Method of making low specific gravity polishing pads

Patent metadata

Field	Value
Publication number	US-12544958-B2
Application number	US-202217805040-A
Country	US
Kind code	B2
Filing date	Jun 2, 2022
Priority date	Jun 2, 2022
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

A polishing pad for chemical mechanical polishing comprises a polishing layer which comprises a polymer matrix which is the reaction product of an isocyanate terminated oligomer or polymer, with a curative blend comprising two or more polyamine curatives wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such expansion occurring during reaction of the isocyanate terminated oligomer or polymer with the two or more curatives, wherein the polishing layer is characterized by one or more of a ratio of viscous modulus (G″) at 104° C. to shear loss modulus (G″) at 150° C. of at least 5:1; and a specific gravity of the polishing layer is less than or equal to 95% of a calculated specific gravity for the isocyanate terminated oligomer or polymer, the curative blend and the pre-expanded fluid filled polymeric microspheres.

First claim

What is claimed is:

1 . A method of forming a plurality of polishing layers for use in chemical mechanical polishing pads comprising:
filling a mold with a mixture comprising an isocyanate-functional pre-polymer, pre-expanded fluid filled polymer microspheres, and a curative blend comprising a mono-aromatic polyamine curative and polyamine curative having two or more aromatic rings where the mixture is characterized by heat being released from reaction of the isocyanate-functional pre-polymer and the curatives; curing the mixture in the filled mold at a cure temperature to form a polymer block having a top edge, a bottom edge and a center, the polymer block comprising a cured polymer matrix and expanding the pre-expanded fluid filled polymer microspheres to form ultra-expanded polymeric microspheres, the expanding being caused by the heat from the cure and the heat released from the reaction between the isocyanate-functional pre-polymer and the curative blend comprising the mono-aromatic polyamine curative and polyamine curative having two or more aromatic rings wherein the mixture remains soft in a center portion of the polymer block for a time to enable expansion of the pre-expanded fluid filled polymer microspheres; setting the mixture with ultra-expanded microspheres to prevent further expansion and to avoid rupture or collapse of the ultra-expanded microspheres; and cutting the polymer block to form multiple polishing layers that include the ultra-expanded microspheres, wherein a portion of the multiple polishing layers cut from the center portion of the polymer block have a specific gravity that is lower than a specific gravity of a polishing layer cut from the top edge and the bottom edge of the polymer block by greater than 5% and the multiple polishing layers include at least ten polishing layers.

2 . The method of claim 1 wherein the specific gravity of the portion of the multiple polishing layers cut from the center portion of the polymer block is no greater than 0.72 g/cm 3 .

3 . The method of claim 1 wherein the portion of the multiple polishing layers cut from the center portion of the polymer block form a series of polishing layers having a specific gravity that vary less than 0.02 g/cm 3 .

4 . The method of claim 1 wherein the mono-aromatic polyamine curative comprises dimethylthiotoluenediamine, monomethylthiotoluenediamine, or both and the polyamine curative having two or more aromatic rings comprises 4,4′-methylene-bis-o-chloroaniline, 4,4′-methylene-bis-(3-chloro-2,6-diethylaniline), or both.

5 . The method of claim 1 wherein the mole ratio of the mono-aromatic polyamine curative to polyamine curative having two or more aromatic rings is 25:75 to 75:25.

6 . The method of claim 1 wherein the multiple polishing layers are characterized by a ratio of viscous modulus (G″) at 104° C. to viscous modulus (G″) at 150° C. of at least greater than 5.

7 . The method of claim 1 wherein the specific gravity of the portion of the multiple polishing layers cut from the center portion of the polymer block is less than or equal to 95% of a calculated specific gravity for the mixture filled in the mold.

8 . The method of claim 1 wherein the polymer block has a thickness of at least 5 cm and a minimum dimension orthogonal to thickness of at least 10 cm.

9 . The method of claim 1 wherein the amount of the pre-expanded polymeric microsphere in the mixture is from 0.5 to 7.0 weight percent based on total weight of pre-polymer, curatives and pre-expanded polymeric microspheres.

10 . A method forming a plurality of polishing layers for use in chemical mechanical polishing pads comprising:
filling a mold with a mixture comprising an isocyanate-functional pre-polymer, pre-expanded fluid filled polymer microspheres, a curative blend comprising a mono-aromatic polyamine curative and polyamine curative having two or more aromatic rings where the mixture is characterized by heat being released from reaction of the isocyanate-functional pre-polymer and the curatives; curing the mixture in the filled mold at a cure temperature to form a polymer block having a top edge, a bottom edge and a center the polymer block comprising a cured polymer matrix and expanding the pre-expanded fluid filled polymer microspheres to form ultra-expanded polymeric microspheres, the expanding being caused by the heat from the cure and the heat released from the reaction between the isocyanate-functional pre-polymer and the curative blend the mono-aromatic polyamine curative and polyamine curative having two or more aromatic rings wherein the mixture remains soft in a center portion of the polymer block for a time to enable the expanding of the pre-expanded fluid filled polymer microspheres; setting the mixture with ultra-expanded microspheres to prevent further expansion and to avoid rupture or collapse of the ultra-expanded microspheres, and cutting the polymer block to form multiple polishing layers that include the ultra-expanded microspheres, wherein at least ten of the multiple polishing layers cut from the center between the top edge and the bottom edge have a specific gravity that varies by less than 0.02 g/cm3 or less than 3% among the at least ten polishing layers.

Assignees

• Rohm & Haas Elect Materials Cmp Holdings Inc

Inventors

• Chiou Nan-Rong

Classifications

• B29C39/38 Primary

  Heating or cooling · CPC title

• B29K2075/00

  Use of {PU, i.e.} polyureas or polyurethanes {or derivatives thereof}, as moulding material · CPC title

• B29L2031/736

  Grinding or polishing equipment · CPC title

• B29L2009/00

  Layered products · CPC title

• B29C69/001

  a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts (for reinforced material B29C70/545; B29C49/4278, B29C51/268 take precedence) · CPC title