Polyamideimide resin composition and method for producing polyamideimide resin

Patent metadata

Field	Value
Publication number	US-12552960-B2
Application number	US-201917610980-A
Country	US
Kind code	B2
Filing date	May 16, 2019
Priority date	May 16, 2019
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

A polyamideimide resin composition comprises a polyamideimide resin and a solvent containing a compound represented by formula (1). In the formula, R 1 represents an alkyl group of 1 to 8 carbon atoms, R 2 and R 3 each independently represent a hydrogen atom or an alkyl group of 1 to 8 carbon atoms, and X represents an alkylene group of 1 to 8 carbon atoms.

First claim

The invention claimed is:

1 . A polyamideimide resin composition comprising a polyamideimide resin and a solvent consisting of a compound represented by formula (1) and optionally an additional solvent at a content of 40 mass % or less, and wherein the additional solvent is selected from the group consisting of N-methyl-2-pyrrolidone, N,N′-dimethylformamide, 1,3-dimethylimidazolidinone, 4-morpholine carbaldehyde, aromatic hydrocarbons, and ketones,

wherein, in the formula (1), R1 represents an alkyl group of 1 to 8 carbon atoms, R2 and R3 each independently represent a hydrogen atom or an alkyl group of 1 to 8 carbon atoms, and X represents an alkylene group of 1 to 8 carbon atoms,
wherein the polyamideimide resin has a terminal carboxyl group blocked by reaction with a vinyl ether compound,
wherein the polyamideimide resin has a number average molecular weight of 10,000 to 24,000, and
wherein the polyamideimide resin has a degree of dispersion of 2.1 to 2.6, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

2 . The polyamideimide resin composition according to claim 1 , wherein the polyamideimide resin further has a terminal group blocked with a blocking agent containing at least one selected from the group consisting of an oxime compound and an alcohol.

3 . The polyamideimide resin composition according to claim 1 , wherein the compound represented by formula (1) comprises at least one selected from the group consisting of 3-methoxy-N,N-dimethylpropionamide and 3-butoxy-N,Ndimethylpropionamide.

4 . The polyamideimide resin composition according to claim 1 , further comprising an epoxy resin.

5 . The polyamideimide resin composition according to claim 1 , wherein the composition is used as a coating agent for coating a surface of a metal substrate.

6 . A method for producing a polyamideimide resin, comprising reacting a monomer mixture containing a diisocyanate compound and a tribasic acid anhydride or a tribasic acid halide, in a solvent consisting of a compound represented by formula (1) and optionally an additional solvent at a content of 40 mass % or less, and wherein the additional solvent is selected from the group consisting of N-methyl-2-pyrrolidone, N,N′-dimethylformamide, 1,3-dimethylimidazolidinone, 4-morpholine carbaldehyde, aromatic hydrocarbons, and ketones,

wherein, in the formula (1), R1 represents an alkyl group of 1 to 8 carbon atoms, R2 and R3 each independently represent a hydrogen atom or an alkyl group of 1 to 8 carbon atoms, and X represents an alkylene group of 1 to 8 carbon atoms;
wherein the polyamideimide resin has a terminal carboxyl group blocked by reaction with a vinyl ether compound, wherein the polyamideimide resin has a number average molecular weight of 10,000 to 24,000, and wherein the polyamideimide resin has a degree of dispersion of 2.1 to 2.6, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

7 . The method for producing a polyamideimide resin according to claim 6 , wherein the vinyl ether compound is added to the monomer mixture in the solvent or the vinyl ether compound is added to a reaction solution containing a polyamideimide resin obtained by reacting the monomer mixture in the solvent, to block a terminal group of the polyamideimide resin.

8 . The method for producing a polyamideimide resin according to claim 6 , wherein the polyamideimide resin further has a terminal group blocked with a blocking agent containing at least one selected from the group consisting of an oxime compound and an alcohol.

9 . The polyamideimide resin composition according to claim 1 , wherein the polyamideimide resin has a number average molecular weight of 17,000 to 20,000.

10 . The polyamideimide resin composition according to claim 9 , wherein the polyamideimide resin has a degree of dispersion (weight average molecular weight/number average molecular weight) of 2.2 to 2.5, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

11 . The polyamideimide resin composition according to claim 1 , wherein the polyamideimide resin has a degree of dispersion of 2.2 to 2.5, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

12 . The polyamideimide resin composition according to claim 1 , wherein the compound represented by formula (1) comprises 3-methoxy-N,Ndimethylpropionamide.

13 . The polyamideimide resin composition according to claim 1 , wherein the compound represented by formula (1) comprises 3-butoxy-N,Ndimethylpropionamide.

14 . The polyamideimide resin composition according to claim 1 , wherein the compound represented by formula (1) is represented by the following formula (1-1):

wherein, in the formula, R1 represents an alkyl group of 1 to 8, and R2 and R3 each independently represent a hydrogen atom or an alkyl group of 1 to 8 carbon atoms.

15 . The polyamideimide resin composition according to claim 1 , wherein a content of the compound represented by formula (1) in the entire solvent is 100 mass %.

16 . The polyamideimide resin composition according to claim 1 , wherein the solvent consists of the compound represented by formula (1) and optionally the additional solvent at a content of 20 mass % or less.

17 . A polyamideimide resin composition comprising a polyamideimide resin and a solvent containing at least one compound selected from the group consisting of 3-methoxy-N, N-dimethylpropionamide and 3-butoxy-N,Ndimethylpropionamide, wherein a content of the at least one compound in the entire solvent is 100 mass %, wherein the polyamideimide resin has a terminal carboxyl group blocked by reaction with a vinyl ether compound, wherein the polyamideimide resin has a number average molecular weight of 10,000 to 24,000, and wherein the polyamideimide resin has a degree of dispersion of 2.1 to 2.6, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

18 . The polyamideimide resin composition according to claim 17 , wherein the polyamideimide resin has a number average molecular weight of 17,000 to 20,000, and the polyamideimide resin has a degree of dispersion of 2.2 to 2.5, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

19 . The polyamideimide resin composition according to claim 17 , wherein polyamideimide resin composition further comprises an epoxy resin, wherein the polyamideimide resin has a number average molecular weight of 17,000 to 20,000, and wherein the polyamideimide resin has a degree of dispersion of 2.2 to 2.5, wherein the degree of dispersion is the weight average molecular weight/number average molecular weight.

Assignees

• Showa Denko Materials Co Ltd
• Resonac Corp

Inventors

• Saito Yasuyuki
• Takahashi Atsushi
• Satake Rei

Classifications

• C08L79/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G73/14

  Polyamide-imides · CPC title

• C09D7/63

  organic · CPC title

• C08G73/1032

  characterised by the solvent(s) used · CPC title

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title