Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components

Patent metadata

Field	Value
Publication number	US-12539539-B2
Application number	US-202017636082-A
Country	US
Kind code	B2
Filing date	Aug 7, 2020
Priority date	Aug 26, 2019
Publication date	Feb 3, 2026
Grant date	Feb 3, 2026

Abstract

Provided are silver particles including a silver powder and a silver layer that includes primary particles, the primary particles being smaller than the silver powder.

First claim

The invention claimed is:

1 . A paste composition comprising:
a plurality of silver particles that each include: a silver powder, wherein the silver powder has an average particle diameter (D50) of 1.59 to 2.45 μm, wherein the plurality of silver particles have a tap density from 4.0 to 7.0 g/cm 3 and a specific surface area from 0.5 to 1.5 m 2 /g as determined by the BET method; an organic protecting compound, wherein a compounded amount of the organic protecting compound is from 1 to 5 mmol per mole of silver particles in the paste composition; and a silver layer, wherein the silver layer includes primary particles that are smaller than the silver powder and the primary particles have a mean particle size of 20-50 nm; a thermosetting resin, wherein the thermosetting resin is between 5 to 18 parts by mass relative to 100 parts by mass of the plurality of the silver particles; and a diluent, wherein the diluent is between 4 and 10 parts by mass relative to 100 parts by mass of the plurality of the silver particles, and wherein the diluent consists essentially of 3,5-dimethyl-1-adamantanamine; wherein the paste composition has a volume resistivity of 0.9-27 μΩ*cm.

2 . The paste composition according to claim 1 , wherein the silver layer is formed by a liquid phase reduction method.

3 . The paste composition according to claim 1 , wherein the silver layer is formed by mixing a silver powder (A), a silver compound (B), and a reducing compound (C) in a liquid phase.

4 . The paste composition according to claim 3 , wherein the silver powder (A) is formed by an atomization method, an electrolysis method, or a chemical reduction method.

5 . The paste composition according to claim 3 , wherein the silver compound (B) is at least one selected from a group consisting of silver nitrate, silver chloride, silver acetate, silver oxalate, and silver oxide.

6 . The paste composition according to claim 1 , wherein the organic protecting compound is at least one selected from a group consisting of a carboxylic acid, an alkylamine, and a carboxylic acid amine salt.

7 . A semiconductor device formed by bonding using the paste composition described in claim 1 .

8 . Electrical and/or electronic components formed by bonding using the paste composition described in claim 1 .

9 . The paste composition of claim 1 , wherein the diluent consists of 3,5-dimethyl-1-adamantanamine.

Assignees

• Kyocera Corp

Inventors

• Nitanai Yuya
• Fujiwara Masakazu

Classifications

• C22C5/06

  Alloys based on silver · CPC title

• C22C1/0466 Primary

  Alloys based on noble metals · CPC title

• B22F1/054

  Nanosized particles · CPC title

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• B22F1/17 Primary

  Metallic particles coated with metal · CPC title