Semiconductor structure with flush shallow trench isolation and gate oxide and method of manufacturing the same
US-2024395883-A1 · Nov 28, 2024 · US
US12550367B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12550367-B2 |
| Application number | US-202318219227-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 7, 2023 |
| Priority date | Oct 28, 2022 |
| Publication date | Feb 10, 2026 |
| Grant date | Feb 10, 2026 |
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A semiconductor structure and a method for forming same. The structure includes: a base substrate; a gate structure, located on the base substrate; a drift region, located in the base substrate on one side of the gate structure; a body region, located in the base substrate on the other side of the gate structure; a drain region, located in the drift region on one side of the gate structure; a source region, located in the body region on the other side of the gate structure; and a floating field plate, located on the drift region between the gate structure and the drain region, where the floating field plate has notches arranged at intervals along a width direction of the gate structure, and the floating field plate also has notches arranged at intervals along a length direction of the gate structure.
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What is claimed is: 1 . A semiconductor structure, comprising: a base substrate; a gate structure, located on the base substrate; a drift region, located in the base substrate on a first side of the gate structure; a body region, located in the base substrate on a second side of the gate structure; a drain region, located in the drift region on the first side of the gate structure; a source region, located in the body region on the second side of the gate structure; an…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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