Ultrasonic transducer, fabrication method thereof and electronic device

Patent metadata

Field	Value
Publication number	US-12538077-B2
Application number	US-202218021544-A
Country	US
Kind code	B2
Filing date	May 27, 2022
Priority date	May 27, 2022
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

Provides are an ultrasonic transducer, a fabrication method thereof and an electronic device. The ultrasonic transducer includes: an array substrate having a groove, a bottom electrode and an insulation layer, wherein an orthographic projection of the groove on the array substrate is within an orthographic projection of the bottom electrode on the array substrate, and the insulation layer covers the bottom electrode; and an opposite substrate, the opposite substrate and the array substrate are oppositely arranged and are attached to each other, the opposite substrate and the array substrate form a cavity in the groove, the opposite substrate has a top electrode and a vibrating diaphragm layer which are arranged in stack, and an orthographic projection of the top electrode on the array substrate is within the orthographic projection of the bottom electrode on the array substrate.

First claim

What is claimed is:

1 . An ultrasonic transducer, comprising:
an array substrate comprising a groove, a bottom electrode and an insulation layer, wherein an orthographic projection of the groove on the array substrate is within an orthographic projection of the bottom electrode on the array substrate, and the insulation layer covers the bottom electrode; and an opposite substrate, wherein the opposite substrate and the array substrate are oppositely arranged and are attached to each other, the opposite substrate and the array substrate form a cavity in the groove, the opposite substrate comprises a top electrode and a vibrating diaphragm layer which are arranged in stack, and an orthographic projection of the top electrode on the array substrate is within the orthographic projection of the bottom electrode on the array substrate; wherein the array substrate further comprises a base substrate, the base substrate comprises the groove, the bottom electrode is at a bottom of the groove, the insulation layer is on a side of the bottom electrode facing the opposite substrate, and a depth of the groove is greater than a sum of thicknesses of the bottom electrode and the insulation layer.

2 . The ultrasonic transducer according to claim 1 , wherein the top electrode is on a side facing away from the array substrate, of the vibrating diaphragm layer, or the top electrode is on a side facing the array substrate, of the vibrating diaphragm layer.

3 . The ultrasonic transducer according to claim 2 , wherein a material of the vibrating diaphragm layer is glass, Polyimide (PI), or Polyethylene Terephthalate (PET).

4 . The ultrasonic transducer according to claim 1 , wherein a material of the base substrate is glass.

5 . The ultrasonic transducer according to claim 4 , wherein a material of the vibrating diaphragm layer is PI or PET, and the vibrating diaphragm layer and the base substrate are fixedly attached through a first adhesive layer,
or a material of the vibrating diaphragm layer is glass, the vibrating diaphragm layer and the base substrate are fixedly attached through a first adhesive layer, or the vibrating diaphragm layer and the base substrate are fixedly attached through a bonding technology.

6 . The ultrasonic transducer according to claim 1 , wherein a size of the top electrode is smaller than or equal to a size of the bottom electrode.

7 . The ultrasonic transducer according to claim 1 , wherein a shape of the groove comprises circle, square and polygon.

8 . The ultrasonic transducer according to claim 1 , wherein the array substrate comprises a device region and a surrounding region arranged surrounding the device region, a plurality of grooves are distributed in an array, the plurality of grooves are in the device region, the bottom electrodes are in one-to-one correspondence with the grooves, and the top electrodes are in one-to-one correspondence with the bottom electrodes, wherein
any two adjacent top electrodes are mutually electrically connected; and the plurality of bottom electrodes are divided into a plurality of regions, any two adjacent bottom electrodes in a same region are mutually electrically connected, and any two adjacent bottom electrodes in different regions are mutually insulated.

9 . The ultrasonic transducer according to claim 8 , wherein all the bottom electrodes in the same column are mutually electrically connected, and the bottom electrodes in different columns are mutually independent; or,
the plurality of bottom electrodes are divided into a plurality of blocky regions, all the bottom electrodes located in the same blocky region are mutually electrically connected, and the bottom electrodes located in the different blocky regions are mutually independent; or, the plurality of bottom electrodes are divided into a middle region and a peripheral region surrounding the middle region, all the bottom electrodes in the middle region are mutually electrically connected, all the bottom electrodes in the peripheral region are mutually electrically connected, and the bottom electrodes in the middle region are independent of the bottom electrodes in the peripheral region.

10 . The ultrasonic transducer according to claim 9 , wherein the array substrate further comprises first leads electrically connected with the bottom electrodes;
the first leads are led out from side walls of the grooves and extend to a first binding region of the surrounding region; or, in positions of the base substrate corresponding to the bottom electrodes, the base substrate has via holes penetrating through the base substrate in a thickness direction of the base substrate, and the first leads are led out from the via holes and extend to the first binding region.

11 . The ultrasonic transducer according to claim 10 , wherein the array substrate further comprises: a first connecting electrode in the surrounding region and arranged on a layer same as the layer where the bottom electrodes are, and a second lead electrically connected with the first connecting electrode; and the opposite substrate further comprises a second connecting electrode in the surrounding region, arranged on a layer as the top electrodes and electrically connected with the top electrodes, the top electrodes are electrically connected with the first connecting electrode through the second connecting electrode, and the second lead is led out and extends to the first binding region.

12 . The ultrasonic transducer according to claim 10 , wherein the opposite substrate comprises a third lead electrically connected with the top electrodes, and the third lead extends to a second binding region of the opposite substrate;
the first binding region and the second binding region are on opposite sides of the device region; or, the first binding region and the second binding region are on a same side of the device region, and an orthographic projection of the second binding region is between an orthographic projection of the device region and an orthographic projection of the first binding region.

13 . An electronic device, comprising: the ultrasonic transducer according to claim 1 .

14 . An ultrasonic transducer, comprising:
an array substrate comprising a groove, a bottom electrode and an insulation layer, wherein an orthographic projection of the groove on the array substrate is within an orthographic projection of the bottom electrode on the array substrate, and the insulation layer covers the bottom electrode; and an opposite substrate, wherein the opposite substrate and the array substrate are oppositely arranged and are attached to each other, the opposite substrate and the array substrate form a cavity in the groove, the opposite substrate comprises a top electrode and a vibrating diaphragm layer which are arranged in stack, and an orthographic projection of the top electrode on the array substrate is within the orthographic projection of the bottom electrode on the array substrate; wherein the array substrate further comprises: a base substrate, the bottom electrode located on the base substrate, the insulation layer located on a side facing away from the base substrate, of the bottom electrode, and a retaining wall structure located on a side facing away from the base substrate, of the insulation layer, wherein the retaining wall structure comprises the groove, and the groove penetrates through the retaining wall structure in a thickness direction of the retaining wall structure.

15 . The ultrasonic transducer according to claim 14 , wherein a material of the base substrate is glass, and a material of the retaining wall

Assignees

• Boe Technology Group Co Ltd

Inventors

• Han Yanling
• Liu Wenqu
• Yao Qi
• Wang Lei
• Huang Hua
• Li Zhuo
• Cao Yonggang
• Gou Yue
• Ji Yaqian
• Li Qianyan
• Wang Yingzi

Classifications

• H04R31/003

  for diaphragms or their outer suspension · CPC title

• H04R7/10 Primary

  comprising superposed layers in contact · CPC title

• B06B1/0292 Primary

  Electrostatic transducers, e.g. electret-type · CPC title