Functional label and method for producing a functional label

US12548472B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12548472-B2
Application numberUS-202218288880-A
CountryUS
Kind codeB2
Filing dateApr 22, 2022
Priority dateMay 4, 2021
Publication dateFeb 10, 2026
Grant dateFeb 10, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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A method of manufacturing a functional label includes providing a source material having one or more label layers and performing a first printing process and thereby forming a print on the source material using a first printing device. The method further includes performing a first die cutting process and thereby forming a functional die cut in the source material using a first die cutting device. The method further includes performing a second printing process separate from the first printing process and thereby forming a digital print on the source material using a second printing device. The method further includes performing a second die-cutting operation separate from the first die cutting operation and thereby forming a format die-cut in the source material using a second die cutting device and thereby forming the functional label.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A method for producing a functional label ( 1 ), comprising: providing a source material ( 108 ) having one or more label layers ( 10 , 20 ), performing a first printing process and thereby forming a print on the source material ( 108 ) by means of a first printing device ( 101 ), performing a first die cutting process and thereby forming a functional die cut ( 13 , 16 , 23 , 26 ) in the source material ( 108 ) by means of a first die cutting device ( 102 ), performing a second printing process separate from the first printing process and thereby forming a digital print ( 14 ) on the source material ( 108 ) by means of a second printing device ( 103 ), and performing a second die cutting process separate from the first die cutting process and thereby forming a format punching in the source material ( 108 ) by means of a second die cutting device ( 104 ) and thereby forming the functional label ( 1 ). 2 . The method of claim 1 , wherein performing the first die cutting process and forming the functional die cut comprises: making at least one punch, cut, slit and/or perforation in the source material ( 108 ) and forming a label area ( 12 ) that is liftable relative to an adjacent label area ( 11 ) so that a hanger element is foldable out of the functional label ( 1 ). 3 . The method of claim 1 , wherein performing the first die cutting process and forming the functional die cut comprises: making at least one punch, cut, slit and/or perforation in the source material ( 108 ) and forming a weakening zone ( 16 , 26 ) in a label area predetermined with respect to an intended operational use of the functional label ( 1 ) and tensile forces acting thereon. 4 . The method of claim 1 , wherein the source material ( 108 ) is provided as a multilayer label having a plurality of label layers ( 10 , 20 ) and the first die-cutting process is performed such that the functional die-cutting ( 13 , 16 , 23 , 26 ) is performed in or on one or more, but not all, label layers. 5 . The method of claim 1 , comprising: providing a first label layer ( 10 ) and second label layer ( 20 ), and performing the first die-cutting process and forming a functional die-cut in the first and in the second label layer ( 10 , 20 ), such that the first and the second label layer ( 10 , 20 ) each have at least one die-cut, cut, slit and/or perforation ( 13 , 16 , 23 , 26 ) which penetrates the respective label layer ( 10 , 20 ) and which are formed offset from one another with respect to a main extension plane of the functional label ( 1 ) and transversely to a stacking direction (R) of the functional label ( 1 ). 6 . The method of claim 1 , wherein the source material ( 108 ) is provided as a multilayer label having a plurality of label layers ( 10 , 20 ) and the first die-cutting operation and the formation of the functional die-cut ( 13 , 16 , 23 , 26 ) is carried out in at least one of the label layers ( 10 , 20 ) and subsequently the label layers ( 10 , 20 ) are coupled to each other. 7 . The method of claim 1 , further comprising: forming an adhesive layer ( 15 ) and introducing an adhesive weakening element ( 22 ) into the adhesive layer ( 15 ), such that the adhesive layer ( 15 ) is arranged after coupling label layers ( 10 , 20 ) with each other between two label layers ( 10 , 20 ) and the adhesive weakening element ( 22 ) is further arranged in an area of the functional die-cut ( 13 , 16 , 23 , 26 ). 8 . The method of claim 1 , wherein the second printing process and the forming of the digital print ( 14 ) is performed subsequently to the first die-cutting process and the forming of the functional die-cut ( 13 , 16 , 23 , 26 ). 9 . The method of claim 1 , wherein the first printing process and the forming of the print comprises printing with silicone varnish and/or printing with an adhesive neutralization. 10 . The method of claim 1 , wherein the first printing process and the forming of the print comprises applying a further digital print. 11 . The method of claim 1 , wherein the second printing process and forming the digital print ( 14 ) comprises inkjet printing. 12 . The method of claim 1 , further comprising: performing a further printing process and applying a varnish and/or an ink. 13 . The method of claim 1 , wherein the source material ( 108 ) is provided in the form of a source material web and the respective process steps are performed multiple times to form a plurality of functional labels.

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What does patent US12548472B2 cover?
A method of manufacturing a functional label includes providing a source material having one or more label layers and performing a first printing process and thereby forming a print on the source material using a first printing device. The method further includes performing a first die cutting process and thereby forming a functional die cut in the source material using a first die cutting devi…
Who is the assignee on this patent?
Schreiner Group Gmbh & Co Kg
What technology area does this patent fall under?
Primary CPC classification G09F3/10. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).