Thermoset injection into fused filament fabrication parts with discontinuous and/or continuous reinforcement

US12539664B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12539664-B2
Application numberUS-202418644252-A
CountryUS
Kind codeB2
Filing dateApr 24, 2024
Priority dateApr 24, 2023
Publication dateFeb 3, 2026
Grant dateFeb 3, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods of infiltrating a three-dimensional part with a resin are disclosed. The methods include designing a part to be printed, the part having at least one inlet and an infill pattern. The methods include using three-dimensional printing to print the designed part. The methods further include infiltrating the printed part using a resin delivered to an interior of the part via the at least one inlet to surround the infill pattern with the resin. The methods additionally include allowing the infiltrated resin to cure.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of infiltrating a three-dimensional part with a resin, comprising: designing a part to be printed, the part having an inlet and infill patterns comprising one or more of a triangular infill, a hexagonal infill, a rectangular infill, and a gyroid infill, wherein the infill patterns further comprise surface patterning features extending along at least one channel thereof in a Z-direction of the part; using three-dimensional printing to print the designed part; infiltrating the printed part using a resin delivered to an interior of the part via the inlet to surround the infill patterns with the resin; and allowing the infiltrated resin to cure. 2 . The method of claim 1 , further comprising pausing the printing of the part prior to infiltrating with the resin. 3 . The method of claim 1 , further comprising inserting one or more Z-direction reinforcement layers into the part. 4 . The method of claim 3 , wherein the one or more Z-direction reinforcement layers comprises a filament or fiber. 5 . The method of claim 4 , wherein the filament or fiber comprises one or more of raw carbon fiber, carbon fiber impregnated with a thermoset resin, carbon fiber impregnated with a thermoplastic matrix, aramid fibers, and fibers impregnated with a polymer. 6 . The method of claim 5 , wherein the insertion of the one or more Z-direction reinforcement layers into the part takes place while the printing of the part is paused, further comprising resuming the printing of the part following the insertion of the one or more Z-direction reinforcement layers. 7 . The method of claim 1 , wherein the resin is a thermoset resin or a thermoplastic resin. 8 . The method of claim 7 , wherein the thermoset resin is one or more of epoxies, phenolic resins, UV curing resins, polyesters, vinylesters, polyamide resins, bismaleimide resins, rubbers, and mixtures thereof. 9 . The method of claim 7 , wherein the thermoplastic resin is one or more of acrylonitrile butadiene styrene (ABS), acrylic, high density polyethylene (HDPE), polypropylene, polyethylene, polystyrene, polyvinylchloride (PVC), styrene, polycarbonate, nylon, acetal, and poly(tetrafluoroethylene) (FTFE). 10 . The method of claim 1 , wherein the resin has a viscosity between about 1,500 cP to 15,000 cP during the infiltration. 11 . The method of claim 1 , wherein the resin is neat. 12 . The method of claim 1 , wherein the resin comprises one or more additives. 13 . The method of claim 12 , wherein the one or more additives include carbon fibers, glass, ceramics, metals, minerals, or mixtures thereof. 14 . The method of claim 12 , wherein the one or more additives are in the form of rods, fibers, cones, tubes, platelets, spheres, or mixtures thereof. 15 . The method of claim 1 , wherein the resin provides for the part with less than 0.2% linear shrinkage in a linear dimension upon said curing of the resin. 16 . The method of claim 1 , wherein the surface patterning features of the infill patterns comprise one or more of undulating surfaces, triangular patterns, hexagonal patterns, offset infill patterns, or variable width channels. 17 . The method of claim 1 , wherein the infiltrating of the part with resin occurs on a multi-axis print bed with five degrees of freedom. 18 . The method of claim 1 , wherein the inlet is one of a plurality of inlets of the part. 19 . A method of infiltrating a three-dimensional part with a resin, comprising: using three-dimensional printing to print a designed part having reinforcement in an X-Y plane and infill patterns comprising one or more of a triangular infill, a hexagonal infill, a rectangular infill, and a gyroid infill, wherein the infill patterns further comprise surface patterning features extending along at least one channel thereof in a Z-direction of the part; printing continuous reinforcement in a Z-direction across one or more layers of the part; printing a final layer including an inlet and an outlet of the part; infiltrating the printed part using a resin delivered to an interior of the part via the inlet to surround the reinforcement in the X-Y plane, the continuous reinforcement in the Z-direction, and the infill patterns with the resin; and allowing the infiltrated resin to cure. 20 . The method of claim 19 , wherein the inlet is one of the plurality of inlets of the part, and wherein the outlet of one of a plurality of outlets of the part.

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What does patent US12539664B2 cover?
Methods of infiltrating a three-dimensional part with a resin are disclosed. The methods include designing a part to be printed, the part having at least one inlet and an infill pattern. The methods include using three-dimensional printing to print the designed part. The methods further include infiltrating the printed part using a resin delivered to an interior of the part via the at least one…
Who is the assignee on this patent?
Markforged Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/118. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 03 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).