Flexible printed circuit board for measuring internal pressure of pouch cell, and method of measuring internal pressure of pouch cell

Patent metadata

Field	Value
Publication number	US-12537235-B2
Application number	US-202118017790-A
Country	US
Kind code	B2
Filing date	Dec 14, 2021
Priority date	Dec 28, 2020
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A flexible printed circuit board for pouch cell internal pressure measurement includes a sensing part on which a pressure sensor is mounted; a board part provided with connector pins connected to a plurality of conductor lines, respectively; and an extension part extending from the sensing part to the board part. The extension part includes a protective sheath of a metal material that surrounds an outer surface of an insulating film in a predetermined section.

First claim

What is claimed is:

1 . A flexible printed circuit board for pouch cell internal pressure measurement comprising:
a plurality of conductor lines; an insulating film having insulation properties and flexibility, which surrounds the plurality of conductor lines; a sensing part on which a pressure sensor is mounted; a board part having connector pins connected to the plurality of conductor lines, respectively; and an extension part extending from the sensing part to the board part, wherein the extension part comprises a protective sheath of a metal material that surrounds an outer surface of the insulating film in a predetermined section.

2 . The flexible printed circuit board of claim 1 , wherein the protective sheath is a gold or copper.

3 . The flexible printed circuit board of claim 1 , wherein the sensing part has a width equal to or smaller than a width of a gas pocket portion formed in a pouch cell that is an internal pressure measurement target, and
the protective sheath is formed to extend with a length equal to or greater than a width of a sealing portion formed in the pouch cell.

4 . The flexible printed circuit board of claim 1 , wherein the sensing part is parylene coated.

5 . The flexible printed circuit board of claim 4 , wherein an underfill or a conformal coating is added to a portion of the sensing part where the pressure sensor and the plurality of conductor lines are soldered.

6 . The flexible printed circuit board of claim 1 , wherein the pressure sensor is a waterproof micro electro-mechanical system (MEMS) pressure sensor.

7 . The flexible printed circuit board of claim 1 , wherein the sensing part further comprises a temperature sensor.

8 . The flexible printed circuit board of claim 1 , wherein the sensing part is provided in plurality and the board part-is provided in singularity.

9 . A method of measuring internal pressure of a pouch cell using the flexible printed circuit board of claim 1 , the pouch cell comprising a pouch outer casing including an upper pouch sheet and a lower pouch sheet covering the upper and lower sides of an electrode assembly, respectively, the method comprising:
sealing the pouch outer casing by thermally welding the protective sheath together with the upper pouch sheet and the lower pouch sheet when the sensing part is disposed in a gas pocket portion inside the pouch cell; and measuring the internal pressure of the pouch cell by connecting a data analysis device to the board part of the flexible printed circuit board and measuring the internal pressure of the pouch cell while repeatedly charging and discharging the pouch cell.

10 . The method of claim 9 , wherein, before disposing the at least one sensing part in the gas pocket portion, a further step of partially sealing the pouch cell by heat-sealing the edges of the upper pouch sheet and the lower pouch sheet to and leaving an unsealed section so that the at least one sensing part can be inserted.

11 . The method of claim 10 , further comprising integrally heat welding the upper pouch sheet, the protective sheath, and the lower pouch sheet with one another using a heat-pressing jig having a groove corresponding to a shape of the protective sheath of an extension part when heat-welding the unsealed section.

12 . The method of claim 9 , wherein the at least one sensing part includes a first sensing part and a second sensing part, and the method further comprises:
disposing the first sensing parts in the gas pocket portion on a side of the pouch cell where a positive electrode lead is located; and disposing the second sensing part in the gas pocket portion on a side of the pouch cell where a negative electrode lead is located.

13 . The method of claim 10 , wherein, after the at least one sensing part is inserted into the pouch outer casing through the unsealed section, a further step of sealing the pouch outer casing by heat-welding the unsealed section.

Assignees

• Lg Energy Solution Ltd

Inventors

• Lee Ki-Young
• Ko Dong-Wan
• Kim Do-Yul
• Kim Ju-Ri

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H01M50/105

  Pouches or flexible bags · CPC title

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title

• H01M50/178

  for pouch or flexible bag cells · CPC title