Ridge identification module, manufacturing method thereof and display apparatus

Patent metadata

Field	Value
Publication number	US-12548368-B2
Application number	US-202218028304-A
Country	US
Kind code	B2
Filing date	Mar 22, 2022
Priority date	Mar 22, 2022
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

This disclosure relates a ridge identification module, a manufacturing method thereof and a display apparatus. The ridge identification module includes a ridge identification substrate, the ridge identification substrate includes a base substrate and photosensitive devices arranged on a side of the base substrate in an array mode; a diaphragm layer on a side where the ridge identification substrate has the plurality of photosensitive devices, the diaphragm layer includes light transmittance holes in an array mode, orthographic projections of the light transmittance holes are in orthographic projections of the photosensitive devices on the base substrate, a ratio of depths of the light transmittance holes to maximum apertures of the light transmittance holes is ≥⅙ and ≤2; micro-lenses on a side of the diaphragm layer away from the ridge identification substrate, orthographic projections of the micro-lenses cover the orthographic projections of the light transmittance holes on the base substrate.

First claim

What is claimed is:

1 . A ridge identification module, comprising:
a ridge identification substrate comprising:
a base substrate comprising a ridge identification region and a bezel region on at least one side of the ridge identification region;
a plurality of photosensitive devices arranged on a side of the base substrate in an array mode; and
shielding electrodes on a side, away from the base substrate, of a layer where the plurality of photosensitive devices are, wherein the shielding electrodes are located in the ridge identification region and the bezel region, and the shielding electrodes located in the bezel region comprise a plurality of hollowed-out structures;
a diaphragm layer on a side of the plurality of photosensitive devices on the ridge identification substrate, wherein a quantity of the diaphragm layer is one, the diaphragm layer comprises light transmittance holes distributed in the array mode, orthographic projections of the light transmittance holes on the base substrate are in orthographic projections of the photosensitive devices on the base substrate, and a ratio of a depths of the light transmittance hole to a maximum apertures of the light transmittance holes is greater than or equal to ⅙ and less than or equal to 2; and a plurality of micro-lenses on a side away from the ridge identification substrate, of the diaphragm layer, wherein orthographic projections of the micro-lenses on the base substrate cover the orthographic projections of the light transmittance holes on the base substrate.

2 . The ridge identification module according to claim 1 , wherein:
apertures of the light transmittance holes are approximately the same in a direction of the ridge identification substrate pointing to the diaphragm layer, or apertures of the light transmittance holes are gradually increased in a direction of the ridge identification substrate pointing to the diaphragm layer.

3 . The ridge identification module according to claim 1 , wherein the maximum aperture d 1 of the light transmittance holes and a minimum aperture d 2 of the light transmittance holes meet a following relation:

d
1

=

D
*
h
/
H

+

d
2

;

D is an aperture of the micro-lens, h is the depth of the light transmittance holes, and H is a distance between a surface of a side of the ridge identification substrate facing the diaphragm layer and a surface of a side of the micro-lenses facing the diaphragm layer;
wherein 1 μm≤D≤50 μm, 2 μm≤h≤8 μm, 4 μm≤d 1 ≤12 μm, 1 μm≤d 2 ≤6 μm, and 40 μm≤H≤160 μm.

4 . The ridge identification module according to claim 1 , further comprising a transparent filling layer between the diaphragm layer and a layer where the plurality of micro-lenses are; and
a distance H between a surface of a side of the ridge identification substrate facing the diaphragm layer and a surface of a side of the micro-lenses facing the diaphragm layer meeting a following relation:

H
=

[

D
2

/

(

8
⁢

h
x

)

+

h
x

/
2

]

/

(

n
x

-
1

)

-

n
*

h
x

/

n
x

;

D is an aperture of the micro-lens, h is the depth of the light transmittance hole, h x is a vector height of the micro-lenses, n is a refractive index of a material used by the micro-lens, and n x is a refractive index of the transparent filling layer;
wherein 2 μm≤h x ≤16 μm, 1.4 μm≤n x ≤1.8 μm, and 1.5 μm≤n≤2.2 μm.

5 . The ridge identification module according to claim 1 , wherein the micro-lenses are in one-to-one correspondence with the light transmittance holes, centers of the orthographic projections of the micro-lenses on the base substrate approximately coincide with centers of the orthographic projections of the light transmittance holes on the base substrate.

6 . The ridge identification module according to claim 5 , wherein the micro-lens comprises a convex surface and a flat surface, and the convex surface is on a side of the flat surface away from the light transmittance holes.

7 . The ridge identification module according to claim 1 , further comprising an infrared cut coating between the diaphragm layer and the ridge identification substrate.

8 . The ridge identification module according to claim 1 , wherein an area of an orthographic projection of the hollowed-out structure on an outmost side on the base substrate is greater than an areas of an orthographic projection of a remaining hollowed-out structures on the base substrate in an extension direction of the bezel region.

9 . The ridge identification module according to claim 1 , wherein the plurality of photosensitive devices are arranged in the ridge identification region in the array mode, and the plurality of hollowed-out structures and the photosensitive devices are arranged in the same rows or columns.

10 . The ridge identification module according to claim 9 , wherein the hollowed-out structures in the same rows or columns with the photosensitive devices are arranged in a mutually independent or communicating mode.

11 . The ridge identification module according to claim 1 , further comprising a plurality of gate lines and a plurality of data lines arranged in a crossed mode, and the plurality of gate lines and the plurality of data lines extend to a side away from the ridge identification region, of the shielding electrodes from the ridge identification region.

12 . The ridge identification module according to

Assignees

• Boe Technology Group Co Ltd

Inventors

• Hai Xiaoquan
• Wang Yingzi
• Dong Xue

Classifications

• G06V40/1318

  using electro-optical elements or layers, e.g. electroluminescent sensing · CPC title

• G06F18/00

  Pattern recognition · CPC title

• G06V40/1376 Primary

  Matching features related to ridge properties or fingerprint texture · CPC title