Systems and apparatuses for a modular electronics roofing attachment and methods of use thereof

Patent metadata

Field	Value
Publication number	US-12548989-B2
Application number	US-202318484857-A
Country	US
Kind code	B2
Filing date	Oct 11, 2023
Priority date	Mar 30, 2022
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

Systems and methods include a modular attachment mounted in a vent of a roof for electronic communication between devices interior to and external to a structure. The vent covers a slot in a roof of the structure to provide ventilation and includes a housing having a length, a width and a height that are sized to fit through the slot of the roof, and includes a top a top portion proximal to the vent, a bottom portion proximal to the interior of the structure and opposite to the top portion, and at least one wall extending between the top portion and the bottom portion. A securing mechanism is connected to the top portion of the housing to secure the housing within the slot. An electronics bus is positioned within the housing and has an interface that enables operation of modular electronic devices that are removably positioned within the housing.

First claim

What is claimed is:

1 . A system comprising:
a roof of a structure; a housing sized to fit through an opening in the roof into an interior of the structure; at least one securing mechanism connect to a top portion of the housing and configured to secure the top portion of the housing to the opening in the roof; and at least one electronics bus positioned within the housing;
wherein the at least one electronics bus comprises at least one interface that is configured to accept at least one modular electronic device that is removably positioned on the at least one electronics bus;
wherein the at least one modular electronic device is configured to communicate with at least one exterior roofing accessory mounted on an exterior of the roof; and

wherein the at least one electronics bus comprises at least one connection to at least one other electronic device positioned within the interior of the structure.

2 . The system of claim 1 , further comprising at least one securing mechanism configured to secure the at least one electronics bus in the opening of the roof.

3 . The system of claim 2 , wherein the at least one securing mechanism comprises a plurality of roofing nails.

4 . The system of claim 1 , further comprising the housing configured to house the at least one electronics bus in the opening of the roof.

5 . The system of claim 1 , wherein the at least one interface comprises at least one standardized connector.

6 . The system of claim 5 , wherein the at least one standardized connector is two standardized connector, the two standardized connector comprising:
a first standardized connector configured for data communication between the at least one electronics bus and the at least one modular electronic device, and a second standardized connector configured to provide electrical power from the at least one electronics bus to the at least one modular electronic device.

7 . The system of claim 5 , wherein the at least one standardized connector is one standardized connector configured to provide data communication and power between the at least one electronics bus to the at least one modular electronic device.

8 . The system of claim 1 , wherein the at least one interface comprises a single interface.

9 . The system of claim 1 , further comprising a wireway on the roof of the structure that is configured to accept wiring between the at least one modular electronic device and the at least one exterior roofing accessory.

10 . The system of claim 1 , further comprising at least one covering configured to cover the opening in the roof and prevent water entry into the opening.

11 . A device comprising:
a housing sized to fit through an opening in a roof into an interior of a structure; at least one securing mechanism connect to a top portion of the housing and configured to secure the top portion of the housing to the opening in the roof; and at least one electronics bus positioned within the housing;
wherein the at least one electronics bus comprises at least one interface that is configured to accept at least one modular electronic device that is removably positioned on the at least one electronics bus;
wherein the at least one modular electronic device is configured to communicate with at least one exterior roofing accessory mounted on an exterior of the roof; and

wherein the at least one electronics bus comprises at least one connection to at least one other electronic device positioned within the interior of the structure.

12 . The device of claim 11 , further comprising at least one securing mechanism configured to secure the at least one electronics bus in the opening of the roof.

13 . The device of claim 12 , wherein the at least one securing mechanism comprises a plurality of roofing nails.

14 . The device of claim 11 , further comprising a housing configured to house the at least one electronics bus in the opening of the roof.

15 . The device of claim 11 , wherein the at least one interface comprises at least one standardized connector.

16 . The device of claim 15 , wherein the at least one standardized connector is two standardized connector, the two standardized connector comprising:
a first standardized connector configured for data communication between the at least one electronics bus and the at least one modular electronic device, and a second standardized connector configured to provide electrical power from the at least one electronics bus to the at least one modular electronic device.

17 . The device of claim 15 , wherein the at least one standardized connector is one standardized connector configured to provide data communication and power between the at least one electronics bus to the at least one modular electronic device.

18 . The device of claim 11 , wherein the at least one interface comprises a single interface.

19 . A method comprising:
creating an opening in a roof of a structure; and installing in the opening at least one device, wherein the at least one device comprises;
a housing sized to fit through an opening in the roof into an interior of the structure;
at least one securing mechanism connect to a top portion of the housing and configured to secure the top portion of the housing to the opening in the roof; and
at least one electronics bus positioned within the housing;
wherein the at least one electronics bus comprises at least one interface that is configured to accept at least one modular electronic device that is removably positioned on the at least one electronics bus;
wherein the at least one modular electronic device is configured to communicate with at least one exterior roofing accessory mounted on an exterior of the roof; and
wherein the at least one electronics bus comprises at least one connection to at least one other electronic device positioned within the interior of the structure.

20 . The method of claim 19 , wherein the at least one interface comprises at least one standardized connector configured to provide data communication and power between the at least one electronics bus to the at least one modular electronic device.

Assignees

• Bmic Llc

Inventors

• Riley Xavier

Classifications

• H02G5/04

  Partially-enclosed installations, e.g. in ducts and adapted for sliding or rolling current collection · CPC title

• H02G1/06

  for laying cables, e.g. laying apparatus on vehicle · CPC title

• H02G3/30

  Installations of cables or lines on walls, floors or ceilings · CPC title

• H02G3/281 Primary

  in ceilings · CPC title

• H02G3/381 Primary

  in ceilings · CPC title