Aluminum-scandium composite, aluminum-scandium composite sputtering target and methods of making

US12545976B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12545976-B2
Application numberUS-202118000180-A
CountryUS
Kind codeB2
Filing dateJun 3, 2021
Priority dateJun 5, 2020
Publication dateFeb 10, 2026
Grant dateFeb 10, 2026

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  1. Title

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  5. First independent claim

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Abstract

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An Al—Sc alloy sputtering target. The target comprising from 1.0 at % to 65 at % scandium and from 35 at % to 99 at % aluminum and having a microstructure including a first aluminum matrix phase and a second phase dispersed uniformly therethrough. The second phase comprises one or more compounds corresponding to the formula Sc x Al y , where x is from 1 to 2 and y is from 0 to 3.

First claim

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We claim: 1 . An Al—Sc composite comprising from 1.0 at % to 65 at % scandium (Sc) and from 35 at % to 99 at % aluminum (Al), having a microstructure including a first aluminum matrix phase and a second phase dispersed therethrough, the second phase comprising a compound corresponding to the formula Al x Sc y , where x is from 0 to 3 and y is from 1 to 2; wherein the concentration of scandium in the second phase is at least 1% greater than the concentration predicted by the equilibrium phase diagram for aluminum-scandium. 2 . The composite of claim 1 , wherein the second phase comprises Al 3 Sc, Al 2 Sc, AlSc, AlSc 2 , Sc, or combinations thereof. 3 . The composite of claim 1 , wherein the second phase comprises less than 60 mol % Al 2 Sc, based on the total moles of the second phase. 4 . The composite of claim 1 , wherein the composite comprises at least 5 vol % of the first aluminum matrix phase as determined by quantitative image analysis. 5 . The composite of claim 1 , wherein the microstructure includes from 20 vol % to 99 vol % of the first aluminum matrix phase and from 1% to 80 vol % of the second phase as determined by quantitative image analysis. 6 . The composite of claim 1 , wherein the concentration of scandium in the second phase is greater than the concentration predicted by the equilibrium phase diagram for aluminum-scandium. 7 . The composite of claim 1 , wherein the second phase comprises greater than 25 at % scandium. 8 . The composite of claim 1 , wherein the second phase comprises greater than 1 mol % of Al 2 Sc, AlSc, AlSc 2 , or Sc or combinations thereof. 9 . The composite of claim 1 , wherein the second phase comprises less than 85 mol % aluminum. 10 . The composite of claim 1 , wherein the second phase further comprises from 1.0 mol % to 70 mol % scandium nitride (ScN). 11 . The composite of claim 1 , wherein grains of the first aluminum matrix phase are characterized by a crystallographic orientation of (110). 12 . The composite of claim 1 , wherein grains of the first aluminum matrix phase are characterized by a random crystallographic orientation. 13 . The composite of claim 1 , wherein the second phase is characterized as having a particle size ranging from 0.5 microns to 500 microns. 14 . The composite of claim 1 , wherein the microstructure is substantially devoid of microcracks, fissures, and oxide inclusions. 15 . The composite of claim 1 , wherein the composite is a sputtering target comprising less than 1000 ppm of oxygen. 16 . A process for producing a non-equilibrium composite, as recited in claim 1 the process comprising: providing a second phase powder comprising a compound corresponding to the formula Al x Sc y , where x is from 0 to 3 and y is from 1 to 2; mixing the powder with a first phase comprising aluminum to form a composite precursor; applying at least one of heat or pressure to the composite precursor to consolidate the materials; and cooling the consolidated composite precursor to form the non-equilibrium composite; wherein the concentration of scandium in the second phase is at least 1% greater than the concentration predicted by the equilibrium phase diagram for aluminum-scandium. 17 . The process of claim 16 , wherein the compound comprises Al 3 Sc, Al 2 Sc, AlSc, AlSC 2 , Sc, or combinations thereof, present in an amount greater than 1 mol %, and free aluminum, present in an amount greater than 20 vol %. 18 . An Al—Sc composite sputtering target comprising from 1.0 at % to 65 at % scandium (Sc) and from 35 at % to 99 at % aluminum (Al), having a microstructure including a first aluminum matrix phase and a second phase dispersed therethrough, the second phase comprising a compound corresponding to the formula Al x Sc y , where x is from 0 to 3 and y is from 1 to 2; wherein the concentration of scandium in the second phase is at least 1% greater than the concentration predicted by the equilibrium phase diagram for aluminum-scandium. 19 . The sputtering target of claim 18 , wherein the uniformity of scandium across a surface of the sputtering target varies by less than +/−0.5 at % scandium over an entire radius of the surface. 20 . An Al—Sc composite comprising from 1.0 at % to 65 at % scandium (Sc) and from 35 at % to 99 at % aluminum (Al), having a microstructure including a first aluminum matrix phase and a second phase dispersed therethrough, the second phase comprising a compound corresponding to the formula Al x SC y , where x is from 0 to 3 and y is from 1 to 2, wherein the second phase further comprises from 1.0 mol % to 70 mol % scandium nitride (ScN). 21 . A process for producing a non-equilibrium composite, as recited in claim 20 the process comprising: providing a second phase powder comprising a compound corresponding to the formula Al x Sc y , where x is from 0 to 3 and y is from 1 to 2; mixing the powder with a first phase comprising aluminum to form a composite precursor; applying at least one of heat or pressure to the composite precursor to consolidate the materials; and cooling the consolidated composite precursor to form the non-equilibrium composite; wherein the second phase further comprises from 1.0 mol % to 70 mol % scandium nitride (ScN). 22 . An Al—Sc composite sputtering target comprising from 1.0 at % to 65 at % scandium (Sc) and from 35 at % to 99 at % aluminum (Al), having a microstructure including a first aluminum matrix phase and a second phase dispersed therethrough, the second phase comprising a compound corresponding to the formula Al x Sc y , where x is from 0 to 3 and y is from 1 to 2; wherein the second phase further comprises from 1.0 mol % to 70 mol % scandium nitride (ScN).

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Classifications

  • comprising intermetallic compounds {(C22C1/0441 takes precedence)} · CPC title

  • Alloys based on aluminium · CPC title

  • Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

  • only nitrides · CPC title

  • Processes characterised by the sequence of their steps · CPC title

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What does patent US12545976B2 cover?
An Al—Sc alloy sputtering target. The target comprising from 1.0 at % to 65 at % scandium and from 35 at % to 99 at % aluminum and having a microstructure including a first aluminum matrix phase and a second phase dispersed uniformly therethrough. The second phase comprises one or more compounds corresponding to the formula Sc x Al y , where x is from 1 to 2 and y is from 0 to 3.
Who is the assignee on this patent?
Materion Corp
What technology area does this patent fall under?
Primary CPC classification C23C14/3414. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).