Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-12552124-B2
Application number	US-202318323467-A
Country	US
Kind code	B2
Filing date	May 25, 2023
Priority date	May 26, 2022
Publication date	Feb 17, 2026
Grant date	Feb 17, 2026

Abstract

Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.

First claim

What is claimed:

1 . A substrate processing apparatus comprising
a lower jig plate for arranging an object to be pressurized, an upper jig plate for pressurizing the object arranged on the lower jig plate, and a support member supporting the lower jig plate and providing the lower jig plate with a supporting force in accordance with an in-plane distribution of a load applied to the lower jig plate, wherein the support member includes columnar members supporting the lower jig plate, the columnar members are formed of members having different shapes or Young's moduli, and the support member adjusts the in-plane distribution of the load applied to the lower jig plate by the columnar members having properties exhibiting different strain amounts when a certain load is applied, and each of the columnar members is formed of a single columnar resiliently deformable solid body.

2 . The substrate processing apparatus according to claim 1 , wherein the support member provides the lower jig plate with a support force in accordance with a height distribution of the object.

3 . The substrate processing apparatus according to claim 1 , wherein the columnar members are arranged in accordance with the in-plane distribution of the load applied to the lower jig plate.

4 . The substrate processing apparatus according to claim 1 , wherein each of the columnar members have a cylinder shape, a prism shape, a cone shape, or a pyramid shape.

5 . The substrate processing apparatus according to claim 1 , wherein the columnar members comprise a first columnar member arranged at a position where a relatively smaller load is applied to the lower jig plate, and a second columnar member arranged at a position where a relatively larger load is applied to the lower jig plate; and
a strain amount of the first columnar member is smaller compared to a strain amount of the second columnar member.

6 . The substrate processing apparatus according to claim 5 , wherein a cross sectional area of the first columnar member is larger than a cross sectional area of the second columnar member.

7 . The substrate processing apparatus according to claim 1 , wherein the columnar members are densely distributed at the position where the relatively smaller load is applied to the lower jig plate compared to the position where the relatively larger load is applied to the lower jig plate.

8 . The substrate processing apparatus according to claim 1 , wherein a resilient deformation of the single columnar solid body according to the load applied to the lower jig plate changes a length of the single columnar solid body along an axial direction of the single columnar solid body.

9 . The substrate processing apparatus according to claim 3 , wherein in the columnar members, a strain gradient is formed in accordance with the in-plane distribution of the load applied to the lower jig plate, and
an amount of strain of the columnar members increases or decreases from a center of the lower jig plate to an outer periphery of the lower jig plate.

Assignees

• Tdk Corp

Inventors

• Sato Yohei
• Shindo Osamu
• Koizumi Hiroshi
• Yamashita Makoto
• Kato Yasuo
• Makida Mitsuyoshi
• Matsumoto Masashi

Classifications

• H10W72/07188

  Apparatus chuck · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/0711 Primary

  Apparatus therefor · CPC title

• H10W90/00

  Package configurations · CPC title

• B30B15/04

  Frames; Guides · CPC title