Socket connector for an electronic package
US-2019150311-A1 · May 16, 2019 · US
Electric assembly comprising two printed circuit boards
US12550260B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12550260-B2 |
| Application number | US-202218564656-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 18, 2022 |
| Priority date | May 28, 2021 |
| Publication date | Feb 10, 2026 |
| Grant date | Feb 10, 2026 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
An electric assembly comprises at least a first circuit board, a second circuit board, and, packaged in a housing, at least one integrated circuit. The first circuit board and the second circuit board have, respectively, a plurality of first contact areas and a plurality of second contact areas. The housing includes in a first area and in a second area, respectively, a plurality of third contact areas and a plurality of fourth contact areas. The third contact areas and/or the fourth contact areas are electrically connected with the integrated circuit. The first circuit board is mechanically and electrically connected with the first area of the housing via the first contact areas and the third contact areas, and the second circuit board is mechanically and electrically connected with the second area of the housing via the second contact areas and the fourth contact areas.
First claim
Opening claim text (preview).
The invention claimed is: 1 . An electric assembly, comprising: a first circuit board; a second circuit board; and, packaged in a housing, at least one integrated circuit that is embodied to receive an electrical, primary signal from the first circuit board, wherein the at least one integrated circuit is further embodied to convert the electrical, primary signal into an electrical, secondary signal and to forward the electrical, secondary signal to the second circuit board wherein the first circuit board has a plurality of first contact areas and the second circuit board has a plurality of second contact areas, wherein the housing includes in a first area a plurality of third contact areas and in a second area a plurality of fourth contact areas, wherein the third contact areas and/or the fourth contact areas are electrically connected, at least partially, with the at least one integrated circuit, wherein the first circuit board is mechanically and electrically connected with the first area of the housing via the first contact areas and the third contact areas, and wherein the second circuit board is mechanically and electrically connected with the second area of the housing via the second contact areas and the fourth contact areas. 2 . The electric assembly as claimed in claim 1 , wherein the first contact areas and the third contact areas and/or the second contact areas and the fourth contact areas are embodied as Quad Flag No-leads (QFN), Land Grid Array (LGA), Dual Flat No-leads (DFN), or Ball Grid Array (BGA) arrangements. 3 . The electric assembly as claimed in claim 1 , wherein the first circuit board and/or the second circuit board are/is a rigid circuit board. 4 . The electric assembly as claimed in claim 1 , wherein the at least one integrated circuit is further embodied to forward the electrical, primary signal to the second circuit board. 5 . The electric assembly as claimed in claim 1 , wherein at least one component arranged on the second circuit board is embodied to process the electrical, secondary signal. 6 . The electric assembly as claimed in claim 1 , wherein the housing and the at least one integrated circuit packaged in the housing are manufacturable by means of a System-in-Package method. 7 . The electric assembly as claimed in claim 1 , wherein at least two integrated circuits are packaged in the housing. 8 . The electric assembly as claimed in claim 1 , wherein the at least one integrated circuit and at least one other electrical component are packaged in the housing.
Assignees
Inventors
Classifications
Ball grid array [BGA]; Bump grid array · CPC title
Land grid array [LGA] · CPC title
Leadless chip, e.g. chip capacitor or resistor · CPC title
Sensor · CPC title
having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title
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Frequently asked questions
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- What does patent US12550260B2 cover?
- An electric assembly comprises at least a first circuit board, a second circuit board, and, packaged in a housing, at least one integrated circuit. The first circuit board and the second circuit board have, respectively, a plurality of first contact areas and a plurality of second contact areas. The housing includes in a first area and in a second area, respectively, a plurality of third contac…
- Who is the assignee on this patent?
- Endress Hauser Se Co Kg
- What technology area does this patent fall under?
- Primary CPC classification H05K1/145. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).