Methods of preparing metal sheets for a DCB / DAB substrate bonding process

Patent metadata

Field	Value
Publication number	US-12545011-B2
Application number	US-202318486643-A
Country	US
Kind code	B2
Filing date	Oct 13, 2023
Priority date	Oct 13, 2023
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

Novel methods of preparing a metal bonded substrate. A method may include providing a ceramic substrate, the ceramic substrate comprising a ceramic body. The method may include bonding a thick metal sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a metal surface, and bringing the ceramic substrate and thick metal sheet together, wherein the metal oxide layer and the thick metal sheet interact to form an interface layer between the thick metal sheet and the ceramic substrate, after the bonding.

First claim

What is claimed is:

1 . A method of preparing a metal bonded substrate, comprising:
providing a ceramic substrate, the ceramic substrate comprising a ceramic body; and bonding a thick metal sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a metal surface, and bringing the ceramic substrate and thick metal sheet together, wherein the metal oxide layer and the thick metal sheet interact to form an interface layer between the thick metal sheet and the ceramic substrate, after the bonding; wherein the metal surface is a first main surface of the thick metal sheet and wherein the powder deposition process comprises spraying a powder onto the first main surface to form the metal oxide layer: wherein bringing the ceramic substrate and thick metal sheet together comprises, after the spraying the powder, applying the first main surface to the ceramic substrate at elevated temperature; and wherein spraying of the powder comprises spraying a metallic powder onto the first main surface in an oxidizing ambient, wherein the metallic powder is oxidized during the spraying.

2 . The method of claim 1 , wherein the metal oxide layer and the thick metal sheet interact to form a eutectic compound, wherein the elevated temperature is greater than or equal to a melting temperature of the eutectic compound, and wherein the elevated temperature is less than a melting temperature of the thick metal sheet.

3 . The method of claim 1 , wherein the oxidizing ambient causes the metallic powder to spray as an oxide material onto the first main surface.

4 . The method of claim 1 , wherein the oxidizing ambient causes the metallic powder to spray as a metal core that is surrounded by an oxide shell onto the first main surface.

5 . A method of preparing a direct copper bonded (DCB) substrate, comprising:
providing a ceramic substrate, the ceramic substrate comprising a ceramic body; and bonding a thick copper sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a copper surface, and bringing the ceramic substrate and thick copper sheet together, wherein the metal oxide layer and the thick copper sheet interact to form an interface layer between the thick copper sheet and the ceramic substrate, after the bonding; wherein the copper surface is a first main surface of the thick copper sheet and wherein the powder deposition process comprises spraying a powder onto the first main surface to form the metal oxide layer; wherein bringing the ceramic substrate and thick copper sheet together comprises, after the spraying the powder, applying the first main surface to the ceramic substrate at elevated temperature; and wherein spraying of the powder comprises spraying a metallic powder onto the first main surface in an oxidizing ambient, wherein the metallic powder is oxidized during the spraying.

6 . The method of claim 5 , wherein the metal oxide layer and the thick copper sheet interact to form a eutectic compound, wherein the elevated temperature is greater than or equal to a melting temperature of the eutectic compound, and wherein the elevated temperature is less than a melting temperature of the thick copper sheet.

7 . The method of claim 1 , wherein the oxidizing ambient causes the metallic powder to spray as a copper oxide material onto the first main surface.

8 . The method of claim 1 , wherein the oxidizing ambient causes the metallic powder to spray as a copper core that is surrounded by a copper oxide shell onto the first main surface.

Assignees

• Littelfuse Inc

Inventors

• Spann Thomas

Classifications

• B22F1/14

  Treatment of metallic powder (mixing with lubricating or binding agents or with organic material B22F1/10) · CPC title

• B22F2201/50

  air · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• B22F2201/03

  Oxygen · CPC title

• C23C4/11

  Oxides · CPC title