Wafer cleaning apparatus

Patent metadata

Field	Value
Publication number	US-12544807-B2
Application number	US-202218714472-A
Country	US
Kind code	B2
Filing date	Nov 24, 2022
Priority date	Nov 29, 2021
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

A wafer cleaning apparatus provided by the present invention comprises a rotary shaft, a chuck arranged on the top of the rotary shaft for retaining the wafer, a fixed shaft coaxially passed through the rotary shaft, and an upper end cover and a lower end cover that block the top and bottom of the fixed shaft respectively. Wherein, the fixed shaft is a hollow shaft with at least one circle of exhaust holes provided on the wall of the fixed shaft. The lower end cover is arranged with a gas inlet port, through which a protective gas is provided to the interior of the fixed shaft. The protective gas forms a positive pressure in the annular space between the fixed shaft and the rotary shaft through the at least one circle of exhaust holes. The present invention provides positive pressure protective gas to the spacing between the fixed shaft and the rotary shaft by opening exhaust holes on the wall of the fixed shaft. A gas seal is formed to prevent contaminants, such as particles and metals, generated in the bottom area of the rotary shaft from diffusing to the back side of the wafer through the annular space between the fixed shaft and the rotary shaft, thereby improving the cleanliness of the back side of the wafer after cleaning.

First claim

The invention claimed is:

1 . A wafer cleaning apparatus, comprising:
a rotary shaft, the top of the rotary shaft being provided with a chuck for holding a wafer; a driving mechanism, driving the rotary shaft to rotate; a fixed shaft, coaxially passing through the rotary shaft, with an annular space between the fixed shaft and the rotary shaft, the fixed shaft being a hollow shaft; an upper end cover, blocking the top of the fixed shaft; a lower end cover, blocking the bottom of the fixed shaft; wherein the wall of the fixed shaft is provided with at least one circle of exhaust holes, and the lower end cover is configured with a gas inlet port through which a protective gas is provided to the interior of the fixed shaft, and the protective gas forms a positive pressure in the annular space between the fixed shaft and the rotary shaft via said at least one circle of exhaust holes.

2 . The wafer cleaning apparatus according to claim 1 , wherein each circle of the exhaust holes is disposed at equal spacing along the circumference of the fixed shaft and inclined downward.

3 . The wafer cleaning apparatus according to claim 2 , wherein the angle between each said exhaust hole and the axis of the fixed shaft is 30° to 60°.

4 . The wafer cleaning apparatus according to claim 1 , wherein the number of exhaust holes per circle is 40 to 60.

5 . The wafer cleaning apparatus according to claim 1 , wherein the gas velocity of the protective gas released through the exhaust holes is more than 3 m/s.

6 . The wafer cleaning apparatus according to claim 1 , wherein the gas pressure of the protective gas passed into the fixed shaft is not less than 30 psi.

7 . The wafer cleaning apparatus according to claim 1 , wherein the fixed shaft is provided with at least two circles of exhaust holes.

8 . The wafer cleaning apparatus according to claim 7 , wherein the fixed shaft is provided with at least three circles of exhaust holes.

9 . The wafer cleaning apparatus according to claim 8 , wherein the closer the two adjacent circles of exhaust holes are to the lower end of the fixed shaft, the smaller the axial spacing between the two adjacent circles of exhaust holes.

10 . The wafer cleaning apparatus according to claim 1 , further comprising:
a liquid inlet port, configured in the lower end cover, a liquid inlet tube, provided inside the fixed shaft; a back side nozzle, disposed on the upper end cover and connected to the liquid inlet port via the liquid inlet tube for supplying cleaning liquid to the back side of the wafer, a front side nozzle, supplying cleaning liquid to the front side of the wafer.

Assignees

• Acm Research Shanghai Inc

Inventors

• He Xideng
• Han Yang
• Zhong Zhaoming
• Huang Tianyu
• Zhao Yunxiang
• Tao Xiaofeng
• Deng Xinping
• Jia Shena
• Wang Hui

Classifications

• H10P72/7626 Primary

  characterised by the construction of the shaft · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/76

  using mechanical means, e.g. clamps or pinches · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title