Omnidirectional flow sensor

Patent metadata

Field	Value
Publication number	US-12553754-B2
Application number	US-202318367015-A
Country	US
Kind code	B2
Filing date	Sep 12, 2023
Priority date	Sep 12, 2022
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

Disclosed is a fast-response sensor system to measure a fluid vector in a plurality of dimensions. This system, known as ‘MAST’ (for MEMS Anemometry Sensing Tower), utilizes microelectromechanical (MEMS) hot-wire devices to produce a solid-state, lightweight, and robust flow sensor system suitable for, e.g., real-time wind estimation onboard a UAV. The MAST uses three through eighteen polygonally-arranged microscale flow sensors to determine the fluid's vector's direction and magnitude.

First claim

What is claimed:

1 . An omnidirectional flow sensor, comprising:
a plurality of microelectromechanical system (MEMS) flow sensors, each MEMS flow sensor comprising: a substrate having a first surface and a second surface opposite the first surface, and a window extending through a portion of the first surface to the second surface; and at least one wire array disposed on the first surface, each wire array comprising an odd number of wires aligned in parallel directions and connected in series, one wire array of the at least one wire array disposed at least partially over the window; a chassis substrate, upon which an additional MEMS flow sensor is placed; a plurality of support substrates; wherein each MEMS flow sensor of the plurality of MEMS flow sensors is coupled to a respective support substrate of the plurality of support substrates at a fixed distance from the chassis substrate; and wherein each MEMS flow sensor faces a different direction.

2 . The omnidirectional flow sensor of claim 1 , further comprising at least one spacer configured to be coupled between the chassis substrate and the plurality of support substrates.

3 . The omnidirectional flow sensor of claim 2 , the plurality of support substrates are arranged in a three-dimensional geometric shape, the three-dimensional geometric shape being disposed at an end of the at least one spacer.

4 . The omnidirectional flow sensor of claim 1 , further comprising an instrument amplifier on each support substrate of the plurality of support substrates configured to amplify a signal from each MEMS flow sensor for greater resolution.

5 . The omnidirectional flow sensor of claim 1 , wherein each support substrate of the plurality of support substrates is coupled orthogonal to the chassis substrate, and each support substrate has one of the plurality of MEMS flow sensors placed on the support substrate at a fixed distance from the chassis substrate facing away from other support substrates.

6 . The omnidirectional flow sensor of claim 1 , wherein there are at least 5 support substrates of the plurality of support substrates.

7 . The omnidirectional flow sensor of claim 1 , wherein each of the plurality of MEMS flow sensors operates as a hotwire anemometer.

8 . The omnidirectional flow sensor of claim 1 , wherein the at least one wire array is part of a Wheatstone bridge.

9 . The omnidirectional flow sensor of claim 1 , wherein the at least one wire array includes four wire arrays configured as legs of a Wheatstone bridge, the four wire arrays including:
a first wire array on the first surface couples a first contact and a second contact; a second wire array on the first surface couples the second contact and a third contact; a third wire array on the first surface couples the third contact and a fourth contact; and a fourth wire array configured to extend over the window couples the fourth contact and the first contact.

10 . The omnidirectional flow sensor of claim 9 , wherein the substrate is a silicon substrate electrically insulated with a layer of silicon nitride or silicon oxide.

11 . The omnidirectional flow sensor of claim 10 , wherein each contact comprises platinum.

12 . The omnidirectional flow sensor of claim 11 , wherein each wire array comprises platinum.

13 . The omnidirectional flow sensor of claim 12 , wherein the chassis substrate and each support substrate of the plurality of support substrates comprises a printed circuit board (PCB).

14 . The omnidirectional flow sensor of claim 1 , further comprising an instrument amplifier on each support substrate of the plurality of support substrates configured to amplify a signal from each MEMS flow sensor for greater resolution.

15 . The omnidirectional flow sensor of claim 1 , further comprising a constant voltage source on the chassis substrate that is operably coupled to each MEMS flow sensor.

16 . The omnidirectional flow sensor of claim 1 , wherein each support substrate of the plurality of support substrates has one MEMS flow sensor bonded to the support substrate with a conductive epoxy.

17 . The omnidirectional flow sensor of claim 1 , wherein each support substrate of the plurality of support substrates has one MEMS flow sensor bonded to the support substrate with solder.

18 . The omnidirectional flow sensor of claim 1 , wherein each support substrate of the plurality of support substrates has one MEMS flow sensor bonded to the support substrate with gold.

19 . A system, comprising:
at least one processor; and an omnidirectional flow sensor operably coupled to the at least one processor, the omnidirectional flow sensor comprising:
a plurality of microelectromechanical system (MEMS) flow sensors, each MEMS flow sensor comprising:
a substrate having a first surface and a second surface opposite the first surface, and a window extending through a portion of the first surface to the second surface; and
at least one wire array disposed on the first surface, each wire array comprising an odd number of wires aligned in parallel directions and connected in series, one wire array of the at least one wire array disposed at least partially over the window;

a chassis substrate, upon which an additional MEMS flow sensor is placed; and
a plurality of support substrates;
wherein each MEMS flow sensor of the plurality of MEMS flow sensors is coupled to a respective support substrate of the plurality of supports substrates at a fixed distance from the chassis substrate; and wherein each MEMS flow sensor faces a different direction.

20 . The system of claim 19 , further comprising a vehicle, wherein the omnidirectional flow sensor is operably coupled to the vehicle.

21 . The system of claim 20 , wherein the vehicle is an unmanned aerial vehicle (UAV).

22 . The system of claim 19 , wherein the at least one processor is coupled to a non-transitory computer-readable storage device containing instructions that, when executed by the at least one processor, causes the at least one processor to, collectively:
cause a constant voltage to be applied across a Wheatstone bridge of the omnidirectional flow sensor; receive signals from each MEMS flow sensor in the omnidirectional flow sensor; determine a wind angle by passing the received signals to a first trained machine learning algorithm and/or determining a wind magnitude by passing the received signals to a second trained machine learning algorithm; and output the determined wind angle and/or wind magnitude.

23 . The system of claim 22 , wherein the first trained machine learning algorithm comprises an input layer and two hidden layers, the two hidden layers including a first hidden layer and a second hidden layer, the input layer having a width of n, where n is a number of MEMS flow sensor in the system, the first hidden layer being of width 8n, and the second hidden layer being of width 4n+5.

24 . The system of claim 23 , wherein the second trained machine learning algorithm comprises an input layer, a hidden layer, and an output layer, the input layer having a width of 3, the hidden layer having a width of 6, and the output layer having a width of 1.

Assignees

• Univ Princeton

Inventors

• Simon Nathaniel
• Piqué Alexander
• Snyder David
• Ikuma Kyle
• Majumdar Anirudha
• Hultmark Marcus

Classifications

• G01P5/10 Primary

  by measuring thermal variables · CPC title

• G01P5/12

  using variation of resistance of a heated conductor · CPC title

• G01F1/69

  of resistive type · CPC title

• G01P1/026

  for speed measuring devices, e.g. pulse generator · CPC title

• G01F1/6845 Primary

  Micromachined devices · CPC title