Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-12544803-B2
Application number	US-202318228297-A
Country	US
Kind code	B2
Filing date	Jul 31, 2023
Priority date	Oct 6, 2022
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

The technical scope of the present disclosure provides a substrate processing apparatus including a first supply unit and a second supply unit each configured to spray a fluid onto a substrate seated on a substrate support unit, wherein the first supply unit includes a first supporter that is connected to a first support shaft configured to rotate so that the first supporter rotates integrally with the first support shaft; a connection member connected to the first supporter and bent by a first angle in a direction parallel to an upper surface of the substrate; and a first nozzle connected to the connecting member and bent at a predetermined angle toward the substrate, and the first supporter is configured to rotate by a second angle in a direction parallel to the upper surface of the substrate.

First claim

What is claimed is:

1 . A substrate processing apparatus comprising a first supply unit and a second supply unit each configured to spray a fluid onto a substrate seated on a substrate support unit,
wherein the first supply unit includes: a first supporter that is connected to a first support shaft configured to rotate so that the first supporter rotates integrally with the first support shaft; a connection member connected to the first supporter and bent by a first angle long a plane parallel to an upper surface of the substrate when the substrate is seated on the substrate support unit; and a first nozzle connected to the connection member and bent at a predetermined angle toward the substrate, wherein the first supporter and the connection member form a first arm that is bent between the first support shaft the first nozzle, wherein the first supporter is configured to rotate by a second angle along the plane parallel to the upper surface of the substrate when the substrate is seated on the substrate unit, wherein the second supply unit includes: a second supporter that is connected to a second support shaft configured to rotate so that the second supporter rotates integrally the second support shaft; and a second nozzle connected to second supporter and bent a predetermined angle toward the substrate, and wherein the second supporter forms a second arm that together with the second nozzle is straight, from a top view, from the second support shaft to a discharge end of the second nozzle.

2 . The substrate processing apparatus of claim 1 , wherein the second nozzle is configured to supply isopropyl alcohol (IPA), xylene, or a mixture of IPA and hydrofluoroether (HFE) onto the substrate.

3 . The substrate processing apparatus of claim 1 , wherein the second supporter is configured to rotate by a third angle along the plane parallel to the upper surface of the substrate, wherein the second angle is greater than the first angle, and wherein the first supporter is rotated by the second angle, and the second supporter is rotated by the third angle, spray fluid sprayed from the first nozzle and spray fluid sprayed by the second nozzle are sprayed to the same target region of the substrate when the substrate is seated on the support unit.

4 . The substrate processing apparatus of claim 1 , wherein the first angle is greater than 0 degrees and less than 90 degrees.

5 . The substrate processing apparatus of claim 1 , wherein the second angle is greater than 0 degrees and less than 90 degrees.

6 . The substrate processing apparatus of claim 1 , wherein
the substrate support unit is configured to rotate in one direction, and the first nozzle is disposed to spray a first fluid in the same direction as the rotation direction of the substrate support unit.

7 . The substrate processing apparatus of claim 6 , wherein the fluid is deionized water (DIW).

8 . The substrate processing apparatus of claim 1 , wherein
the first nozzle is configured to be disposed above a target region of the substrate when the substrate is seated on the support unit, and the target region has a circular shape having a second radius on the upper surface of the substrate, which has a disc shape with a first radius.

9 . The substrate processing apparatus of claim 8 , wherein the first radius is in a range of about 100 mm to about 500 mm, and the second radius is in a range of about 50 mm to about 300 mm,
wherein the second radius is less than the first radius.

10 . A substrate processing apparatus comprising a first supply unit and a second supply unit each configured to spray a fluid onto a substrate seated on a substrate support unit,
wherein the first supply unit includes: a first supporter that is connected to a first support shaft configured to rotate so that the first supporter rotates integrally with the first support shaft; a first connection member connected to the first supporter and bent by a first angle along a plane parallel to an upper surface of the substrate when the substrate is seated on the substrate support unit; a second connection member bent by a second angle along the plane parallel to the upper surface of the substrate when the substrate is seated on the substrate support unit; a second supporter disposed between the first connection member and the second connection member to connect the first connection member to the second connection member; a first nozzle connected to the second connection member and bent at a predetermined angle toward the substrate, and the first supporter is configured to rotate by a third angle along a plane parallel to the upper surface of the substrate when the substrate is seated on the substrate support unit, wherein the first supporter, the first connection member, the second supporter, and the second connection member form a first arm that is bent between the first support shat and the first nozzle, and wherein the second supply unit includes; a third supporter that is connected to a second support shaft configured to rotate so that the third supporter rotates integrally with the second support shaft; and a second nozzle connected to the third supporter and bent at a predetermined angle toward the substrate, wherein the third supporter forms a second arm that together with the second nozzle is straight, from a top view, from the second support shaft to a discharge end of the second nozzle.

11 . The substrate processing apparatus of claim 10 , wherein the third supporter is configured to rotate by a fourth angle along a plane parallel to the upper surface of the substrate when the substrate is seated on the substrate support unit, and the fourth angle is greater than the third angle, and wherein when the first supporter is rotated by the third angle, and the third supporter is rotated by the fourth angle, spray fluid sprayed from the first nozzle and spray fluid sprayed by the second nozzle are sprayed to the same target region of the substrate.

12 . The substrate processing apparatus of claim 10 , wherein the second nozzle is configured to supply IPA, xylene, or a mixture of IPA and HFE onto the substrate.

13 . The substrate processing apparatus of claim 10 , wherein the substrate support unit is configured to rotate in one direction,
wherein the first nozzle is disposed to spray a first fluid in the same direction as the rotation direction of the substrate support unit.

14 . The substrate processing apparatus of claim 13 , wherein the first fluid includes DIW.

15 . The substrate processing apparatus of claim 11 , wherein the first nozzle is configured to be disposed on a target region of the substrate when seated on the support unit, wherein
the target region has a circular shape having a second radius on the upper surface of the substrate, which has a disk shape with a first radius.

16 . The substrate processing apparatus of claim 15 , wherein the first radius is in a range of about 100 mm to about 500 mm, and the second radius is in a range of about 50 mm to about 300 mm,
wherein the second radius is less than the first radius.

17 . A substrate processing apparatus comprising a first supply unit and a second supply unit each configured to spray a fluid onto a substrate seated on a substrate support unit,
wherein the first supply unit includes: a first supporter that is connected to a first support shaft configured to rotate so that the first supporter rotates integrally with the first support shaft; a connection member connected to the first supporter and bent by a first angle greater

Assignees

• Semes Co Ltd

Inventors

• Na Seungeun
• Kim Kyungmin
• Song Sinae
• Jeong Hojin
• Park Jungeun

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• B08B3/08

  the liquid having chemical or dissolving effect · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• B08B3/022 Primary

  Cleaning travelling work (B08B3/042 takes precedence) · CPC title

• B08B3/024

  Cleaning by means of spray elements moving over the surface to be cleaned · CPC title