Antenna package and display device including the same

US12537311B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12537311-B2
Application numberUS-202217965932-A
CountryUS
Kind codeB2
Filing dateOct 14, 2022
Priority dateOct 14, 2021
Publication dateJan 27, 2026
Grant dateJan 27, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An antenna package includes an antenna device and a circuit board bonded to the antenna device. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.

First claim

Opening claim text (preview).

What is claimed is: 1 . An antenna package, comprising: an antenna device comprising: a dielectric layer; a radiator disposed on a top upper surface of the dielectric layer; a transmission line comprising a first transmission line and a second transmission line that extend in different directions on the top upper surface of the dielectric layer to be connected to the radiator and a lower parasitic element disposed to be adjacent to the transmission line and a lower portion of the radiator on the top upper surface of the dielectric layer and a circuit board bonded to the antenna device, the circuit board comprising: a core layer; a feeding line formed on the core layer and bonded to the antenna device; and a CPW (Co-planar waveguide) ground formed on the core layer to be physically separated from the feeding line, the antenna device and the lower parasitic element. 2 . The antenna package of claim 1 , wherein a spacing distance between the CPW ground and the feeding line is constant. 3 . The antenna package of claim 1 , wherein at least a portion of the CPW ground is farther away from the feeding line as the CPW ground becomes closer to the antenna device. 4 . The antenna package of claim 3 , wherein the CPW ground comprises: a first region having a constant spacing distance from the feeding line; and a second region that is farther away from the feeding line as the CPW ground becomes closer to the antenna device. 5 . The antenna package of claim 4 , wherein the second region has a stepped shape or a chamfer shape. 6 . The antenna package of claim 1 , wherein the antenna device further comprises: an upper parasitic element disposed to be adjacent to an upper portion of the radiator on the top surface of the dielectric layer. 7 . The antenna package of claim 6 , wherein the feeding line comprises: a first feeding line bonded to the first transmission line; and a second feeding line bonded to the second transmission line, wherein the CPW ground comprises: a central ground disposed between the first feeding line and the second feeding line; a first side ground facing the central ground with the first feeding line interposed therebetween; and a second side ground facing the central ground with the second feeding line interposed therebetween. 8 . The antenna package of claim 6 , wherein the CPW ground is disposed around the lower parasitic element. 9 . The antenna package of claim 8 , wherein a spacing distance between the CPW ground and the lower parasitic element in a plan view is 20 μm or more. 10 . The antenna package of claim 6 , wherein the radiator comprises convex portions and concave portions, and the first transmission line and the second transmission line are connected to different concave portions of the concave portions. 11 . The antenna package of claim 6 , wherein the first transmission line comprises: a first feeding portion; and a first bent portion extending from the first feeding portion to be connected to the radiator; wherein the second transmission line comprises: a second feeding portion; and a second bent portion extending from the second feeding portion to be connected to the radiator. 12 . The antenna package of claim 6 , wherein the upper parasitic element comprises a first upper parasitic element and a second upper parasitic element separated from each other. 13 . The antenna package of claim 12 , wherein the radiator comprises convex portions and concave portions, and the first upper parasitic element and the second upper parasitic element are adjacent to different concave portions of the concave portions. 14 . The antenna package of claim 13 , wherein the first upper parasitic element and the second upper parasitic element face each other with a convex portion located at an upper portion of the radiator among the convex portions interposed therebetween. 15 . The antenna package of claim 6 , wherein the lower parasitic element comprises: a central parasitic element disposed between the first transmission line and the second transmission line; a first side parasitic element facing the central parasitic element with the first transmission line interposed therebetween; and a second side parasitic element facing the central parasitic element with a second transmission line interposed therebetween. 16 . The antenna package of claim 15 , wherein the first side parasitic element comprises: a first parasitic body facing the central parasitic element with the first transmission line interposed therebetween; a first parasitic extension protruding from the first parasitic body; and a first parasitic bent portion extending from the first parasitic extension toward the radiator, wherein the second side parasitic element comprises: a second parasitic body facing the central parasitic element with the second transmission line interposed therebetween; a second parasitic extension protruding from the second parasitic body; and a second parasitic bent portion extending from the second parasitic extension toward the radiator. 17 . The antenna package of claim 16 , wherein the radiator has a mesh structure, and the central parasitic element, the first parasitic body and the second parasitic body have a solid structure. 18 . The antenna package of claim 17 , wherein a portion of the first transmission line between the central parasitic element and the first parasitic body has a solid structure, and a remaining portion of the first transmission line has a mesh structure, and a portion of the second transmission line between the central parasitic element and the second parasitic body has a solid structure, and a remaining portion of the second transmission line has a mesh structure. 19 . The antenna package of claim 16 , wherein the radiator has a mesh structure, and each of the central parasitic element, the first parasitic body and the second parasitic body comprises a mesh portion and a solid portion. 20 . An image display device comprising the antenna package of claim 1 .

Assignees

Inventors

Classifications

  • for horn or waveguide antennas · CPC title

  • Two or more parasitic elements · CPC title

  • H01Q1/38Primary

    formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

  • H01Q19/005Primary

    Patch antenna using one or more coplanar parasitic elements · CPC title

  • H01Q1/243Primary

    with built-in antennas · CPC title

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Frequently asked questions

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What does patent US12537311B2 cover?
An antenna package includes an antenna device and a circuit board bonded to the antenna device. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.
Who is the assignee on this patent?
Dongwoo Fine Chem Co Ltd, Kreemo Inc
What technology area does this patent fall under?
Primary CPC classification H01Q1/38. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 27 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).