Heating oven and method of use

US12539659B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12539659-B2
Application numberUS-202117999453-A
CountryUS
Kind codeB2
Filing dateJun 25, 2021
Priority dateJun 25, 2020
Publication dateFeb 3, 2026
Grant dateFeb 3, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Ways to produce a plurality of preform ( 5 ) temperature profiles are provided that employ systems having a first heating means, a second heating means, and a first transfer means. The a first heating means has a first preform ( 5 ) path, imparts a first temperature profile to a preform ( 5 ) passing through the first preform ( 5 ) path, and has a first dispensing means configured to selectively dispense the preform ( 5 ) passing through at least a portion of the first preform ( 5 ) path. The second heating means has a second preform ( 5 ) path, imparts a second temperature profile to a preform ( 5 ) passing through the second preform ( 5 ) path, and has a second dispensing means configured to selectively dispense the preform ( 5 ) passing through at least a portion of the second preform ( 5 ) path. The first transfer means selectively transfers a preform ( 5 ) between the first preform ( 5 ) path and the second preform ( 5 ) path.

First claim

Opening claim text (preview).

What is claimed is: 1 . A system for producing a plurality of preform temperature profiles, the system comprising: a first heating means having a first preform path, the first preform path defined by a first transport system including a first conveyer element formed into a first closed loop, wherein the first heating means includes one or more first infrared ovens configured to impart a first temperature profile to a preform passing through at least a portion of the first preform path, the first heating means including a first dispensing means configured to selectively dispense the preform passing through at least a portion of the first preform path away from the first preform path and towards a blow molding system; a second heating means having a second preform path, the second preform path defined by a second transport system including a second conveyer element formed into a second closed loop, wherein the second heating means includes one or more second infrared ovens configured to impart a second temperature profile to a preform passing through at least a portion of the second preform path with the second temperature profile different from the first temperature profile by way of one or both of a number of the first infrared ovens being different from a number of the second infrared ovens or a length of the first preform path being different from a length of the second preform path, the second heating means including a second dispensing means configured to selectively dispense the preform passing through at least a portion of the second preform path away from the second preform path and towards a blow molding system; and a first transfer means configured to selectively transfer a preform between the first preform path of the first heating means and the second preform path of the second heating means one or more times such that the transferred preform is heated by each of the first heating means and the second heating means at least once before being dispensed towards the blow molding system, wherein a number of times the transferred preform is heated by each of the first heating means and the second heating means in combination is variably based upon characteristics of the transferred preform. 2 . The system of claim 1 , wherein the first dispensing means includes a first transfer wheel. 3 . The system of claim 2 , wherein the second dispensing means includes a second transfer wheel. 4 . The system of claim 1 , wherein the first transfer means includes a transfer wheel. 5 . The system of claim 1 , wherein a quantity of the second infrared ovens is greater than a quantity of the first infrared ovens. 6 . The system of claim 1 , wherein the second preform path is longer than the first preform path. 7 . The system of claim 1 , further comprising a first preform loader configured to deliver unheated preforms to the first heating means. 8 . The system of claim 7 , further comprising a second perform loader configured to deliver unheated preforms to the second heating means. 9 . The system of claim 1 , further comprising: a third heating means having a third preform path, the third heating means configured to impart a third temperature profile to a preform passing through the third preform path, the third heating means including a third dispensing means configured to selectively dispense the preform passing through at least a portion of the third preform path; and a second transfer means configured to selectively transfer a preform between the second preform path of the second heating means and the third preform path of the third heating means. 10 . The system of claim 9 , further comprising a first preform loader configured to deliver unheated preforms to the first heating means, a second perform loader configured to deliver unheated preforms to the second heating means, and a third preform loader configured to deliver unheated preforms to the third heating means.

Assignees

Inventors

Classifications

  • Containers; Packaging elements or accessories, Packages (closures therefor B29L2031/56; ink or toner cartridges B29L2031/7678; squeeze tubes B29L2023/20; suitcases B29L2031/7418) · CPC title

  • the preform having one end closed · CPC title

  • Injection blow-moulding · CPC title

  • not using inherent heat of the preform, i.e. 2 step blow moulding · CPC title

  • characterised by the path, e.g. sinusoidal path · CPC title

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What does patent US12539659B2 cover?
Ways to produce a plurality of preform ( 5 ) temperature profiles are provided that employ systems having a first heating means, a second heating means, and a first transfer means. The a first heating means has a first preform ( 5 ) path, imparts a first temperature profile to a preform ( 5 ) passing through the first preform ( 5 ) path, and has a first dispensing means configured to selectivel…
Who is the assignee on this patent?
Discma Ag
What technology area does this patent fall under?
Primary CPC classification B29C49/42073. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 03 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).