Manufacturing methods of a planar transformer

Patent metadata

Field	Value
Publication number	US-12548706-B2
Application number	US-202117540256-A
Country	US
Kind code	B2
Filing date	Dec 2, 2021
Priority date	Jun 3, 2019
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.

First claim

What is claimed is:

1 . A manufacturing method of a PCB of a planar transformer, comprising:
providing a PCB substrate with a through hole; performing colloid injection molding on double sides of the PCB substrate to form a double-sided winding part integrated with the PCB substrate, wherein the double-sided winding part is of a symmetric structure on the double sides of the PCB substrate, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole allowing a magnetic core to pass through, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in a wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.

2 . The manufacturing method of claim 1 , wherein a semiautomatic CNC winding machine is adopted to enable the metal conducting wire to pass through the wire passing groove and to be wound from inside to outside on the double sides of the double-sided winding part at the same time, and after the winding is completed, obtained are two coils in series with each only having a lead end located on an outermost ring.

3 . The manufacturing method of claim 1 , wherein the wire passing groove comprises a first groove located in the wall of the through hole and two second grooves located in the two wire blocking parts on the double sides of the double-sided winding part.

4 . The manufacturing method of claim 1 , wherein the through hole of the PCB substrate is selected from the group consisting of circular, elliptic, and rectangular.

5 . A method of manufacturing a planar transformer, the method comprising:
forming a double-sided winding integrated with a PCB substrate, wherein the double-sided winding is symmetric on both sides of the PCB substrate and circumferential about a through hole in the PCB substrate; passing a wire through a wire passing groove in the PCB substrate; and planarly winding the wire from inside to outside on both sides of the double-sided winding to form two coils in series, one located on each side of the PCB substrate.

6 . The method of claim 5 wherein winding the wire from inside to outside on both sides of the double-sided winding is performed at the same time.

7 . The method of claim 6 wherein winding the wire is performed using a semiautomatic CNC winding machine.

8 . The method of claim 5 wherein the two coils in series, one located on each side of the PCB substrate, each having a lead end located on an outermost ring.

9 . The method of claim 5 further comprising forming a via hole aligned with the through hole to form a magnetic core hole allowing a magnetic core to pass through the PCB substrate.

10 . The method of claim 9 further comprising mounting the magnetic core passing through the PCB substrate.

11 . The method of claim 9 wherein a circumference of the via hole is raised to form one or more wire blocking parts.

12 . The manufacturing method of claim 11 , wherein the wire passing groove comprises a first groove located in the wall of the through hole and two second grooves located in the two wire blocking parts on the double sides of the double-sided winding part.

13 . The manufacturing method of claim 5 wherein the wire passing groove comprises a first groove located in the wall of the through hole.

14 . The manufacturing method of claim 5 wherein forming a double-sided winding integrated with a PCB substrate comprises colloid injection molding of the double-sided winding.

15 . A method of manufacturing a planar transformer, the method comprising:
providing a PCB substrate having a printed circuit winding formed thereon, wherein the winding is circumferential about a through hole in the PCB substrate; passing a wire through a wire passing groove in the PCB substrate; and planarly winding the wire from inside to outside on both sides of the PCB substrate to form two coils in series, one located on each side of the PCB substrate; and mounting a magnetic core passing through the PCB substrate.

16 . The method of claim 15 wherein winding the wire from inside to outside on both sides of the double-sided winding is performed at the same time.

17 . The method of claim 15 wherein the two coils in series, one located on each side of the PCB substrate, each having a lead end located on an outermost ring.

18 . The method of claim 15 wherein the magnetic core passes through the PCB substrate through a via hole aligned with the through hole.

19 . The method of claim 18 wherein a circumference of the via hole is raised to form one or more wire blocking parts.

20 . The manufacturing method of claim 15 , wherein the wire passing groove comprises a first groove located in the wall of the through hole.

Assignees

• Apple Inc

Inventors

• Zha Xiaoyue
• Ouyang Guo
• Ren Jingjing
• Maddineni Prudhvi Mohan
• Phadke Vijay G
• Khan Balal

Classifications

• H05K1/0213

  Electrical arrangements not otherwise provided for · CPC title

• H01F41/0206

  Manufacturing of magnetic cores by mechanical means (magnetic cores per se H01F27/24) · CPC title

• H01F27/24

  Magnetic cores · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H01F41/10

  Connecting leads to windings (making electric connections in general H01R43/00) · CPC title