Heat dissipation device of heat pipe combined with vapor chamber

Patent metadata

Field	Value
Publication number	US-12535278-B2
Application number	US-202418664290-A
Country	US
Kind code	B2
Filing date	May 15, 2024
Priority date	Apr 16, 2024
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A heat dissipation device includes a vapor chamber ( 1 ) and at least one heat pipe ( 2 ). The vapor chamber ( 1 ) includes a bottom plate ( 10 ) and a top plate ( 11 ) combined with each other to form a cavity ( 100 ); the cavity ( 100 ) contains a top plate capillary layer ( 11 a ) covering the top plate ( 11 ) which has at least one through hole ( 110 ). The heat pipe ( 2 ) includes a pipe body ( 20 ) with a closed end ( 200 ) and an open end ( 201 ) fixed in the through hole ( 110 ), and a pipe capillary layer ( 21 ) with a connecting portion ( 210 ). The top plate ( 11 ) includes at least one protrusion ( 111 ) corresponding to the through hole ( 110 ) and having a receiving portion ( 111 a ) recessed inside the top plate ( 11 ), and a capillary structure ( 11 b ) in the receiving portion ( 111 a ) and contacting with the connecting portion ( 210 ) and top plate capillary layer ( 11 a ).

First claim

What is claimed is:

1 . A heat dissipation device, comprising:
a vapor chamber ( 1 ), comprising a bottom plate ( 10 ) and a top plate ( 11 ), the bottom plate ( 10 ) and the top plate ( 11 ) covering and combined with each other to define a cavity ( 100 ), a top plate capillary layer ( 11 a ) disposed in cavity ( 100 ) and covering the top plate ( 11 ), and the top plate ( 11 ) comprising at least one through hole ( 110 ) defined thereon; and at least one heat pipe ( 2 ), comprising a pipe body ( 20 ), and a pipe capillary layer ( 21 ) disposed in the pipe body ( 20 ), the pipe body ( 20 ) comprising a closed end ( 200 ) and an open end ( 201 ) away from the closed end ( 200 ), the open end ( 201 ) fixed in the through hole ( 110 ), and the pipe capillary layer ( 21 ) comprising a connecting portion ( 210 ) exposed from the open end ( 201 ); wherein, the top plate ( 11 ) comprises at least one protrusion ( 111 ) disposed protrusively from the through hole ( 110 ), and the protrusion ( 111 ) comprises a receiving portion ( 111 a ) recessed from inside of the top plate ( 11 ), and a capillary structure ( 11 b ) is disposed in the receiving portion ( 111 a ) and in contact with the connecting portion ( 210 ) and the top plate capillary layer ( 11 a ).

2 . The heat dissipation device according to claim 1 , wherein the top plate ( 11 ) comprises a plurality of abutting parts ( 112 ) concavely disposed thereon and abutting against the bottom plate ( 10 ).

3 . The heat dissipation device according to claim 1 , wherein the top plate capillary layer ( 11 a ) covers a bottom of the capillary structure ( 11 b ).

4 . The heat dissipation device according to claim 1 , wherein a bottom plate capillary layer ( 10 a ) is disposed in the cavity ( 100 ) and covering the bottom plate ( 10 ), and the bottom plate capillary layer ( 10 a ) is coupled to the top plate capillary layer ( 11 a ).

5 . The heat dissipation device according to claim 1 , wherein the cavity ( 100 ) comprises a plurality of support structures ( 12 ) disposed therein.

6 . The heat dissipation device according to claim 5 , wherein the support structures ( 12 ) are columnar bodies.

7 . The heat dissipation device according to claim 1 , wherein an amount of the through hole ( 110 ) is multiple, and the protrusion ( 111 ) is arranged corresponding to multiple through holes ( 110 ) and integrally coupled to the through holes ( 110 ), and multiple the receiving portions ( 111 a ) corresponding to the through holes ( 110 ) communicate to each other.

8 . The heat dissipation device according to claim 1 , wherein the capillary structure ( 11 b ) is a sintered powder.

9 . The heat dissipation device according to claim 1 , wherein the open end ( 201 ) of the pipe body ( 20 ) of the heat pipe ( 2 ) abuts against the capillary structure ( 11 b ).

10 . The heat dissipation device according to claim 1 , wherein the open end ( 201 ) of the pipe body ( 20 ) of the heat pipe ( 2 ) is serrated or partially perforated.

Assignees

• Taiwan Microloops Corp

Inventors

• Lin Chun-Hung

Classifications

• F28D15/046 Primary

  characterised by the material or the construction of the capillary structure · CPC title

• F28F1/32

  the means having portions engaging further tubular elements · CPC title

• F28D15/0233 Primary

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title