EPMs measured from a baseline semiconductor device manufactured under a baseline condition corresponding to a basic experimental condition for setting semiconductor device manufacturing parameters; deriving a plurali…

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What does patent US12554246B2 cover?
Determining a semiconductor device manufacturing parameter may include determining an EPM (electrical measurement parameters) group that has a correlation in a baseline EPM dataset including EPMs of a device manufactured under a baseline condition, deriving principal components (PCs) corresponding to main correlation axes between EPMs in the EPM group, deriving a PC-based dataset including a ba…
Who is the assignee on this patent?
Sk Hynix Inc, Postech Acad Ind Found
What technology area does this patent fall under?
Primary CPC classification G05B19/4099. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).