Two component (2K) curable adhesive composition

Patent metadata

Field	Value
Publication number	US-12540262-B2
Application number	US-202217839006-A
Country	US
Kind code	B2
Filing date	Jun 13, 2022
Priority date	Dec 13, 2019
Publication date	Feb 3, 2026
Grant date	Feb 3, 2026

Abstract

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprising: a first curing agent for the monomers of said first part; a second curing agent for the monomers of said first part; and, a solubilizer.

First claim

What is claimed is:

1 . A curable and debondable two-part adhesive composition comprising:
a first part comprising (meth)acrylate monomer; co-polymerizable acid; and an electrolyte; and a second part comprising a first curing agent for the (meth)acrylate monomers of said first part; a second curing agent for the (meth)acrylate monomer of said first part; and a solubilizer, wherein said first part and/or said second part further comprise electrically conductive particles selected from the group consisting of carbon black, silver and mixtures thereof.

2 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said (meth)acrylate monomer is selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl(meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl(meth)acrylate, 2-ethylhexyl-(meth)acrylate, nonyl (meth) acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl(meth)acrylate, stearyl(meth)acrylate, glycidyl (meth)acrylate, isobornyl (meth)acrylate, 2-aminoethyl (meth)acrylate, y-(meth)acryloyloxypropyl trimethoxysilane, (meth)acrylic acid-ethylene oxide adduct, trifluoromethylmethyl (meth)acrylate, 2-trifluoromethylethyl (meth)acrylate, 2-perfluoro ethylethyl (meth)acrylate, 2-perfluoroethyl-2-perfluorobutylethyl (meth)acrylate, 2-perfluoroethyl (meth)acrylate, perfluoromethyl (meth)acrylate, diperfluoromethylmethyl (meth)acrylate, 2-perfluoromethyl-2-perfluoroethylmethyl (meth)acrylate, 2-perfluorohexylethyl (meth)acrylate, 2-perfluorodecylethyl (meth)acrylate, 2-perfluorohexadecylethyl (meth)acrylate, ethoxylated trimethylolpropane triacrylate, trimethylol propane trimethacrylate, dipentaerythritol monohydroxypentacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, 1,6-hexanedioldiacrylate, neopentyl glycoldiacrylate, pentaerythritol tetraacrylate, 1,2-butylene glycoldiacrylate, trimethylopropane ethoxylate tri(meth)acrylate, glyceryl propoxylate tri(meth) acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, tripropylene glycol di(meth)acrylate, neopentylglycol propoxylate di(meth)acrylate, 1,4-butanediol di(meth)acrylate, polyethyleneglycol di(meth)acrylate, triethyleneglycol di(meth)acrylate, butylene glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate and mixtures thereof.

3 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said (meth)acrylate monomer component is present in an amount of from 20 to 80% by weight of the total weight of the first part.

4 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said co-polymerizable acid is selected from the group consisting of methacrylic acid, acrylic acid, itaconic acid, maleic acid, aconitic acid, crotonic acid, fumaric acid and mixtures thereof.

5 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said copolymerisable acid is present in an amount of from 0.25 to 20% by weight of the total weight of the first part.

6 . A curable and debondable two-part adhesive composition comprising:
a first part comprising (meth)acrylate monomer; co-polymerizable acid; and an electrolyte; and a second part comprising a first curing agent for the (meth)acrylate monomers of said first part; a second curing agent for the (meth)acrylate monomer of said first part; and a solubilizer, wherein said electrolyte is selected from the group consisting of 1-ethyl-3-methylimidazolium methansulfonate, 1-ethyl-3-methylimidazolium methyl sulfate, 1-hexyl-3-methylimidazolium 2-(2-fluoroanilino)-pyridinate, 1-hexyl-3-methylimidazolium imide, 1-butyl-1-methyl-pyrrolidinium 2-(2-fluoroanilino)-pyridinate, 1-butyl-1-methyl-pyrrolidinium imide, trihexyl (tetradecyl) phospholium 2-(2-fluoroanilino)-pyridinate, cyclohexyltrimethylammonium bis (trifluormethylsulfonyl) imide, di (2-hydroxyethyl) ammonium trifluoroaetate, N,N-dimethyl (2-hydroxyethyl) ammonium octanoate, methyltrioctylammonium bis (trifluoromethylsulfonyl) imide, N-ethyl-N—N—N—N-tetramethylguanidinium trifluorometanesulfonate, guanidinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-buthyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-hydroxymethylpyridinium ethylsulfate, 1-butyl-1-methylpyrrolidinium bis (trifluoromethylsulfonyl) imide, 1-butyl-methylpyrrolidinium tris (pentafluoroethyl) trifluorophosphate, 3-methyl imidazolium ethylsulfate, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-ethyl-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium chloride, 1-octyl-3-methylimidazolium chloride, 1-methyl-3-octylimidazolium chloride, 1-propyl-3-methylimidazolium iodide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-2, 3-dimethylimidazolium tetrafluoroborate, 1-butyl-2,3-dimethylimidazolium hexafluorophosphate, 1-butylimidazol, 1-methylimidazolium tetrafluoroborate, tetrabutylphosphonium tris(pentafluoroethyl) trifluorophosphate, trihexyl (tetradecyl) phosphonium tetrafluoroborate and mixtures thereof.

7 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said electrolyte is present in an amount of from 2.5 to 25% by weight of the total weight of the first part.

8 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said first curing agent is a peroxide curing agent,
said peroxide curing agent selected from the group consisting of tert-butyl peroxide, tert-butyl perbenzoate, cumene hydroperoxide, tert-butyl peroxybenzoate, diacetyl peroxide, benzoyl peroxide, tert-butyl peracetate, lauryl peroxide and mixtures thereof.

9 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said first curing agent is present in an amount of from 25 to 75% by weight of the total weight of the second part.

10 . A curable and debondable two-part adhesive composition comprising:
a first part comprising (meth)acrylate monomer; co-polymerizable acid; and an electrolyte; and a second part comprising a first curing agent for the (meth)acrylate monomers of said first part; a second curing agent for the (meth)acrylate monomer of said first part; and a solubilizer, wherein said second curing agent is a metal compound selected from salts and complexes of iron, copper, cobalt, vanadium and manganese.

11 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said second curing agent is present in an amount of from 0.01 to 5% by weight of the total weight of the second part.

12 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said solubilizer is polyethylene glycol or epoxy resin selected from the group consisting of cycloaliphatic epoxides, epoxy novolac resins, bisphenol-A-epoxy resins, bisphenol-F-epoxy resins, bisphenol-A epichlorohydrin based epoxy resins, alkyl epoxides, limonene dioxides, polyepoxides and mixtures thereof.

13 . A curable and debondable two-part adhesive composition according to claim 1 , wherein said solubilizer is present in an amount of from 20 to 45% by weight of the total weight of the second par

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Stapf Stefanie
• Lieske Alexandra
• Gutierrez Diaz Jordan
• Moeller Thomas

Classifications

• C09J2463/00

  Presence of epoxy resin · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J133/02

  Homopolymers or copolymers of acids; Metal or ammonium salts thereof · CPC title

• B32B2307/54

  Yield strength; Tensile strength · CPC title

• B32B2250/02

  2 layers · CPC title