Method of stabilizing temperature sensing in the presence of temperature-sensing component temperature variation

Patent metadata

Field	Value
Publication number	US-12535362-B2
Application number	US-202217707997-A
Country	US
Kind code	B2
Filing date	Mar 30, 2022
Priority date	Jan 27, 2022
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and obtaining instant corrected value of the response value of the black body.

First claim

What is claimed is:

1 . A method of stabilizing temperature sensing in the presence of temperature variation of a thermal imager core chip, the method comprising the steps of:
(S 1 ) obtaining a response value (x) from the thermal imager core chip at a first temperature (T 1 ) while the temperature of the thermal imager core chip is rising, causing the response value to decrease; (S 2 ) obtaining, by preliminary experiment, a high-temperature first-order linear function (f H (T)) expressing relationship between a high-temperature black body response value and the thermal imager core chip temperature, wherein the high-temperature first-order linear function is obtained through derivation of a relationship between the high-temperature black body response value and a time and a relationship between the thermal imager core chip temperature and the time; (S 3 ) obtaining, by preliminary experiment, a low-temperature first-order linear function (f L (T)) expressing relationship between a low-temperature black body response value and the thermal imager core chip temperature, wherein the low-temperature first-order linear function is obtained through derivation of a relationship between the low-temperature black body response value and a time and a relationship between the thermal imager core chip temperature and the time; (S 4 ) obtaining a response value (f H (T 1 )) of the high-temperature first-order linear function at the first temperature, a response value (f H (T 2 )) of the high-temperature first-order linear function at a second temperature (T 2 ) of the thermal imager core chip, a response value (f L (T 1 )) of the low-temperature first-order linear function at the first temperature, a response value (f L (T 2 )) of the low-temperature first-order linear function at the second temperature, and a response value (x) of the black body and substituting the five values into an equation for correcting the response values,
wherein the equation for correcting the response values is as follows:

d
=

{

[

1
-

f
H

(

T
1

)

-
x

f
H

(

T
1

)

-

f
L

(

T
1

)

]

×

[

f
H

(

T
1

)

-

f
H

(

T
2

)

]

}

+

[

1
-

x
-

f
L

(

T
1

)

f
H

(

T
1

)

-

f
L

(

T
1

)

]

×

[

f
L

(

T
1

)

-

f
L

(

T
2

)

]

}

where d denotes the instant corrected value,
x denotes the response value of the black body,
f H (T 1 ) denotes the response value of the high-temperature first-order linear function at the first temperature,
f H (T 2 ) denotes the response value of the high-temperature first-order linear function at the second temperature,
f L (T 1 ) denotes the response value of the low-temperature first-order linear function at the first temperature, and
f L (T 2 ) denotes the response value of the low-temperature first-order linear function at the second temperature;

(S 5 ) obtaining an instant corrected value (d) of the response value (x) of the black body; and

Assignees

• Nat Chung Shan Inst Science & Tech

Inventors

• Tang Shiang-Feng
• Yen Shun-Lung
• Chang Kuo-Jen
• Chen Hsin-Chang

Classifications

• G01K11/30

  using measurement of the effect of a material on X-radiation, gamma radiation or particle radiation · CPC title

• G01J5/53

  Reference sources, e.g. standard lamps; Black bodies · CPC title

• G01K1/20 Primary

  Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature · CPC title

• G01J5/80

  Calibration (using comparison with reference sources G01J5/52) · CPC title

• G01J5/70

  Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing · CPC title