Antenna apparatus

Patent metadata

Field	Value
Publication number	US-12537290-B2
Application number	US-202318204462-A
Country	US
Kind code	B2
Filing date	Jun 1, 2023
Priority date	Dec 2, 2020
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

The present disclosure relates to an antenna apparatus, and especially comprises: a main body module in which a main board is mounted; an RF module which is fixed to the front so that an intermediate outside air layer is formed between the RF module and the main body module, and in which an RF filter unit and an antenna element unit are mounted; and an amplification unit module which is disposed so as to be exposed in the intermediate outside air layer between the main body module and the RF module, and comprises an amplification unit substrate having analog amplification elements mounted thereon, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and back of the main body module, and heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer, and thus the advantage of enabling maximum heat dissipation performance is provided.

First claim

The invention claimed is:

1 . An antenna apparatus comprising:
a main body module in which a main board is embedded; a radio frequency (RF) module fixed to a front of the main body module so that an intermediate outside air layer is formed between the main body module and the RF module and having an RF filter unit and an antenna element unit embedded therein; and an amplification unit module disposed to be exposed to the intermediate outside air layer between the main body module and the RF module and including an amplification unit substrate on which analog amplification elements are mounted, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and a rear of the main body module, heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer; and a finger guard panel configured to partition the intermediate outside air layer between the main body module and the RF module from an outer space and formed with a plurality of airflow holes through which outside air of the outer space flows into the intermediate outside air layer or inside air of the intermediate outside air layer flows out to the outer space.

2 . The antenna apparatus of claim 1 , further comprising: a rear housing in which an inner space having an open front portion is formed so that a rear surface of the main board is closely seated; and
a front housing coupled to a front end of the rear housing and coupled to shield the inner space, wherein a power supply unit (PSU) board having a front surface matched with a front surface of the main board and a surge substrate unit disposed to be spaced by a predetermined distance rearward from the rear surface of the main board are seated in the inner space separately from the main board.

3 . The antenna apparatus of claim 2 , wherein a plurality of front housing heat-dissipation fins for dissipating the heat generated from the heating elements mounted on front surfaces of the main board or the PSU board to the intermediate outside air layer are integrally formed on a front surface of the front housing.

4 . The antenna apparatus of claim 1 , wherein the amplification unit module is coupled to the main board by a male socket portion provided on a rear end of the amplification unit substrate in a socket pin connection manner and coupled to the RF filter unit by a through-pin terminal provided on a front end of the amplification unit substrate in a feed through-pin connection manner.

5 . The antenna apparatus of claim 1 , wherein the main body module and the RF module are provided to be spaced apart from each other in a front-rear direction with the amplification unit module interposed therebetween, and
the finger guard panel has a front end coupled to the RF module and a rear end coupled to the main body module to partition the intermediate outside air layer between the main body module and the RF module from the outer space.

6 . The antenna apparatus of claim 1 , wherein the finger guard panel is provided to partition four surfaces forming the intermediate outside air layer from the outer space.

7 . The antenna apparatus of claim 1 , wherein the finger guard panel is formed to be rounded to the outside.

8 . The antenna apparatus of claim 1 , wherein the finger guard panel is formed so that an outer surface connecting a front end or a rear end and an outer surface connecting a left end or a right end have a rounded surface.

9 . The antenna apparatus of claim 1 , wherein the RF module includes:
a front antenna housing stacked and coupled to a front of the amplification unit module and having the RF filter unit and the antenna element unit embedded therein; and a radome panel coupled to a front end of the front antenna housing to protect the RF filter unit and the antenna element unit from the outside, and the radome panel is waterproofly coupled to the front antenna housing.

10 . The antenna apparatus of claim 9 , wherein the RF filter unit is formed of a cavity filter including at least one cavity.

Assignees

• Kmw Inc

Inventors

• Kim Duk Yong
• Moon Young Chan
• Shim Joon Hyong
• So Sung Hwan
• Jeong Bae Mook
• Yun Min Seon
• Ji Kyo Sung
• Ryu Chi Back
• Jang Sung Ho
• Kim Jae Hong
• Choi Oh Seog
• Seo Yong Won
• Park Won Jun

Classifications

• H01Q21/061

  Two dimensional planar arrays · CPC title

• H01Q15/14

  Reflecting surfaces; Equivalent structures {(electromagnetic shields H01Q1/526)} · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q1/42

  Housings not intimately mechanically associated with radiating elements, e.g. radome · CPC title

• H01Q1/02

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title